公开(公告)号：US09543736B1

公开(公告)日：2017-01-10

申请号：US14947621

申请日：2015-11-20

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Tymon Barwicz ,  Yves Martin

IPC: H01S5/022 ,  H01S5/30 ,  H01S5/024 ,  G02B6/13 ,  G02B6/12

CPC classification number: G02B6/4232 ,  G02B6/12002 ,  G02B6/12004 ,  H01L2224/83192 ,  H01S5/0224 ,  H01S5/02268 ,  H01S5/02272 ,  H01S5/02469

Abstract: A technique relates to assembling a multi-chip system. A first chip stack element having two major surfaces and a first solder pad, a first vertical stop, a first lateral stop and a first waveguiding element is provided. A second chip stack element having two major surfaces and including a second solder pad, a flow resistor connected to the second solder pad, a second vertical stop, a second lateral stop, a reservoir pad connected to the flow resistor, and a second waveguiding element is provided. A solder material is plated to form a plated solder pad. A technique includes pre-aligning the first chip stack element and the second chip stack element, raising the temperature to a temperature above the melting temperature of the solder material, and flowing solder through the flow resistor. Aspects include aligning the first and second waveguiding elements and cooling the connected assembly to re-solidify the solder material.

Abstract translation: 技术涉及组装多芯片系统。 提供具有两个主表面的第一芯片堆叠元件和第一焊盘，第一垂直止动器，第一横向止动器和第一波导元件。 具有两个主表面并且包括第二焊盘的第二芯片堆叠元件，连接到第二焊盘的流阻器，第二垂直止动器，第二横向止动器，连接到流阻器的储存器衬垫，以及第二波导元件 被提供。 焊接材料被镀覆以形成镀覆的焊盘。 一种技术包括预先对准第一芯片堆叠元件和第二芯片堆叠元件，将温度升高到高于焊料材料的熔化温度的温度，并使焊料流过流阻器。 方面包括对准第一和第二波导元件并冷却连接的组件以重新固化焊料材料。