公开(公告)号：US07013055B2

公开(公告)日：2006-03-14

申请号：US10611684

申请日：2003-07-01

申请人： Kazuyuki Hayamizu ,  Yoshiyuki Komura ,  Yukari Terakawa ,  Hayami Hosokawa ,  Toshiyuki Takahashi ,  Masayoshi Higuchi ,  Yoshitaka Tatara ,  Naru Yasuda ,  Hiroto Nozawa

发明人： Kazuyuki Hayamizu ,  Yoshiyuki Komura ,  Yukari Terakawa ,  Hayami Hosokawa ,  Toshiyuki Takahashi ,  Masayoshi Higuchi ,  Yoshitaka Tatara ,  Naru Yasuda ,  Hiroto Nozawa

IPC分类号： G02B6/12 ,  G02B6/10

CPC分类号： G02B6/4246 ,  G02B6/12007 ,  G02B6/125 ,  G02B6/138 ,  G02B6/30 ,  H01L31/14

摘要： A method of manufacturing an optical waveguide device includes providing an optical fiber guide for fixing an optical fiber and optical element placing portions for providing element mounting benches outside a waveguide fixing region of a silicon substrate. A metallic thin film is formed outside the waveguide fixing region of the silicon substrate. After an optical waveguide substrate is bonded to a whole of an upper surface of the silicon substrate through a bonding resin which will become an upper cladding layer, the optical waveguide substrate is diced along an edge of the waveguide fixing region, and the optical waveguide substrate outside the waveguide fixing region is removed to expose the optical fiber guide and the optical element placing portions.

摘要翻译： 一种制造光波导器件的方法包括提供用于固定光纤的光纤引导件和用于在硅衬底的波导固定区域外部提供元件安装台的光学元件放置部分。 在硅衬底的波导固定区域的外部形成金属薄膜。 在通过将成为上包层的接合树脂将光波导基板结合到硅基板的整个上表面之后，沿着波导固定区域的边缘切割光波导基板，并且光波导基板 去除波导固定区域外部，露出光纤引导件和光学元件放置部分。

公开(公告)号：US07174081B2

公开(公告)日：2007-02-06

申请号：US11313171

申请日：2005-12-20

申请人： Kazuyuki Hayamizu ,  Yoshiyuki Komura ,  Yukari Terakawa ,  Hayami Hosokawa ,  Toshiyuki Takahashi ,  Masayoshi Higuchi ,  Yoshitaka Tatara ,  Naru Yasuda ,  Hiroto Nozawa

发明人： Kazuyuki Hayamizu ,  Yoshiyuki Komura ,  Yukari Terakawa ,  Hayami Hosokawa ,  Toshiyuki Takahashi ,  Masayoshi Higuchi ,  Yoshitaka Tatara ,  Naru Yasuda ,  Hiroto Nozawa

IPC分类号： G02B6/10 ,  G02B6/12

CPC分类号： G02B6/4246 ,  G02B6/12007 ,  G02B6/125 ,  G02B6/138 ,  G02B6/30 ,  H01L31/14

摘要： An optical waveguide device includes a first substrate, where the first substrate includes a first plate and an optical waveguide region disposed on the first plate, and where the optical waveguide region includes a core for transmitting light and a cladding surrounding the core. The optical waveguide device further includes a second substrate, where the second substrate includes a second plate having a spacer. Additionally, a surface including the optical waveguide region of the first substrate opposes a surface including the spacer of the second substrate, the spacer is formed the region which is out of the core of the first substrate, a top surface of the spacer is in contact with the first substrate, the first substrate and the second substrate are bound with adhesive material, and the entire surface of the core is in contact with the adhesive material.

摘要翻译： 光波导器件包括第一衬底，其中第一衬底包括第一板和布置在第一板上的光波导区，并且其中光波导区包括用于透射光的芯和围绕芯的包层。 光波导器件还包括第二衬底，其中第二衬底包括具有间隔物的第二板。 此外，包括第一基板的光波导区域的表面与包括第二基板的间隔件的表面相对，间隔件形成在第一基板的芯的外部的区域中，间隔件的顶表面接触 利用第一基板，第一基板和第二基板与粘合剂材料结合，并且芯的整个表面与粘合材料接触。

公开(公告)号：US20060104587A1

公开(公告)日：2006-05-18

申请号：US11313171

申请日：2005-12-20

申请人： Kazuyuki Hayamizu ,  Yoshiyuki Komura ,  Yukari Terakawa ,  Hayami Hosokawa ,  Toshiyuki Takahashi ,  Masayoshi Higuchi ,  Yoshitaka Tatara ,  Naru Yasuda ,  Hiroto Nozawa

