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公开(公告)号：US10534140B2
公开(公告)日：2020-01-14
申请号：US16285750
申请日：2019-02-26
发明人： Tymon Barwicz , Hidetoshi Numata
摘要： Methods of forming waveguide connectors include positioning a polymer waveguide in one or more insertion structures within an inner portion of a cap where the polymer waveguide has alignment features on a connection end face corresponding to one or more components of an assembled connector. The method can include inserting a ferrule into the inner portion of the cap such that an inner wall of the cap seals around the assembled connector to prevent contaminants from entering the inner portion and heating the polymer waveguide and the ferrule to a first temperature with the ferrule comprising alignment features and having a different coefficient of thermal expansion from the polymer waveguide. The alignment features of the polymer waveguide align with the alignment features of the ferrule when the polymer waveguide and the ferrule are heated to the first temperature.
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公开(公告)号：US10527787B1
公开(公告)日：2020-01-07
申请号：US16270886
申请日：2019-02-08
发明人： Yves Martin , Jason S. Orcutt , Tymon Barwicz , William Green
摘要： Techniques are provided for single edge coupling of chips with integrated waveguides. For example, a package structure includes a first chip with a first critical edge, and a second chip with a second critical edge. The first and second chips include integrated waveguides with end portions that terminate on the first and second critical edges. The second chip includes a signal reflection structure that is configured to reflect an optical signal propagating in one or more of the integrated waveguides of the second chip. The first and second chips are edge-coupled at the first and second critical edges such that the end portions of the integrated waveguides of the first and second chips are aligned to each other, and wherein all signal input/output between the first and second chips occurs at the single edge-coupled interface.
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公开(公告)号：US10444429B1
公开(公告)日：2019-10-15
申请号：US16239864
申请日：2019-01-04
发明人： Yves Martin , Jason S. Orcutt , Tymon Barwicz , William Green
摘要： Techniques are provided for single edge coupling of chips with integrated waveguides. For example, a package structure includes a first chip with a first critical edge, and a second chip with a second critical edge. The first and second chips include integrated waveguides with end portions that terminate on the first and second critical edges. The second chip includes a signal reflection structure that is configured to reflect an optical signal propagating in one or more of the integrated waveguides of the second chip. The first and second chips are edge-coupled at the first and second critical edges such that the end portions of the integrated waveguides of the first and second chips are aligned to each other, and wherein all signal input/output between the first and second chips occurs at the single edge-coupled interface.
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公开(公告)号：US10281658B2
公开(公告)日：2019-05-07
申请号：US15233183
申请日：2016-08-10
发明人： Tymon Barwicz , Hidetoshi Numata
摘要： Waveguide connector assembly device and methods of forming waveguide connectors include a cap having an inner portion to protect a connection end face of a polymer waveguide, wherein the cap includes one or more insertion structures to position the polymer waveguide in relation to one or more components of an assembled connector, and an inner wall to seal around the assembled connector to prevent contaminants from entering the inner portion.
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公开(公告)号：US20180269338A1
公开(公告)日：2018-09-20
申请号：US15980014
申请日：2018-05-15
发明人： Solomon Assefa , Tymon Barwicz , William M. Green , Marwan H. Khater , Jessie C. Rosenberg , Steven M. Shank
IPC分类号： H01L31/0203 , G02B6/42 , H01L31/153 , H01L31/02 , H01L31/18 , H01L31/0232
摘要： Approaches for silicon photonics integration are provided. A method includes: forming at least one encapsulating layer over and around a photodetector; thermally crystallizing the photodetector material after the forming the at least one encapsulating layer; and after the thermally crystallizing the photodetector material, forming a conformal sealing layer on the at least one encapsulating layer and over at least one device. The conformal sealing layer is configured to seal a crack in the at least one encapsulating layer. The photodetector and the at least one device are on a same substrate. The at least one device includes a complementary metal oxide semiconductor device or a passive photonics device.
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公开(公告)号：US20180003898A1
公开(公告)日：2018-01-04
申请号：US15198061
申请日：2016-06-30
摘要： Embodiments are directed to a method of forming an optical coupler system. The method includes forming at least one waveguide over a substrate, and forming gratings in a first region over the substrate. The method further includes configuring the gratings to couple optical signals to or from the at least one waveguide, and forming a v-groove in the first region over the substrate, wherein forming the v-groove includes removing the gratings from the first region.
