METHOD FOR TREATING A WOOD SUBSTRATE
    2.
    发明公开

    公开(公告)号:US20230150166A1

    公开(公告)日:2023-05-18

    申请号:US17526526

    申请日:2021-11-15

    IPC分类号: B27K3/22

    CPC分类号: B27K3/22 B27K2240/20

    摘要: A method for treating a wood substrate is provided. The method comprises contacting the wood substrate in a field application with an aqueous composition. The contacting is performed at a pressure of less than 20 psia. The aqueous composition comprises, by total weight of the aqueous composition, 1.0% to 10.0% by weight of a micronized basic copper carbonate, 0.35% to 2.5% by weight of a quaternary ammonium compound, and at least 80% by weight of water.