发明人： Kazuyuki Hayamizu ,  Yoshiyuki Komura ,  Yukari Terakawa ,  Hayami Hosokawa ,  Toshiyuki Takahashi ,  Masayoshi Higuchi ,  Yoshitaka Tatara ,  Naru Yasuda ,  Hiroto Nozawa

IPC分类号： G02B6/10

CPC分类号： G02B6/4246 ,  G02B6/12007 ,  G02B6/125 ,  G02B6/138 ,  G02B6/30 ,  H01L31/14

摘要： A method of manufacturing an optical waveguide device includes providing an optical fiber guide for fixing an optical fiber and optical element placing portions for providing element mounting benches outside a waveguide fixing region of a silicon substrate. A metallic thin film is formed outside the waveguide fixing region of the silicon substrate. After an optical waveguide substrate is bonded to a whole of an upper surface of the silicon substrate through a bonding resin which will become an upper cladding layer, the optical waveguide substrate is diced along an edge of the waveguide fixing region, and the optical waveguide substrate outside the waveguide fixing region is removed to expose the optical fiber guide and the optical element placing portions.

公开(公告)号：US07113683B2

公开(公告)日：2006-09-26

申请号：US11312663

申请日：2005-12-20

申请人： Kazuyuki Hayamizu ,  Yoshiyuki Komura ,  Yukari Terakawa ,  Hayami Hosokawa ,  Toshiyuki Takahashi ,  Masayoshi Higuchi ,  Yoshitaka Tatara ,  Naru Yasuda ,  Hiroto Nozawa

发明人： Kazuyuki Hayamizu ,  Yoshiyuki Komura ,  Yukari Terakawa ,  Hayami Hosokawa ,  Toshiyuki Takahashi ,  Masayoshi Higuchi ,  Yoshitaka Tatara ,  Naru Yasuda ,  Hiroto Nozawa

IPC分类号： G02B6/10 ,  G02B6/12

CPC分类号： G02B6/4246 ,  G02B6/12007 ,  G02B6/125 ,  G02B6/138 ,  G02B6/30 ,  H01L31/14

摘要： A method of manufacturing an optical waveguide device includes providing an optical fiber guide for fixing an optical fiber and optical element placing portions for providing element mounting benches outside a waveguide fixing region of a silicon substrate. A metallic thin film is formed outside the waveguide fixing region of the silicon substrate. After an optical waveguide substrate is bonded to a whole of an upper surface of the silicon substrate through a bonding resin which will become an upper cladding layer, the optical waveguide substrate is diced along an edge of the waveguide fixing region, and the optical waveguide substrate outside the waveguide fixing region is removed to expose the optical fiber guide and the optical element placing portions.

摘要翻译： 一种制造光波导器件的方法包括提供用于固定光纤的光纤引导件和用于在硅衬底的波导固定区域外部提供元件安装台的光学元件放置部分。 在硅衬底的波导固定区域的外部形成金属薄膜。 在通过将成为上包层的接合树脂将光波导基板结合到硅基板的整个上表面之后，沿着波导固定区域的边缘切割光波导基板，并且光波导基板 去除波导固定区域外部，露出光纤引导件和光学元件放置部分。

公开(公告)号：US20060110098A1

公开(公告)日：2006-05-25

申请号：US11312663

申请日：2005-12-20

申请人： Kazuyuki Hayamizu ,  Yoshiyuki Komura ,  Yukari Terakawa ,  Hayami Hosokawa ,  Toshiyuki Takahashi ,  Masayoshi Higuchi ,  Yoshitaka Tatara ,  Naru Yasuda ,  Hiroto Nozawa

发明人： Kazuyuki Hayamizu ,  Yoshiyuki Komura ,  Yukari Terakawa ,  Hayami Hosokawa ,  Toshiyuki Takahashi ,  Masayoshi Higuchi ,  Yoshitaka Tatara ,  Naru Yasuda ,  Hiroto Nozawa

IPC分类号： G02B6/12

CPC分类号： G02B6/4246 ,  G02B6/12007 ,  G02B6/125 ,  G02B6/138 ,  G02B6/30 ,  H01L31/14

摘要： A method of manufacturing an optical waveguide device includes providing an optical fiber guide for fixing an optical fiber and optical element placing portions for providing element mounting benches outside a waveguide fixing region of a silicon substrate. A metallic thin film is formed outside the waveguide fixing region of the silicon substrate. After an optical waveguide substrate is bonded to a whole of an upper surface of the silicon substrate through a bonding resin which will become an upper cladding layer, the optical waveguide substrate is diced along an edge of the waveguide fixing region, and the optical waveguide substrate outside the waveguide fixing region is removed to expose the optical fiber guide and the optical element placing portions.

