公开(公告)号：US20180283845A1

公开(公告)日：2018-10-04

申请号：US15476187

申请日：2017-03-31

Applicant: Intel Corporation

Inventor： Mario Pacheco ,  Manish Dubey ,  Purushotham Kaushik Muthur Srinath ,  Deepak Goyal ,  Liwen Jin

IPC: G01B9/02 ,  G01B11/00

Abstract: An interferometer for characterizing a sample, the interferometer including a light emitter to produce a light beam. A wavelength modulator can dither a wavelength of the light beam to produce an input beam having an oscillating wavelength. A beam splitter can be configured to divide the input beam into a reference beam and a measurement beam. The reference beam can reflect from a mirror having a fixed position and return to the beam splitter. The measurement beam can reflect from the sample and return to the beam splitter. The beam splitter can interfere the received reference beam and measurement beam to form an output beam. A detector can convert the output beam to an electrical signal. A processor can control the wavelength modulator, receive the electrical signal, and determine a distance to the sample based on the electrical signal and the oscillating wavelength of the input beam.

公开(公告)号：US10078204B2

公开(公告)日：2018-09-18

申请号：US14229909

申请日：2014-03-29

Applicant: Intel Corporation

Inventor： Nilanjan Z. Ghosh ,  Kevin T. McCarthy ,  Zhiyong Wang ,  Deepak Goyal ,  Changhua Liu ,  Leonel R. Arana

IPC: G01J3/28 ,  G01J3/04 ,  G01J3/44 ,  G02B21/00 ,  G01N21/65 ,  G01N21/84 ,  G01N21/95 ,  G01N21/21

CPC classification number: G02B21/008 ,  G01J3/44 ,  G01N21/21 ,  G01N21/65 ,  G01N21/8422 ,  G01N21/9501 ,  G01N2021/656 ,  G02B21/0064

Abstract: Embodiments include devices, systems and processes for using a combined confocal Raman microscope for inspecting a photo resist film material layer formed on the top surface of a layer of a substrate package, to detect border defects between regions of light exposed (e.g., cured) and unexposed (e.g., uncured) resist film material. Use of the confocal Raman microscope may provide a 3D photo-resist chemical imaging and characterization technique based on combining (1) Raman spectroscopy to identify the borders between regions of light exposed and unexposed resist along XY planes, with (2) Confocal imaging to select a Z-height of the XY planes scanned. Such detection provides fast, high resolution, non-destructive in-line inspection, and improves technical development of polymerization profiles of the resist film material.

公开(公告)号：US09817028B2

公开(公告)日：2017-11-14

申请号：US14866221

申请日：2015-09-25

Applicant: Intel Corporation

Inventor： Mayue Xie ,  Hemachandar Tanukonda Devarajulu ,  Deepak Goyal

IPC: G01R1/07 ,  G01R31/303 ,  G01R31/311

CPC classification number: G01R1/071 ,  G01R1/06772 ,  G01R31/303 ,  G01R31/311

Abstract: An apparatus comprises a contactless sense probe, an electro optic sensor module, and a test signal emitter circuit. The contactless sense probe includes a photoconductive switch and the signal bandwidth of the photoconductive switch is variable. The test signal emitter circuit configured to apply a test signal to a device under test (DUT) at a first location of the DUT, wherein the test signal includes a test signal frequency. The electro-optic sensor module is coupled to the contactless sense probe and configured to: generate an impulse signal at the contactless sense probe using an optical signal input to the first photoconductive switch; sense the test signal frequency in the impulse signal using the contactless sense probe at a second location of the DUT; and generate an indication of a defect in the DUT when the test signal frequency is undetected in the impulse signal.

公开(公告)号：US09625256B1

公开(公告)日：2017-04-18

申请号：US14757973

申请日：2015-12-23

Applicant: Intel Corporation

Inventor： Purushotham Kaushik Muthur Srinath ,  Mario Pacheco ,  Deepak Goyal

IPC: G01B11/27

CPC classification number: G01B11/272 ,  H01K3/00 ,  H01L24/00

Abstract: Techniques and mechanisms for evaluating misalignment of circuit structures. In an embodiment, infrared (IR) radiation is variously focused on different planes of an assembly including an integrated circuit (IC) chip and a substrate that is to be coupled to, or that is coupled to, the IC chip. The cross-sectional planes include respective structures that variously reflect IR radiation. The reflected IR radiation is measured to create images each representing a corresponding cross-section of the assembly. In another embodiment, respective reference features of the images are identified and evaluated to determine whether a misalignment between the reference features satisfies one or more threshold test conditions.