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公开(公告)号:US08838050B2
公开(公告)日:2014-09-16
申请号:US13602007
申请日:2012-08-31
申请人: Dae Seok Jang , Youn Suk Kim , Ki Joong Kim , Sung Jae Yoon , Chul Hwan Yoon
发明人: Dae Seok Jang , Youn Suk Kim , Ki Joong Kim , Sung Jae Yoon , Chul Hwan Yoon
CPC分类号: H04B7/212 , H03F3/72 , H03F2203/7209
摘要: Disclosed herein is a power amplifier for time division multiple access. The power amplifier for time division multiple access includes: power amplifiers power-amplifying input transmission signals and outputting the amplified signals; a power control unit using a time division multiple access type to control amplification of the power amplifiers; a switching unit formed at output terminals of the power amplifiers and the power control unit and outputting the amplified signals to an antenna based on a switching pass determined by the power control unit; and a timing control unit formed at an input terminal of the power control unit and determining turn-on time of a second signal by a level of an output signal generated by comparing a first signal with reference voltage.
摘要翻译: 这里公开了一种用于时分多址的功率放大器。 用于时分多址功率放大器包括:功率放大器功率放大输入传输信号并输出放大信号; 功率控制单元,其使用时分多址类型来控制功率放大器的放大; 开关单元,形成在所述功率放大器和所述功率控制单元的输出端子处,并且基于由所述功率控制单元确定的开关通过将放大的信号输出到天线; 以及定时控制单元,形成在所述功率控制单元的输入端,并且通过将第一信号与参考电压进行比较而产生的输出信号的电平来确定第二信号的导通时间。
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公开(公告)号:US20110163413A1
公开(公告)日:2011-07-07
申请号:US12984041
申请日:2011-01-04
申请人: Ki Joong Kim , Jin Seok Kim , Kwang Sic Kim , Youn Suk Kim , Young Sik Kang , Tae Joon Park
发明人: Ki Joong Kim , Jin Seok Kim , Kwang Sic Kim , Youn Suk Kim , Young Sik Kang , Tae Joon Park
CPC分类号: H01L27/016 , H01L23/5223 , H01L23/5225 , H01L23/5227 , H01L23/5228 , H01L23/66 , H01L28/20 , H01L28/60 , H01L2924/0002 , H01L2924/09701 , H01L2924/00
摘要: A radio frequency (RF) semiconductor device includes a semiconductor substrate, a resistor film formed at one area of the semiconductor substrate, a first metal layer formed on the semiconductor substrate, a dielectric layer formed at least on the lower electrode film, a second metal layer formed on the dielectric layer, a first insulating layer having a first pad via connected with the first metal layer, a capacitor via connected with the second metal layer, and an inductor via connected with the first or second metal layer. a third metal layer includes filling parts that fill the capacitor via and the inductor via, respectively, and a second circuit line. A second insulating layer is formed on the first insulating layer to have a second pad via connected with the first pad via. A bonding pad is formed at the first and second pad vias.
摘要翻译: 射频(RF)半导体器件包括半导体衬底,形成在半导体衬底的一个区域上的电阻膜,形成在半导体衬底上的第一金属层,至少在下电极膜上形成的电介质层,第二金属 形成在电介质层上的第一绝缘层,具有与第一金属层连接的第一焊盘通孔的第一绝缘层,与第二金属层连接的电容器通孔,以及与第一或第二金属层连接的电感器通路。 第三金属层包括分别填充电容器通孔和电感器通孔的填充部分和第二电路线。 第二绝缘层形成在第一绝缘层上,以具有与第一焊盘通孔连接的第二焊盘。 在第一和第二焊盘通孔处形成接合焊盘。
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公开(公告)号:US08884338B2
公开(公告)日:2014-11-11
申请号:US12557995
申请日:2009-09-11
申请人: Ki Joong Kim
发明人: Ki Joong Kim
IPC分类号: H01L23/52 , H01L27/07 , G11C11/4074 , G11C7/02 , G11C5/06 , H01L27/105 , H01L29/94 , H01L27/02
CPC分类号: H01L27/105 , G11C5/063 , G11C7/02 , G11C11/4074 , H01L27/0207 , H01L27/0733 , H01L29/94
摘要: A semiconductor integrated-circuit device is disclosed. The semiconductor integrated-circuit device uses a filter, which includes a standard capacitor, as a standard cell connecting a memory cell with a logic cell. As such, the semiconductor integrated-circuit device can minimize a glitch phenomenon of power/ground voltages and provide stability of power/ground voltages.