公开(公告)号：US20120020609A1

公开(公告)日：2012-01-26

申请号：US12673102

申请日：2008-09-03

申请人： Masaaki Kasai ,  Hayami Hosokawa ,  Naru Yasuda ,  Hiroshi Sameshima ,  Yoshitaka Tatara ,  Naoki Yoshitake

发明人： Masaaki Kasai ,  Hayami Hosokawa ,  Naru Yasuda ,  Hiroshi Sameshima ,  Yoshitaka Tatara ,  Naoki Yoshitake

IPC分类号： G02B6/122

CPC分类号： G02B6/1221 ,  B41J19/20 ,  G02B6/43 ,  H01R35/02 ,  H04B10/25 ,  H04M1/0214 ,  H04M1/0274 ,  H05K1/0274 ,  H05K1/0393 ,  H05K1/148

摘要： An optical wiring mounted on an electronic device has a light transmission path for transmitting an optical signal. A function layer that reduces friction generated when coming in contact with a structural body in the electronic device to lower than when the light transmission path comes in contact with the structural body, and that bends according to deformation of the light transmission path, is arranged.

摘要翻译： 安装在电子设备上的光线路具有用于发送光信号的光传输路径。 功能层，其与电子设备中的结构体接触而产生的摩擦产生的摩擦力低于当光传输路径与结构体接触时的摩擦力，并且根据光传输路径的变形而弯曲。

公开(公告)号：US20110052130A1

公开(公告)日：2011-03-03

申请号：US12674459

申请日：2008-08-27

申请人： Naoki Yoshitake ,  Yoshitaka Tatara ,  Naru Yasuda ,  Hayami Hosokawa

发明人： Naoki Yoshitake ,  Yoshitaka Tatara ,  Naru Yasuda ,  Hayami Hosokawa

IPC分类号： G02B6/10 ,  B32B27/08 ,  B32B7/12

CPC分类号： G02B6/1221 ,  B29B13/023 ,  B29C65/02 ,  B29C65/1406 ,  B29C65/8207 ,  B29C66/0242 ,  B29C66/0244 ,  B29C66/0342 ,  B29C66/1122 ,  B29C66/45 ,  B29C66/71 ,  B29C66/737 ,  B29C66/73774 ,  B29C66/73921 ,  B29C66/91411 ,  B29C66/91645 ,  B29C66/91921 ,  B29K2023/12 ,  B29K2067/00 ,  B29K2075/00 ,  B29K2079/08 ,  B29K2995/0018 ,  B29K2995/004 ,  B29K2995/0041 ,  B29L2011/0066 ,  B29L2031/3431 ,  B29L2031/767 ,  G02B6/138 ,  G02B6/3604 ,  G02B6/43 ,  H04M1/0214 ,  H04M1/026 ,  H04M1/22 ,  Y10T428/31511 ,  Y10T428/31565 ,  Y10T428/31663 ,  Y10T428/31797 ,  B29K2067/003 ,  B29K2033/08 ,  B29K2023/18 ,  B29K2023/06

摘要： An organic device has a substrate made of polymer, and a polymer layer adhered on the substrate. A crystallization degree of an adhesive surface with the polymer layer in the substrate is smaller than a crystallization degree of an interior of the substrate. In a manufacturing method for manufacturing an organic device including a substrate made of polymer; and having a polymer layer adhered on the substrate, the manufacturing method includes performing a low crystallization process on an adhesive surface with the polymer layer in the substrate to have a crystallization degree lower than a crystallization degree of an interior of the substrate.

摘要翻译： 有机器件具有由聚合物制成的衬底，并且粘附在衬底上的聚合物层。 与基板中的聚合物层的粘合剂表面的结晶度小于基板内部的结晶度。 在制造包括由聚合物制成的基板的有机器件的制造方法中， 并且具有粘附在基板上的聚合物层，所述制造方法包括在基板中的聚合物层的粘合剂表面上执行低结晶化处理以使结晶度低于基板内部的结晶度。

公开(公告)号：US08952468B2

公开(公告)日：2015-02-10

申请号：US13699989

申请日：2011-04-20

申请人： Koichi Ishimoto ,  Yoshitaka Tatara ,  Shin Inuzuka ,  Sebastiano Conti

发明人： Koichi Ishimoto ,  Yoshitaka Tatara ,  Shin Inuzuka ,  Sebastiano Conti

IPC分类号： H01L29/84 ,  H04R19/00 ,  H04R19/04

CPC分类号： H04R19/005 ,  H04R19/04 ,  H04R2410/03

摘要： In an acoustic sensor, a conductive vibrating membrane and a fixed electrode plate are disposed above a silicon substrate with an air gap provided therebetween, and the substrate has an impurity added to a surface thereof. A microphone includes an acoustic transducer; and an acquiring section that acquires a change in pressure as detected by the acoustic transducer. A method for manufacturing an acoustic transducer including a semiconductor substrate, a vibrating membrane, which is conductive, and a fixed electrode plate and detecting a pressure according to a change in capacitance between the vibrating membrane and the fixed electrode plate, the method includes an impurity adding step of adding an impurity to a surface of the semiconductor substrate; and a forming step of forming the vibrating membrane and the fixed electrode plate above the semiconductor substrate to which the impurity has been added.

