SOLVENT-BORNE WOOD PRESERVATIVE COMPOSITIONS
    31.
    发明申请

    公开(公告)号:US20200282592A1

    公开(公告)日:2020-09-10

    申请号:US16789154

    申请日:2020-02-12

    Abstract: Wood preservative compositions comprising a particulate copper compound in a solvent carrier with low aromatic content. Particulate copper dispersions in this composition demonstrated superior stability, and wood treated with the composition is protected from attack by wood decay fungi and termites. The invention is also directed to wood preservative compositions comprising: (a.) a biodegradable organic solvent carrier selected from the group consisting of vegetable oil, renewable resource oil, and biodiesel; (b.) a dispersion of solid particles of a metal compound having a particle size between about 0.005 microns to about 10 microns; (c.) an organic biocide; and (d.) a dispersant; ratio of the dispersant to the metal compound is from about 1:500 to about 100:1 (wt/wt). The invention is also directed to compositions comprising penflufen and solvent carriers. The invention is also directed to methods of treating wood using the compositions, and wood treated with the disclosed compositions and methods.

    METHOD FOR TREATING A WOOD SUBSTRATE
    38.
    发明公开

    公开(公告)号:US20230150166A1

    公开(公告)日:2023-05-18

    申请号:US17526526

    申请日:2021-11-15

    CPC classification number: B27K3/22 B27K2240/20

    Abstract: A method for treating a wood substrate is provided. The method comprises contacting the wood substrate in a field application with an aqueous composition. The contacting is performed at a pressure of less than 20 psia. The aqueous composition comprises, by total weight of the aqueous composition, 1.0% to 10.0% by weight of a micronized basic copper carbonate, 0.35% to 2.5% by weight of a quaternary ammonium compound, and at least 80% by weight of water.

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