公开(公告)号：US07396735B2

公开(公告)日：2008-07-08

申请号：US10538222

申请日：2003-12-09

申请人： Kazuyuki Nakanishi ,  Tadashi Oshima ,  Hideo Hasegawa ,  Hiroyuki Mori ,  Hideo Tachikawa ,  Yukio Miyachi ,  Yasushi Yamada ,  Hiroyuki Ueda ,  Masayasu Ishiko

发明人： Kazuyuki Nakanishi ,  Tadashi Oshima ,  Hideo Hasegawa ,  Hiroyuki Mori ,  Hideo Tachikawa ,  Yukio Miyachi ,  Yasushi Yamada ,  Hiroyuki Ueda ,  Masayasu Ishiko

IPC分类号： H01L21/76

CPC分类号： H01L23/3732 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

摘要： A semiconductor element heat dissipating member is provided which has excellent heat dissipation characteristics and adhesion characteristics and enables production of a semiconductor device at a low cost. A semiconductor device using the same, and a method of producing the same are also provided. The semiconductor element heat dissipating member has a conductive substrate and an electrically insulating amorphous carbon film containing hydrogen, and the electrically insulating amorphous carbon film is formed at least on a region of the conductive substrate on which region a semiconductor element is to be mounted.

摘要翻译： 提供了具有优异的散热特性和粘合特性的半导体元件散热构件，并且能够以低成本制造半导体器件。 还提供了使用该半导体器件的半导体器件及其制造方法。 半导体元件散热构件具有导电基板和含有氢的电绝缘非晶碳膜，并且至少在导电基板的要安装半导体元件的区域的区域上形成电绝缘非晶碳膜。

公开(公告)号：US20080024888A1

公开(公告)日：2008-01-31

申请号：US11825127

申请日：2007-07-03

申请人： Kazuhiro Hattori ,  Hiroyuki Mori

发明人： Kazuhiro Hattori ,  Hiroyuki Mori

IPC分类号： G02B7/04

CPC分类号： G02B7/102

摘要： The present invention may provide a lens barrel which may include a guide shaft, and a movable lens frame. The barrel may be with an image capturing optical system disposed therein. The guide shaft may be disposed in the barrel and may extend parallel to the optical axis of the image capturing optical system. The movable lens frame may be reciprocally movable along the guide shaft in the barrel and holding lenses of the image capturing optical system. The barrel may include a wall supporting the guide shaft. The wall may include a light shield member projecting therefrom along the guide shaft in covering relation to a surface of the guide shaft which faces the optical axis.

摘要翻译： 本发明可以提供一种镜筒，其可以包括导向轴和可移动透镜框。 枪管可以具有设置在其中的摄像光学系统。 引导轴可以设置在镜筒中并且可以平行于图像拍摄光学系统的光轴延伸。 可移动透镜框架可以沿着镜筒中的引导轴和摄像光学系统的保持透镜往复移动。 枪管可以包括支撑引导轴的壁。 壁可以包括沿着导向轴从其突出的遮光构件，该遮光构件与导向轴的面向光轴的表面相关。

公开(公告)号：US07285589B2

公开(公告)日：2007-10-23

申请号：US10189393

申请日：2002-07-08

申请人： Yuko Fujihira ,  Tsutomu Noguchi ,  Hiroyuki Mori ,  Shinichiro Yamada

发明人： Yuko Fujihira ,  Tsutomu Noguchi ,  Hiroyuki Mori ,  Shinichiro Yamada

IPC分类号： C08K5/54 ,  C08K5/29

CPC分类号： C08L67/04 ,  C08G69/44 ,  C08K5/29 ,  C08L67/02 ,  C08L77/00 ,  C08L79/02 ,  Y02P20/582 ,  C08L2666/20 ,  C08L2666/18

摘要： By molding a biodegradable plastic material which is treated with a compound reactive to the active hydrogen in the biodegradable plastic material, a biodegradable plastic material and molding having long-term reliability are obtained.

