摘要:
The invention provides a method, system, and program product for determining a gradient of a parametric yield of an integrated circuit with respect to parameters of a delay of an edge of a timing graph of the circuit. A first aspect of the invention provides a method for determining a gradient of a parametric yield of an integrated circuit with respect to parameters of a delay of an edge of a timing graph of the circuit, the method comprising: conducting a statistical timing analysis; expressing a statistical circuit delay in terms of a delay of the edge; and computing a gradient of the statistical circuit delay with respect to parameters of the delay of the edge.
摘要:
In one embodiment, the invention is a method and apparatus for variation enabling statistical testing using deterministic multi-corner timing analysis. One embodiment of a method for obtaining statistical timing data for an integrated circuit chip includes obtaining deterministic multi-corner timing data for the integrated circuit chip and constructing the statistical timing data from the deterministic multi-corner timing data.
摘要:
A method and system for dispositioning integrated circuit chips. The method includes performing a performance path test on an integrated circuit chip having one or more clock domains, the performance path test based on applying test patterns to selected sensitizable data paths of the integrated circuit chip at different clock frequencies; and dispositioning the integrated circuit chip based on results of the performance path test.
摘要:
A method of integrated circuit (IC) disposition includes the steps of determining one or more disposition criteria based at least in part on statistical timing of a given IC design; and determining whether a given IC according to the given IC design satisfies the one or more disposition criteria based at least in part on one or more measurements of at least one test structure.
摘要:
At least one target metric is identified for an integrated circuit chip design for which manufacturing chip testing is to be optimized. At least one surrogate metric is also identified for the integrated circuit chip design for which manufacturing chip testing is to be optimized. A relationship between the at least one target metric and the at least one surrogate metric is modeled using a general joint probability density function. A chip disposition criterion is determined based on the general joint probability density function. The chip disposition criterion determines, for a given physical chip putatively manufactured in accordance with the design, based on the at least one surrogate metric for the given physical chip, whether the given physical chip is to be accepted or discarded during the manufacturing chip testing.
摘要:
Disclosed are embodiments of a method, system and computer program product for optimizing integrated circuit product yield by re-centering the manufacturing line and, optionally, adjusting wafer-level chip dispositioning rules based on the results of post-manufacture (e.g., wafer-level or module-level) performance path testing. In the embodiments, a correlation is made between in-line parameter measurements and performance measurements acquired during the post-manufacture performance path testing. Then, based on this correlation, the manufacturing line can be re-centered. Optionally, an additional correlation is made between performance measurements acquired during wafer-level performance testing and performance measurements acquired particularly during module-level performance path testing and, based on this additional correlation, adjustments can be made to the wafer-level chip dispositioning rules to further minimize yield loss.
摘要:
At least one target metric is identified for an integrated circuit chip design for which manufacturing chip testing is to be optimized. At least one surrogate metric is also identified for the integrated circuit chip design for which manufacturing chip testing is to be optimized. A relationship between the at least one target metric and the at least one surrogate metric is modeled using a general joint probability density function. A chip disposition criterion is determined based on the general joint probability density function. The chip disposition criterion determines, for a given physical chip putatively manufactured in accordance with the design, based on the at least one surrogate metric for the given physical chip, whether the given physical chip is to be accepted or discarded during the manufacturing chip testing.
摘要:
A method of integrated circuit (IC) disposition includes the steps of determining one or more disposition criteria based at least in part on statistical timing of a given IC design; and determining whether a given IC according to the given IC design satisfies the one or more disposition criteria based at least in part on one or more measurements of at least one test structure.
摘要:
A method of integrated circuit (IC) disposition includes the steps of determining one or more disposition criteria based at least in part on statistical timing of a given IC design; and determining whether a given IC according to the given IC design satisfies the one or more disposition criteria based at least in part on one or more measurements of at least one test structure.
摘要:
An acoustic monitoring system includes a portable acoustic detection device, a sound analysis device and a confidence level device. The portable acoustic detection device is capable of receiving sound at one or more locations near a sound-producing device. The sound analysis device receives the sound from the portable sound detection device, determines a diagnosis based on a comparison between the sound and pre-recorded sound data, and outputs the diagnosis to the portable acoustic detection device. The sound analysis device also determines a corrective action for inhibiting the sound, which is also output to the portable sound detection device. The confidence level device determines a confidence level of the diagnosis indicating a likelihood that the diagnosis is successfully diagnosed.