公开(公告)号：US06861855B2

公开(公告)日：2005-03-01

申请号：US09735684

申请日：2000-12-13

Applicant: Jean-Michel Jurine ,  Isabelle George

Inventor： Jean-Michel Jurine ,  Isabelle George

IPC: G01R31/26 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  H01L21/66 ,  H01R13/02 ,  G01R31/02

CPC classification number: G01R1/0675 ,  G01R1/07357 ,  G01R3/00

Abstract: This invention pertains to a high density interconnection test connector intended especially for verification of integrated circuits, including a plate supporting a multiplicity of conductive pins one of the ends of which forms a contact zone with the electronic circuit to be tested and the other end forms a contact zone with a connecting plate that has a connection means with the test equipment, with the conductive pins presenting a form that is capable of ensuring flexibility and including a longitudinal component, characterized in that the pins present a succession of at least three arc-shaped sections (4, 5, 6) in alternating directions extended on both sides by rectilinear segments that are mobile according to one degree of freedom in axial translation, with the pins being inserted in the front plates.

Abstract translation: 本发明涉及一种特别用于验证集成电路的高密度互连测试连接器，其包括支撑多个导电引脚的板，其中一个端部与待测试的电子电路形成接触区域，另一端形成 接触区带有与测试设备具有连接装置的连接板，导电销具有能够确保柔性并且包括纵向部件的形式，其特征在于，所述销呈现一系列至少三个弧形 在两侧的交替方向上的横截面（4,5,6）由直线段延伸，直线段可根据轴向平移中的一个自由度移动，并将销插入前板。

公开(公告)号：US06420887B1

公开(公告)日：2002-07-16

申请号：US09593314

申请日：2000-06-13

Applicant: January Kister ,  Jean-Michel Jurin ,  Isabelle George

Inventor： January Kister ,  Jean-Michel Jurin ,  Isabelle George

IPC: G01R3102

CPC classification number: G01R1/07378 ,  G01R1/07357

Abstract: A space transformer made up of a primary structure that is fabricated from semiconductor body for retaining beam probes used for contacting the pads of a circuit or device under test. The primary structure is part of the space transformer and has vias that hold the beam probes, and a ceramic support structure to provide sufficient stiffness before bonding it to a secondary structure of the space transformer. The fabrication of the primary structure and its embedding within the secondary structure is performed in a manner analogous to the fabrication of circuit chips and its embedding within the packaging. As a result, down scaling in chip fabrication can be correspondingly applied to the fabrication of space transformers.

Abstract translation: 由主要结构构成的空间变换器，其由半导体本体制成，用于保持用于接触被测电路或器件的焊盘的光束探针。 主要结构是空间变压器的一部分，并且具有保持梁探头的通孔和陶瓷支撑结构，以在将其结合到空间变压器的二次结构之前提供足够的刚度。 主要结构的制造及其嵌入二次结构中的方式与电路芯片的制造及其在封装内的嵌入方式类似。 因此，芯片制造中的缩小比例可以相应地应用于空间变压器的制造。