摘要翻译: 公开了一种半导体集成电路器件。 半导体集成电路器件使用包括标准电容器的滤波器作为连接存储器单元与逻辑单元的标准单元。 因此,半导体集成电路器件可以最小化电源/接地电压的毛刺现象并提供电源/接地电压的稳定性。
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公开(公告)号:US07505743B2
公开(公告)日:2009-03-17
申请号:US10849230
申请日:2004-05-20
申请人: Young Hoon Kim , Ki Joong Kim , Dae Hun Hur , Woo Jin Byun
发明人: Young Hoon Kim , Ki Joong Kim , Dae Hun Hur , Woo Jin Byun
IPC分类号: H04B1/02
CPC分类号: H04B1/0458 , H04B1/006
摘要: The invention provides a dual band transmitter available for a mobile communication terminal such as mobile phone, in which a first RF amplifier 111 amplifies the power of a high band signal BS1 at a first amplification factor that is determined according to a first bias voltage. A second RF amplifier 121 amplifies the power of a low band signal BS2 at a second amplification factor determined according to a second bias voltage. A first coupling capacitor C11 couples an output signal from the first RF amplifier 111. A second coupling capacitor C21 couples an output signal from the second RF amplifier 121. A filtering coupler 140 has a high pass filter FT1 for a first coupled signal from the first coupling capacitor C11 and a low pass filter FT2 for a second coupled signal from the second coupling capacitor C21. A power amplifier controller 150 compares the magnitudes of filtered signals from the filtering coupler 140 with preset reference values to obtain difference values, and adjusts the bias voltages of the first and second RF amplifiers 111 and 121 based upon the difference values to control the first and second amplification factors.
摘要翻译: 本发明提供一种可用于诸如移动电话的移动通信终端的双频带发射机,其中第一RF放大器111以根据第一偏置电压确定的第一放大因子放大高频带信号BS1的功率。 第二RF放大器121以根据第二偏置电压确定的第二放大因数放大低频信号BS2的功率。 第一耦合电容器C11耦合来自第一RF放大器111的输出信号。第二耦合电容器C21耦合来自第二RF放大器121的输出信号。滤波耦合器140具有用于来自第一RF放大器111的第一耦合信号的高通滤波器FT1 耦合电容器C11和低通滤波器FT2,用于来自第二耦合电容器C21的第二耦合信号。 功率放大器控制器150将来自滤波耦合器140的滤波信号的幅度与预设参考值进行比较以获得差值,并且基于差值来调整第一和第二RF放大器111和121的偏置电压,以控制第一和第 第二放大因子。
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公开(公告)号:US20100289069A1
公开(公告)日:2010-11-18
申请号:US12557995
申请日:2009-09-11
申请人: Ki Joong Kim
发明人: Ki Joong Kim
IPC分类号: H01L27/105 , H01L29/94
CPC分类号: H01L27/105 , G11C5/063 , G11C7/02 , G11C11/4074 , H01L27/0207 , H01L27/0733 , H01L29/94
摘要: A semiconductor integrated-circuit device is disclosed. The semiconductor integrated-circuit device uses a filter, which includes a standard capacitor, as a standard cell connecting a memory cell with a logic cell. As such, the semiconductor integrated-circuit device can minimize a glitch phenomenon of power/ground voltages and provide stability of power/ground voltages.
摘要翻译: 公开了一种半导体集成电路器件。 半导体集成电路器件使用包括标准电容器的滤波器作为连接存储器单元与逻辑单元的标准单元。 因此,半导体集成电路器件可以最小化电源/接地电压的毛刺现象并提供电源/接地电压的稳定性。
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公开(公告)号:US07187910B2
公开(公告)日:2007-03-06
申请号:US10859147
申请日:2004-06-03
申请人: Ki Joong Kim , Dae Heon Hur , Woo Jin Byun
发明人: Ki Joong Kim , Dae Heon Hur , Woo Jin Byun
IPC分类号: H04B1/02
CPC分类号: H01P5/185
摘要: Disclosed herein are a directional coupler which is implemented with strip lines for signal coupling and inter-digital capacitors for phase compensation, and a dual-band transmitter using the same. The directional coupler includes a first transmission device, a first directional coupling device for coupling a part of a signal from the first transmission device, a first inter-digital capacitor connected between the first transmission device and the first directional coupling device, a second transmission device, a second directional coupling device for coupling a part of a signal from the second transmission device, and a second inter-digital capacitor connected between the second transmission device and the second directional coupling device.
摘要翻译: 这里公开了一种定向耦合器,其用于用于信号耦合的带状线和用于相位补偿的数字间电容器,以及使用其的双频发射器。 定向耦合器包括第一传输设备,用于耦合来自第一传输设备的信号的一部分的第一定向耦合设备,连接在第一传输设备和第一定向耦合设备之间的第一数字间电容器,第二传输设备 ,用于耦合来自第二传输装置的信号的一部分的第二定向耦合装置和连接在第二传输装置和第二定向耦合装置之间的第二数字间电容器。
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