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公开(公告)号：US09835804B2
公开(公告)日：2017-12-05
申请号：US15469639
申请日：2017-03-27
发明人： Tymon Barwicz , Jerome Bougie , Darrell Childers , Paul Francis Fortier , Alexander Janta-Polczynski , Stephan L. Martel
IPC分类号： G02B6/38
CPC分类号： G02B6/3826 , G02B6/381 , G02B6/3893 , G02B6/3897 , G02B6/3898 , G02B6/4231 , G02B6/428 , G02B6/4292
摘要： A clip connects two ferrules together, without a housing, to form a fiber optic connection. The clip has proximal and distal ends which define, and the clip has arms extending along the longitudinal axis to hold a cable-side ferrule in connection with fixed ferrule connected to a photonic module or die. The arms form an opening through which the cable-side ferrule is passed for connecting to the fixed ferrule. The arms have resilient bends forming a spring that can be resiliently extended along the longitudinal axis. The arms have a contact area at their ends which grasp the end of the cable-sided ferrule. The arms resiliently retract to compress the cable-sided ferrule towards the fixed ferrule with a predetermined force. The clip is positioned with respect to the circuit board using a pick and place system. The clip is not taller than either ferrule portion, enabling a limited vertical clearance.
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公开(公告)号：US20170194513A1
公开(公告)日：2017-07-06
申请号：US15463189
申请日：2017-03-20
发明人： Solomon Assefa , Tymon Barwicz , William M. Green , Marwan H. Khater , Jessie C. Rosenberg , Steven M. Shank
IPC分类号： H01L31/0203 , G02B6/42 , H01L31/02 , H01L31/153 , H01L31/0232 , H01L31/18
CPC分类号： H01L31/0203 , G02B6/00 , G02B6/12004 , G02B6/4253 , H01L21/0217 , H01L21/02271 , H01L21/02274 , H01L21/32053 , H01L21/84 , H01L27/1443 , H01L28/20 , H01L31/02019 , H01L31/02161 , H01L31/02327 , H01L31/153 , H01L31/18 , H01L31/1808 , H01L31/186 , H01L31/1872 , Y02E10/50 , Y02P70/521
摘要： Approaches for silicon photonics integration are provided. A method includes: forming at least one encapsulating layer over and around a photodetector; thermally crystallizing the photodetector material after the forming the at least one encapsulating layer; and after the thermally crystallizing the photodetector material, forming a conformal sealing layer on the at least one encapsulating layer and over at least one device. The conformal sealing layer is configured to seal a crack in the at least one encapsulating layer. The photodetector and the at least one device are on a same substrate. The at least one device includes a complementary metal oxide semiconductor device or a passive photonics device.
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公开(公告)号：US20170192181A1
公开(公告)日：2017-07-06
申请号：US14985492
申请日：2015-12-31
发明人： Tymon Barwicz , Jerome Bougie , Darrell Childers , Paul Francis Fortier , Alexander Janta-Polczynski , Stephan L. Martel
CPC分类号： G02B6/3826 , G02B6/381 , G02B6/3893 , G02B6/3897 , G02B6/3898 , G02B6/4231 , G02B6/428 , G02B6/4292
摘要： A clip connects two ferrules together, without a housing, to form a fiber optic connection. The clip has proximal and distal ends which define, and the clip has arms extending along the longitudinal axis to hold a cable-side ferrule in connection with fixed ferrule connected to a photonic module or die. The arms form an opening through which the cable-side ferrule is passed for connecting to the fixed ferrule. The arms have resilient bends forming a spring that can be resiliently extended along the longitudinal axis. The arms have a contact area at their ends which grasp the end of the cable-sided ferrule. The arms resiliently retract to compress the cable-sided ferrule towards the fixed ferrule with a predetermined force. The clip is positioned with respect to the circuit board using a pick and place system. The clip is not taller than either ferrule portion, enabling a limited vertical clearance.
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公开(公告)号：US20170179681A1
公开(公告)日：2017-06-22
申请号：US14974268
申请日：2015-12-18
IPC分类号： H01S5/02 , H01L21/8238 , H01S5/30 , H01L27/092
CPC分类号： H01S5/0213 , G02B6/4202 , G02B6/4206 , H01L21/8238 , H01L21/8258 , H01L27/092 , H01S5/026 , H01S5/0261 , H01S5/34333
摘要： The present disclosure relates to nitride based optoelectronic and electronic devices with Si CMOS. The disclosure provides a semiconductor device, comprising a sapphire substrate, and a laser region and a detector region deposed on the sapphire substrate. The laser is formed onto the substrate from layers of GaN, InGaN and optionally the AlGaN. The detector can be an InGaN detector. A waveguide may be interposed between the laser and detector regions coupling these regions. The semiconductor device allows integration of nitride base optoelectronic and electronic devices with Si CMOS. The disclosure also provides a method for making the semiconductor devices.
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