摘要:
In a lighting strip (8, 80, 380), a flexible electrically insulated cable (10, 110, 410) includes spaced apart parallel electrical conductors (12, 14, 112, 114, 118, 412, 414, 4181, 4182, 4183, 4184) bound together by electrical insulation (16, 116, 416) as a cable. The electrical conductors include power conductors (12, 14, 112, 114, 412, 414). A plurality of lighting units (20, 120, 220, 320, 420) secured to and spaced apart along the flexible electrically insulated cable each include: (i) one or more light emitting devices (24, 124a, 124b, 124c, 124d, 224b1, 224b2, 224b3, 224c1, 224c2, 224c3, 224d1, 224d2, 224d3, 4241, 4242, 4243, 4244); (ii) power regulating electrical circuitry (40, 140, 240, 340, 440); and (iii) insulation displacing conductors (28, 30, 128a, 128b, 128c, 128d, 130a, 130b, 130c, 130d, 391, 392, 393, 500, 550, 600) connecting the lighting unit with at least the power conductors. The insulation displacing conductors (500, 550, 600) may be interchangeable.
摘要翻译:在照明条(8,80,380)中,柔性电绝缘电缆(10,110,410)包括间隔开的平行电导体(12,14,112,114,118,412,414,418) 通过电绝缘(16,116,416)作为电缆结合在一起的电缆(418,124,418,332) 。 电导体包括电力导体(12,14,112,114,412,414)。 沿着柔性电绝缘电缆固定并间隔开的多个照明单元(20,120,220,320,420)包括:(i)一个或多个发光器件(24,124a,124b,124c ,124 d,224 b 1,224 b 2,224 b 3,224 c 1,224 c 2,224 c 3,224 d 1,224 d 2,224 d 3,424 1, 424 2,424 3,424 4); (ii)功率调节电路(40,140,240,340,440); 和(iii)将绝缘移动导体(28,30,128a,128b,128c,128d,130a,130b,130c,130d,391,392,393,500,650,600) 照明单元至少具有电源导体。 绝缘位移导体(500,550,600)可以是可互换的。
摘要:
An LED light engine includes a flexible electrical cable, a wire-socket assembly attached to the cable, and an LED module selectively attached to the wire-socket assembly. The wire-socket assembly includes at least two IDC terminals. The IDC terminal displaces the insulating covering of the cable and contacts one of the electrical conductors. The LED module includes an LED electrically connected to the IDC terminals when the LED module attaches to the wire-socket assembly.
摘要:
One or more light emitting diode diodes (LEDs) are attached to a printed circuit board. The attached LEDs are connectable with a power source via circuitry of the printed circuit board. An overmolding material is insert molded an over at least portions of the printed circuit board proximate to the LEDs to form a free standing high thermal conductivity material overmolding that covers at least portions of the printed circuit board proximate to the LEDs. The free standing high thermal conductivity material has a melting temperature greater than about 100° C. and has a thermal conductivity greater than or about 1 W/m·K. In some embodiments, the free standing high thermal conductivity material is a thermoplastic material.
摘要:
One or more light emitting diode diodes (LEDs) are attached to a printed circuit board. The attached LEDs are connectable with a power source via circuitry of the printed circuit board. An overmolding material is insert molded an over at least portions of the printed circuit board proximate to the LEDs to form a free standing high thermal conductivity material overmolding that covers at least portions of the printed circuit board proximate to the LEDs. The free standing high thermal conductivity material has a melting temperature greater than about 100° C. and has a thermal conductivity greater than or about 1 W/m·K. In some embodiments, the free standing high thermal conductivity material is a thermoplastic material.
摘要:
One or more light emitting diode diodes (LEDs) are attached to a printed circuit board. The attached LEDs are connectable with a power source via circuitry of the printed circuit board. An overmolding material is insert molded an over at least portions of the printed circuit board proximate to the LEDs to form a free standing high thermal conductivity material overmolding that covers at least portions of the printed circuit board proximate to the LEDs. The free standing high thermal conductivity material has a melting temperature greater than about 100° C. and has a thermal conductivity greater than or about 1 W/m·K. In some embodiments, the free standing high thermal conductivity material is a thermoplastic material.
摘要:
One or more light emitting diode diodes (LEDs) are attached to a printed circuit board. The attached LEDs are connectable with a power source via circuitry of the printed circuit board. An overmolding material is insert molded an over at least portions of the printed circuit board proximate to the LEDs to form a free standing high thermal conductivity material overmolding that covers at least portions of the printed circuit board proximate to the LEDs. The free standing high thermal conductivity material has a melting temperature greater than about 100° C. and has a thermal conductivity greater than or about 1 W/m·K. In some embodiments, the free standing high thermal conductivity material is a thermoplastic material.
摘要:
A lighting assembly for an existing linear fluorescent fixture includes a support, at least two opposing light emitting diodes (LED) on respective sides of the support configured to direct light in opposite general directions, a housing configured to cover the support and the at least two opposing LEDs; and end caps including electrical connectors to connect to electrical connections of the existing linear fluorescent fixture.
摘要:
A string light engine includes a plurality of LEDs, a plurality of IDC connectors, and an insulated flexible conductor. Each IDC connector is in electrical communication with at least one of the plurality of LEDs and is operatively mechanically connected to at least one of the plurality of LEDs. The IDC connectors attach to the conductor.
摘要:
A string light engine includes a flexible power cord, a heat sink, an IDC terminal, a PCB, and an LED. The flexible power cord includes an electrical wire and an insulating material for the wire. The heat sink attaches to the power cord. The IDC terminal is inserted through the insulating material and electrically communicates with the wire. The PCB is at least partially received in the heat sink. The PCB includes a first surface having circuitry and a second surface opposite the first surface. The circuitry is in electrical communication with the IDC terminal. The second surface is abutted against a surface of the heat sink so that heat is transferred from the LED into the heat sink. The LED mounts to the first surface of the PCB and is in electrical communication with the circuitry.