摘要翻译： 通过将可生物降解的塑料材料成型为在可生物降解的塑料材料中与活性氢反应的化合物处理，得到具有长期可靠性的可生物降解的塑料材料和模制品。

公开(公告)号：US20070197050A1

公开(公告)日：2007-08-23

申请号：US11359730

申请日：2006-02-22

申请人： Paul Shirley ,  Hiroyuki Mori

发明人： Paul Shirley ,  Hiroyuki Mori

IPC分类号： H01L21/00

CPC分类号： H01L21/6715

摘要： A semiconductor substrate undergoing processing to fabricate integrated circuit devices thereon is spun about a rotational axis while introducing liquid onto a surface of the substrate. An annular-shaped sheet of liquid is formed on the surface, the sheet of liquid having an inner diameter defining a liquid-free void. The size of a diameter of the void is reduced by manipulation of the annular-shaped sheet of liquid. The void may then be enlarged until the surface is substantially dry. The annular-shaped sheet of liquid may be formed and altered by selectively moving a contact area on the surface of the substrate on which the liquid is introduced. Systems for processing a substrate and configured to deposit and manipulate a sheet of liquid thereon are also disclosed.

摘要翻译： 在其上制造集成电路器件的处理的半导体衬底围绕旋转轴旋转，同时将液体引入到衬底的表面上。 在表面上形成环状的液体片，该液体片具有限定无液体空隙的内径。 通过操作环形片状液体来减小空隙直径的大小。 然后可以扩大空隙，直到表面基本上干燥。 可以通过选择性地移动在其上引入液体的基板的表面上的接触区域来形成和改变环形片状液体。 还公开了用于处理基板并且被配置为在其上沉积和操纵一片液体的系统。

公开(公告)号：US20070164384A1

公开(公告)日：2007-07-19

申请号：US11466523

申请日：2006-08-23

申请人： Yasushi Maruyama ,  Hideshi Abe ,  Hiroyuki Mori

发明人： Yasushi Maruyama ,  Hideshi Abe ,  Hiroyuki Mori

IPC分类号： H01L27/14

CPC分类号： H01L27/14645 ,  H01L27/14621 ,  H01L27/14625 ,  H01L27/14627 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14643 ,  H01L27/14658 ,  H01L27/14683 ,  H01L27/14685 ,  H01L27/14689

摘要： A solid-state imaging device having a high sensitivity and a structure in which a miniaturized pixel is obtained, and a method for manufacturing the solid-state imaging device in which an interface is stable, a spectroscopic characteristic is excellent and which can be manufactured with a high yield ratio are provided. The solid-state imaging device includes at least a silicon layer formed with a photo sensor portion and a wiring layer formed on the front-surface side of the silicon layer, and in which light L is made to enter from the rear-surface side opposite to the front-surface side of the silicon layer and the thickness of the silicon layer 4 is 10 μm or less. Also, the method for manufacturing the solid-state imaging device at least includes the steps of: forming a semiconductor region of a photo sensor portion in a silicon layer of a layered substrate in which a silicon substrate, an intermediate layer and a silicon layer are laminated; bonding a first supporting substrate onto the silicon layer; removing the silicon substrate and the intermediate layer; forming thereafter a wiring portion above the silicon layer; bonding a second supporting substrate onto the wiring portion, and removing the first supporting substrate to make the silicon layer exposed.

摘要翻译： 具有高灵敏度的固态成像装置和获得小型化像素的结构，以及其中界面稳定的固态成像装置的制造方法，光谱特性优异并且可以用 提供高产率。 固态成像装置至少包括形成有光传感器部分的硅层和形成在硅层的表面侧的布线层，并且使光L从相对的背面侧进入 到硅层的表面侧，硅层4的厚度为10μm以下。 此外，制造固态成像装置的方法至少包括以下步骤：在硅衬底，中间层和硅层的层叠衬底的硅层中形成光电传感器部分的半导体区域 层压; 将第一支撑衬底接合到所述硅层上; 去除硅衬底和中间层; 然后形成硅层上方的布线部分; 将第二支撑基板接合到布线部分上，并且移除第一支撑基板以使硅层暴露。

公开(公告)号：US20070134495A1

公开(公告)日：2007-06-14

申请号：US10595644

申请日：2004-11-05

申请人： Hiroyuki Mori ,  Sumio Hamada ,  Takeshi Okuno

发明人： Hiroyuki Mori ,  Sumio Hamada ,  Takeshi Okuno

IPC分类号： B32B15/02

CPC分类号： C08J3/12 ,  A01N25/34 ,  B29B9/12 ,  C08F255/00 ,  C08J3/128 ,  C08J2323/02 ,  C08L51/06 ,  D01F1/10 ,  Y10T428/2998 ,  A01N53/00 ,  A01N2300/00 ,  C08L2666/02