摘要翻译： 在声学传感器中，导电振动膜和固定电极板设置在硅衬底之上，其间设置有气隙，并且衬底具有添加到其表面的杂质。 麦克风包括声换能器; 以及获取部，其获取由所述声换能器检测出的压力变化。 一种用于制造包括半导体衬底，导电的振动膜和固定电极板并根据振动膜和固定电极板之间的电容变化来检测压力的声学换能器的方法，所述方法包括杂质 向半导体衬底的表面添加杂质的步骤; 以及在已经添加有杂质的半导体衬底上形成振动膜和固定电极板的形成步骤。

公开(公告)号：US20140225204A1

公开(公告)日：2014-08-14

申请号：US14112219

申请日：2012-08-29

申请人： Yusuke Nakagawa ,  Yoshitaka Tatara ,  Nobuyuki Iida ,  Koichi Ishimoto ,  Tsuyoshi Hamaguchi ,  Hajime Kano

发明人： Yusuke Nakagawa ,  Yoshitaka Tatara ,  Nobuyuki Iida ,  Koichi Ishimoto ,  Tsuyoshi Hamaguchi ,  Hajime Kano

IPC分类号： B81B3/00 ,  B81C1/00

CPC分类号： B81B3/0027 ,  B81C1/00531 ,  H04R1/2807 ,  H04R19/005 ,  H04R19/04 ,  H04R31/00

摘要： A cavity is provided in a substrate so as to penetrate from a front surface to a back surface of the substrate. A thin-film diaphragm for sensing acoustic vibrations above the substrate is provided over the cavity. At least one wall surface of the cavity is configured of a first inclined surface between the front surface of the substrate and a middle portion in the thickness direction, the first inclined surface gradually widening toward the outside of the substrate as the first inclined surface goes from the front surface of the substrate toward the middle portion, and a second inclined surface between the middle portion and the back surface of the substrate, the second inclined surface gradually narrowing toward the inside of the substrate as the second inclined surface goes from the middle portion toward the back surface of the substrate.

摘要翻译： 在基板上设置有从基板的表面到背面贯通的空腔。 用于感测基板上方的声振动的薄膜隔膜设置在空腔上。 空腔的至少一个壁面由基板的前表面和厚度方向的中间部分之间的第一倾斜面构成，随着第一倾斜面从第一倾斜面朝向基板的外侧逐渐变宽 基板朝向中间部分的前表面，以及在基板的中间部分和后表面之间的第二倾斜表面，随着第二倾斜表面从中间部分开始，第二倾斜表面朝向基板的内部逐渐变窄 朝向基板的背面。

公开(公告)号：US20130069179A1

公开(公告)日：2013-03-21

申请号：US13699989

申请日：2011-04-20

申请人： Koichi Ishimoto ,  Yoshitaka Tatara ,  Shin Inuzuka ,  Sebastiano Conti

发明人： Koichi Ishimoto ,  Yoshitaka Tatara ,  Shin Inuzuka ,  Sebastiano Conti

IPC分类号： H01L29/84 ,  H01L21/02

CPC分类号： H04R19/005 ,  H04R19/04 ,  H04R2410/03

摘要： In an acoustic sensor, a conductive vibrating membrane and a fixed electrode plate are disposed above a silicon substrate with an air gap provided therebetween, and the substrate has an impurity added to a surface thereof. A microphone includes an acoustic transducer; and an acquiring section that acquires a change in pressure as detected by the acoustic transducer. A method for manufacturing an acoustic transducer including a semiconductor substrate, a vibrating membrane, which is conductive, and a fixed electrode plate and detecting a pressure according to a change in capacitance between the vibrating membrane and the fixed electrode plate, the method includes an impurity adding step of adding an impurity to a surface of the semiconductor substrate; and a forming step of forming the vibrating membrane and the fixed electrode plate above the semiconductor substrate to which the impurity has been added.

摘要翻译： 在声学传感器中，导电振动膜和固定电极板设置在硅衬底之上，其间设置有气隙，并且衬底具有添加到其表面的杂质。 麦克风包括声换能器; 以及获取部，其获取由所述声换能器检测出的压力变化。 一种用于制造包括半导体衬底，导电的振动膜和固定电极板并根据振动膜和固定电极板之间的电容变化来检测压力的声学换能器的方法，所述方法包括杂质 向半导体衬底的表面添加杂质的步骤; 以及在已经添加有杂质的半导体衬底上形成振动膜和固定电极板的形成步骤。