公开(公告)号：US20100176832A1

公开(公告)日：2010-07-15

申请号：US12715896

申请日：2010-03-02

Applicant: January Kister

Inventor： January Kister

IPC: G01R31/02

CPC classification number: G01R1/07314 ,  G01R1/0675 ,  G01R1/06755 ,  G01R1/07357

Abstract: The present invention is a set of layered probes that make electrical contact to a device under test. The layered probes are disposed within openings of at least one guide plate. The guide plate surrounds the probes via the openings.

Abstract translation: 本发明是一组分层探针，其与待测器件电接触。 分层探针设置在至少一个引导板的开口内。 引导板通过开口围绕探针。

公开(公告)号：US07514948B2

公开(公告)日：2009-04-07

申请号：US11786107

申请日：2007-04-10

Applicant: January Kister

Inventor： January Kister

IPC: G01R31/02 ,  H01R4/48

CPC classification number: G01R1/07307 ,  G01R1/06733

Abstract: Improved probing of closely spaced contact pads is provided by an array of vertical probes having all of the probe tips aligned along a single contact line, while the probe bases are arranged in an array having two or more rows parallel to the contact line. With this arrangement of probes, the probe base thickness can be made greater than the contact pad spacing along the contact line, thereby advantageously increasing the lateral stiffness of the probes. The probe tip thickness is less than the contact pad spacing, so probes suitable for practicing the invention have a wide base section and a narrow tip section.

Abstract translation: 通过具有所有探针尖端沿着单个接触线对准的垂直探针的阵列提供紧密间隔的接触垫的改进的探测，而探针基底布置成平行于接触线的两行或更多行的阵列。 利用这种探针的布置，可以使探针基底厚度大于沿着接触线的接触垫间距，从而有利地增加探针的横向刚度。 探针尖端厚度小于接触垫间距，因此适用于实施本发明的探针具有宽的基部和窄的尖端部分。

公开(公告)号：US07417447B2

公开(公告)日：2008-08-26

申请号：US12009128

申请日：2008-01-15

Applicant: January Kister

Inventor： January Kister

IPC: G01R31/02

CPC classification number: G01R1/07357 ,  G01R1/07371

Abstract: Method and apparatus using a retention arrangement with a potting enclosure for holding a plurality of probes by their retention portions, the probes being of the type having contacting tips for establishing electrical contact with pads or bumps of a device under test (DUT) to perform an electrical test. The retention arrangement has a top plate with top openings for the probes, a bottom plate with bottom openings for the probes, the plates being preferably made of ceramic with laser-machined openings, and a potting enclosure between the plates for admitting a potting agent that upon curing pots the retaining portions of the probes. In some embodiments a spacer is positioned between the top and bottom plates for defining the potting enclosure. Alternatively, the retention arrangement has intermediate plates located in the potting enclosure and having probe guiding openings to guide the probes.

公开(公告)号：US07345492B2

公开(公告)日：2008-03-18

申请号：US11302650

申请日：2005-12-14

Applicant: January Kister

Inventor： January Kister

IPC: G01R31/02 ,  G01R31/28

CPC classification number: G01R1/07357 ,  G01R1/07371

Abstract: Method and apparatus using a retention arrangement with a potting enclosure for holding a plurality of probes by their retention portions, the probes being of the type having contacting tips for establishing electrical contact with pads or bumps of a device under test (DUT) to perform an electrical test. The retention arrangement has a top plate with top openings for the probes, a bottom plate with bottom openings for the probes, the plates being preferably made of ceramic with laser-machined openings, and a potting enclosure between the plates for admitting a potting agent that upon curing pots the retaining portions of the probes. In some embodiments a spacer is positioned between the top and bottom plates for defining the potting enclosure. Alternatively, the retention arrangement has intermediate plates located in the potting enclosure and having probe guiding openings to guide the probes.