摘要： A two-layered olefin-based resin pellet comprising a core layer formed of an olefin-based resin composition (A) and a sheath layer formed of an olefin-based resin composition (B) and laminated on the outer surface of the core layer, wherein said olefin-based composition (A) contains an insecticidal compound, a granular inorganic filler, a metal soap, and an olefin-based resin (a) having a relatively high solubility to the insecticidal compound; and said olefin-based resin composition (B) contains, as a main component, an olefin-based resin (b) having a relatively low solubility to the insecticidal compound.

摘要翻译： 一种双层烯烃系树脂颗粒，其包含由烯烃系树脂组合物（A）形成的芯层和由烯烃系树脂组合物（B）形成的层叠在芯层的外表面上的鞘层， 其中所述烯烃基组合物（A）含有对杀虫化合物具有较高溶解度的杀虫化合物，粒状无机填料，金属皂和烯烃类树脂（a） 所述烯烃类树脂组合物（B）含有对杀虫化合物的溶解度较低的烯烃系树脂（b）作为主要成分。

公开(公告)号：US20060281215A1

公开(公告)日：2006-12-14

申请号：US11466527

申请日：2006-08-23

申请人： Yasushi Maruyama ,  Hideshi Abe ,  Hiroyuki Mori

发明人： Yasushi Maruyama ,  Hideshi Abe ,  Hiroyuki Mori

IPC分类号： H01L21/00

CPC分类号： H01L27/14645 ,  H01L27/14621 ,  H01L27/14625 ,  H01L27/14627 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14643 ,  H01L27/14658 ,  H01L27/14683 ,  H01L27/14685 ,  H01L27/14689

摘要： A solid-state imaging device having a high sensitivity and a structure in which a miniaturized pixel is obtained, and a method for manufacturing the solid-state imaging device in which an interface is stable, a spectroscopic characteristic is excellent and which can be manufactured with a high yield ratio are provided. The solid-state imaging device includes at least a silicon layer formed with a photo sensor portion and a wiring layer formed on the front-surface side of the silicon layer, and in which light L is made to enter from the rear-surface side opposite to the front-surface side of the silicon layer and the thickness of the silicon layer 4 is 10 μm or less. Also, the method for manufacturing the solid-state imaging device at least includes the steps of: forming a semiconductor region of a photo sensor portion in a silicon layer of a layered substrate in which a silicon substrate, an intermediate layer and a silicon layer are laminated; bonding a first supporting substrate onto the silicon layer; removing the silicon substrate and the intermediate layer; forming thereafter a wiring portion above the silicon layer; bonding a second supporting substrate onto the wiring portion, and removing the first supporting substrate to make the silicon layer exposed.

公开(公告)号：US07136126B2

公开(公告)日：2006-11-14

申请号：US10671656

申请日：2003-09-29

申请人： Masahiko Murayama ,  Yosuke Nishiura ,  Yoshiharu Yabuki ,  Hiroyuki Mori

发明人： Masahiko Murayama ,  Yosuke Nishiura ,  Yoshiharu Yabuki ,  Hiroyuki Mori

IPC分类号： G02F1/1335 ,  C09K19/00

CPC分类号： G02F1/133632 ,  G02B5/3016 ,  Y10T428/10

摘要： An optical compensatory sheet comprises a cellulose acetate support and an optically anisotropic layer. The optically anisotropic layer contains a discotic liquid crystal molecule. The cellulose acetate support has a Bth550 birefringence in the range of 0.0007 to 0.004.

