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48 条记录 (耗时 0.037 秒)

    System for improving the visibility of a vehicle during reduced visibility conditions
    31.
    发明申请
    System for improving the visibility of a vehicle during reduced visibility conditions 审中-公开
    用于在可见度降低的情况下提高车辆的可视性的系统

    公开(公告)号：US20060192665A1

    公开(公告)日：2006-08-31

    申请号：US11057970

    申请日：2005-02-15

    申请人： Won Song

    发明人： Won Song

    IPC分类号： B60Q1/26

    CPC分类号： B60Q1/46 ,  B60Q1/38 ,  B60Q1/44

    摘要： Improved proximity indicators and turn indicators for hazardous operating conditions. Such indicators provide increased visibility and safety to observers and operators of vehicles. Such lights may be comprised of separate devices or may be comprised of flashing or strobing brake, accelerator, and/or turn indicators positioned at the front, sides, top, and rear of a vehicle. The intensity and flashing pattern of such indicators vary according to the operating settings of a vehicle, the proximity of obstacles including other vehicles, the desire of the operator, and according to the prevailing operating or weather conditions.

    摘要翻译： 改进的接近指示器和危险操作条件的转向指示器。 这些指标为车辆的观察员和操作员提供更高的可见性和安全性。 这种灯可以由单独的装置组成，或者可以包括位于车辆的前侧，侧面，顶部和后方的闪光或选通制动器，加速器和/或转向指示器。 这些指示器的强度和闪烁模式根据车辆的操作设置，包括其他车辆在内的障碍物的接近程度，操作者的愿望以及当前的操作或天气条件而变化。

    Method and system for transmitting voice data by using wireless LAN and bluetooth
    35.
    发明申请
    Method and system for transmitting voice data by using wireless LAN and bluetooth 审中-公开
    使用无线局域网和蓝牙传输语音数据的方法和系统

    公开(公告)号：US20080026696A1

    公开(公告)日：2008-01-31

    申请号：US11878939

    申请日：2007-07-27

    申请人： Hyo Choi ,  Jin Jeon ,  Dae Kim ,  Kyeongho Lee ,  Sang Shim ,  Won Song ,  Jeong Kim

    发明人： Hyo Choi ,  Jin Jeon ,  Dae Kim ,  Kyeongho Lee ,  Sang Shim ,  Won Song ,  Jeong Kim

    IPC分类号： H04B7/00

    CPC分类号： H04M1/6066 ,  H04M2250/02 ,  H04M2250/06 ,  H04W4/18 ,  H04W52/0216 ,  H04W52/0219 ,  H04W74/06 ,  H04W84/12 ,  H04W84/18 ,  H04W88/06 ,  Y02D70/142 ,  Y02D70/144

    摘要： Embodiments of methods and systems according to the application can transmit voice data by using a wireless LAN and a Bluetooth. One system embodiment can include a headset, an AP, and a terminal device to communicate with the headset according to a first protocol (e.g., Bluetooth) to transmit downlink voice data to the headset and to receive uplink voice data from the headset and to communicate with the AP according to a second protocol (e.g., wireless LAN) to transmit the uplink voice data to the AP and to receive the downlink voice data from the AP. The terminal device can receive the downlink voice data from the AP after the terminal device sends a PS-Poll frame to the AP within a period during which a transmission/reception between the terminal device and the headset is not to be performed.

    摘要翻译： 根据应用的方法和系统的实施例可以通过使用无线LAN和蓝牙来发送语音数据。 一个系统实施例可以包括头戴式耳机，AP和终端设备，以根据第一协议（例如，蓝牙）与头戴式耳机进行通信，以将下行语音数据发送到头戴式耳机，并从耳机接收上行语音数据并进行通信 根据第二协议的AP（例如，无线LAN）将上行语音数据发送到AP并从AP接收下行语音数据。 在终端设备和耳机之间的发送/接收不被执行的时间段内，终端设备可以在终端设备向AP发送PS-Poll帧之后从AP接收下行链路语音数据。

    Method of fabricating semiconductor device comprises a photoresist pattern having a desired critical dimension
    39.
    发明授权
    Method of fabricating semiconductor device comprises a photoresist pattern having a desired critical dimension 失效
    制造半导体器件的方法包括具有所需临界尺寸的光致抗蚀剂图案

    公开(公告)号：US08232199B2

    公开(公告)日：2012-07-31

    申请号：US12828404

    申请日：2010-07-01

    申请人： Won Song ,  Byung-Goo Jeon

    发明人： Won Song ,  Byung-Goo Jeon

    IPC分类号： H01L21/4763

    CPC分类号： H01L22/20 ,  H01L22/12 ,  Y10S438/949 ,  Y10S438/981

    摘要： A method of fabricating a semiconductor device and a fabrication system of the semiconductor device are provided. The method includes sequentially forming a film to be etched and a dielectric film and measuring a thickness of the dielectric film, forming a photoresist film on the dielectric film, performing a lithography process using the measured thickness of the dielectric film to form a photoresist film pattern, and etching the dielectric film and the film to be etched using the photoresist film pattern.

    摘要翻译： 提供一种半导体器件的制造方法和半导体器件的制造系统。 该方法包括顺序地形成待蚀刻的膜和电介质膜并测量电介质膜的厚度，在电介质膜上形成光致抗蚀剂膜，使用所测量的电介质膜的厚度进行光刻处理以形成光刻胶膜图案 并且使用光致抗蚀剂膜图案蚀刻电介质膜和待蚀刻的膜。