Abstract translation: 使用具有用于通过其保持部分保持多个探针的封装外壳的保持装置的方法和装置，所述探针具有用于与被测器件（DUT）的焊盘或凸块建立电接触的接触尖端，以执行 电气测试。 保持装置具有顶板，其具有用于探针的顶部开口，具有用于探针的底部开口的底板，该板优选地由具有激光加工孔的陶瓷制成，并且在该板之间的灌封封套用于容纳灌封剂， 在固化罐时，探针的保持部分。 在一些实施例中，间隔件定位在顶板和底板之间，用于限定灌封罩。 或者，保持装置具有位于灌封封壳中的中间板，并且具有用于引导探针的探针引导开口。

公开(公告)号：US07217138B2

公开(公告)日：2007-05-15

申请号：US11125035

申请日：2005-05-09

Applicant: January Kister ,  James Jaquette ,  Steve Fahrner

Inventor： January Kister ,  James Jaquette ,  Steve Fahrner

IPC: H01R12/00

CPC classification number: H01R13/2407 ,  H01R12/714 ,  H01R13/2428 ,  H01R13/2485

Abstract: An interconnect assembly includes a number of interconnect stages combined in a carrier structure. Each interconnect stage includes at least two contact sets having an upwards pointing cantilever contact and a downwards pointing cantilever contact. The cantilever contacts are attached to the carrier structure and are arranged around openings in the carrier structure such that the downward pointing cantilevers may reach through the carrier structure. Each contact set defines an independent conductive path between a single pair of opposing chip and test apparatus contacts such that multiple conductive paths are available for each interconnect stage for increased transmission reliability and reduced resistance. The cantilever contacts have a meandering contour and are either combined in symmetrical pairs at their respective tips or are free pivoting. The meandering contour provides a maximum deflectable cantilever length within an available footprint defined by the pitch of the tested chip.

Abstract translation: 互连组件包括以载体结构组合的多个互连级。 每个互连级包括至少两个具有向上指向的悬臂接触和向下指向悬臂接触的触头组。 悬臂接触件附接到载体结构并且布置在载体结构中的开口周围，使得向下指向的悬臂可以穿过载体结构。 每个触点组限定了一对相对的芯片和测试装置触点之间的独立导电路径，使得多个导电路径可用于每个互连级，以增加传输可靠性和降低的电阻。 悬臂触点具有曲折的轮廓，并且在其各自的尖端处以对称对组合或者是自由枢转。 曲折轮廓提供了由测试芯片的间距所限定的可用占空比内的最大可偏转悬臂长度。

公开(公告)号：US07059865B2

公开(公告)日：2006-06-13

申请号：US10759338

申请日：2004-01-16

Applicant: January Kister ,  James Jaquette ,  Gene Tokraks

Inventor： January Kister ,  James Jaquette ,  Gene Tokraks

IPC: H01R12/00

CPC classification number: G01R1/06711 ,  G01R1/07307 ,  G01R3/00

Abstract: An interconnect assembly includes a number of interconnects combined in a preferably planar dielectric carrier frame having resilient portions acting as spring members in conjunction with their respective interconnect's rotational displacement during operational contacting. Each interconnect is fabricated as a see-saw structure pivoting around a rotation axis that substantially coincides with a symmetry plane of the torsion features provided by the resilient portion. The torsion features protrude towards and adhere to a central portion of the see-saw interconnect such that an angular movement of the interconnect is resiliently opposed by the torsion feature and the resilient portion. The torsion features and interconnects may be independently optimized to provide the interconnect with maximum stiffness and a maximum deflection at same time.

Abstract translation: 互连组件包括多个互连件，其组合在优选平面的电介质载体框架中，其具有在操作接触期间结合其相应互连的旋转位移作为弹簧构件的弹性部分。 每个互连件被制造为围绕旋转轴线枢转的跷跷板结构，该旋转轴线基本上与由弹性部分提供的扭转特征的对称平面重合。 扭转特征突出并附着到跷跷板互连的中心部分，使得互连件的角运动通过扭转特征和弹性部分弹性地相对。 扭转特征和互连可以被独立地优化，以在相同的时间为互连提供最大刚度和最大偏转。

公开(公告)号：USD510043S1

公开(公告)日：2005-09-27

申请号：US29183540

申请日：2003-06-11

Applicant: January Kister

Designer： January Kister

CPC classification number: G01R1/0675 ,  G01R1/07357

公开(公告)号：US20050159027A1

公开(公告)日：2005-07-21

申请号：US11077054

申请日：2005-03-10

Applicant: January Kister ,  James Jaquette ,  Gene Tokraks

Inventor： January Kister ,  James Jaquette ,  Gene Tokraks

IPC: G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  H01R12/00

CPC classification number: G01R1/06711 ,  G01R1/07307 ,  G01R3/00

Abstract: An interconnect assembly includes a number of interconnects combined in a preferably planar dielectric carrier frame having resilient portions acting as spring members in conjunction with their respective interconnect's rotational displacement during operational contacting. Each interconnect is fabricated as a see-saw structure pivoting around a rotation axis that substantially coincides with a symmetry plane of the torsion features provided by the resilient portion. The torsion features protrude towards and adhere to a central portion of the see-saw interconnect such that an angular movement of the interconnect is resiliently opposed by the torsion feature and the resilient portion. The torsion features and interconnects may be independently optimized to provide the interconnect with maximum stiffness and a maximum deflection at same time.