摘要翻译： 光学补偿片材包括乙酸纤维素载体和光学各向异性层。 光学各向异性层含有盘状液晶分子。 乙酸纤维素载体具有在0.0007至0.004范围内的Bth＆lt; 550＆gt;双折射。

公开(公告)号：US20050139828A1

公开(公告)日：2005-06-30

申请号：US10978754

申请日：2004-11-01

申请人： Yasushi Maruyama ,  Hideshi Abe ,  Hiroyuki Mori

发明人： Yasushi Maruyama ,  Hideshi Abe ,  Hiroyuki Mori

IPC分类号： H01L27/14 ,  H01L21/00 ,  H01L23/00 ,  H01L27/146 ,  H01L29/74 ,  H01L31/00

CPC分类号： H01L27/14645 ,  H01L27/14621 ,  H01L27/14625 ,  H01L27/14627 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14643 ,  H01L27/14658 ,  H01L27/14683 ,  H01L27/14685 ,  H01L27/14689

摘要： A solid-state imaging device having a high sensitivity and a structure in which a miniaturized pixel is obtained, and a method for manufacturing the solid-state imaging device in which an interface is stable, a spectroscopic characteristic is excellent and which can be manufactured with a high yield ratio are provided. The solid-state imaging device includes at least a silicon layer formed with a photo sensor portion and a wiring layer formed on the front-surface side of the silicon layer, and in which light L is made to enter from the rear-surface side opposite to the front-surface side of the silicon layer and the thickness of the silicon layer 4 is 10 μm or less. Also, the method for manufacturing the solid-state imaging device at least includes the steps of: forming a semiconductor region of a photo sensor portion in a silicon layer of a layered substrate in which a silicon substrate, an intermediate layer and a silicon layer are laminated; bonding a first supporting substrate onto the silicon layer; removing the silicon substrate and the intermediate layer; forming thereafter a wiring portion above the silicon layer; bonding a second supporting substrate onto the wiring portion, and removing the first supporting substrate to make the silicon layer exposed.

摘要翻译： 具有高灵敏度的固态成像装置和获得小型化像素的结构，以及其中界面稳定的固态成像装置的制造方法，光谱特性优异并且可以用 提供高产率。 固态成像装置至少包括形成有光传感器部分的硅层和形成在硅层的表面侧的布线层，并且使光L从相对的背面侧进入 到硅层的表面侧，硅层4的厚度为10μm以下。 此外，制造固态成像装置的方法至少包括以下步骤：在硅衬底，中间层和硅层的层叠衬底的硅层中形成光电传感器部分的半导体区域 层压; 将第一支撑衬底接合到所述硅层上; 去除硅衬底和中间层; 然后形成硅层上方的布线部分; 将第二支撑基板接合到布线部分上，并且移除第一支撑基板以使硅层暴露。

公开(公告)号：US06909558B2

公开(公告)日：2005-06-21

申请号：US10662903

申请日：2003-09-15

申请人： Shinichi Orimo ,  Hiroyuki Mori

发明人： Shinichi Orimo ,  Hiroyuki Mori

IPC分类号： G02B7/02 ,  G02B27/62 ,  G02B15/14 ,  G03B21/14

CPC分类号： G02B13/009 ,  G02B7/023 ,  G02B27/62 ,  G03F7/70825 ,  H04N5/2254 ,  H04N17/002

摘要： A lens held by a lens holding member is centered easily and correctly by a mechanism in which a guide pin is inserted into a guide hole for positioning the lens holding member with respect to the main body unit of the lens barrel in a plane perpendicular to the optical axis of the lens and for mounting the lens holding member for movement in a direction along the optical axis. Adjustment pins are rotationally mounted on at least three sites on the outer peripheral surface of the main body unit of the lens barrel. If each adjustment pin is rotated, an offset portion of the adjustment pin which is relative to the center of rotation of the adjustment pin, is rotated, as the offset portion is engaged in an engagement hole of the lens holding member. In this way the lens holding member on each site is displaced in the direction along the optical axis to adjust the tilt of the lens held by the lens holding member.

摘要翻译： 由透镜保持构件保持的透镜通过其中引导销插入导向孔中的机构而容易且正确地对中，用于将透镜保持构件相对于透镜镜筒的主体单元定位在垂直于透镜保持构件的平面中 并且用于安装用于沿着光轴的方向移动的透镜保持构件。 调整销被旋转地安装在镜筒的主体单元的外周表面上的至少三个位置上。 如果每个调节销旋转，则调节销的相对于调节销的旋转中心的偏移部分被旋转，因为偏移部分接合在透镜保持部件的接合孔中。 以这种方式，每个位置处的透镜保持构件沿着光轴的方向移位，以调整由透镜保持构件保持的透镜的倾斜。