Abstract translation: 互连组件包括多个互连件，其组合在优选平面的电介质载体框架中，其具有在操作接触期间结合其相应互连的旋转位移作为弹簧构件的弹性部分。 每个互连件被制造为围绕旋转轴线枢转的跷跷板结构，该旋转轴线基本上与由弹性部分提供的扭转特征的对称平面重合。 扭转特征突出并附着到跷跷板互连的中心部分，使得互连件的角运动通过扭转特征和弹性部分弹性地相对。 扭转特征和互连可以被独立地优化，以在相同的时间为互连提供最大刚度和最大偏转。

公开(公告)号：US20050159025A1

公开(公告)日：2005-07-21

申请号：US10759338

申请日：2004-01-16

Applicant: January Kister ,  James Jaquette ,  Gene Tokraks

Inventor： January Kister ,  James Jaquette ,  Gene Tokraks

IPC: G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  H01R12/00

CPC classification number: G01R1/06711 ,  G01R1/07307 ,  G01R3/00

Abstract: An interconnect assembly includes a number of interconnects combined in a preferably planar dielectric carrier frame having resilient portions acting as spring members in conjunction with their respective interconnect's rotational displacement during operational contacting. Each interconnect is fabricated as a see-saw structure pivoting around a rotation axis that substantially coincides with a symmetry plane of the torsion features provided by the resilient portion. The torsion features protrude towards and adhere to a central portion of the see-saw interconnect such that an angular movement of the interconnect is resiliently opposed by the torsion feature and the resilient portion. The torsion features and interconnects may be independently optimized to provide the interconnect with maximum stiffness and a maximum deflection at same time.

Abstract translation: 互连组件包括多个互连件，其组合在优选平面的电介质载体框架中，其具有在操作接触期间结合其相应互连的旋转位移作为弹簧构件的弹性部分。 每个互连件被制造为围绕旋转轴线枢转的跷跷板结构，该旋转轴线基本上与由弹性部分提供的扭转特征的对称平面重合。 扭转特征突出并附着到跷跷板互连的中心部分，使得互连件的角运动通过扭转特征和弹性部分弹性地相对。 扭转特征和互连可以被独立地优化，以在相同的时间为互连提供最大刚度和最大偏转。

公开(公告)号：US06420887B1

公开(公告)日：2002-07-16

申请号：US09593314

申请日：2000-06-13

Applicant: January Kister ,  Jean-Michel Jurin ,  Isabelle George

Inventor： January Kister ,  Jean-Michel Jurin ,  Isabelle George

IPC: G01R3102

CPC classification number: G01R1/07378 ,  G01R1/07357

Abstract: A space transformer made up of a primary structure that is fabricated from semiconductor body for retaining beam probes used for contacting the pads of a circuit or device under test. The primary structure is part of the space transformer and has vias that hold the beam probes, and a ceramic support structure to provide sufficient stiffness before bonding it to a secondary structure of the space transformer. The fabrication of the primary structure and its embedding within the secondary structure is performed in a manner analogous to the fabrication of circuit chips and its embedding within the packaging. As a result, down scaling in chip fabrication can be correspondingly applied to the fabrication of space transformers.

Abstract translation: 由主要结构构成的空间变换器，其由半导体本体制成，用于保持用于接触被测电路或器件的焊盘的光束探针。 主要结构是空间变压器的一部分，并且具有保持梁探头的通孔和陶瓷支撑结构，以在将其结合到空间变压器的二次结构之前提供足够的刚度。 主要结构的制造及其嵌入二次结构中的方式与电路芯片的制造及其在封装内的嵌入方式类似。 因此，芯片制造中的缩小比例可以相应地应用于空间变压器的制造。