公开(公告)号：US07593227B2

公开(公告)日：2009-09-22

申请号：US11940471

申请日：2007-11-15

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth ,  Madhusudan K. Iyengar ,  Donald W. Porter ,  Roger R. Schmidt ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth ,  Madhusudan K. Iyengar ,  Donald W. Porter ,  Roger R. Schmidt ,  Robert E. Simons

IPC分类号： H05K7/20

CPC分类号： H05K7/20772

摘要： An isolation valve assembly, a coolant connect/disconnect assembly, a cooled multi-blade electronics center, and methods of fabrication thereof are provided employing an isolation valve and actuation mechanism. The isolation valve is disposed within at least one of a coolant supply or return line providing liquid coolant to the electronics subsystem. The actuation member is coupled to the isolation valve to automatically translate a linear motion, resulting from insertion of the electronics subsystem into the operational position within the electronics housing, into a rotational motion to open the isolation valve and allow coolant to pass. The actuation mechanism, which operates to automatically close the isolation valve when the liquid cooled electronics subsystem is withdrawn from the operational position, can be employed in combination with a compression valve coupling, with one fitting of the compression valve coupling being disposed serially in fluid communication with the isolation valve.

摘要翻译： 使用隔离阀和致动机构来提供隔离阀组件，冷却剂连接/断开组件，冷却的多叶片电子设备中心及其制造方法。 隔离阀设置在向电子子系统提供液体冷却剂的冷却剂供应或返回管线中的至少一个中。 致动构件联接到隔离阀以自动地将由电子系统子系统插入电子设备外壳内的操作位置而产生的直线运动转换成旋转运动，以打开隔离阀并允许冷却剂通过。 当液体冷却的电子子系统从操作位置退出时，操作以自动关闭隔离阀的致动机构可以与压缩阀联接一起使用，压缩阀联接器的一个配件串联设置为流体连通 与隔离阀。

公开(公告)号：US07492593B2

公开(公告)日：2009-02-17

申请号：US12049632

申请日：2008-03-17

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

IPC分类号： H05K7/20

CPC分类号： H05K7/20754

摘要： Augmenting air cooling of electronics system using a cooling fluid to cool air entering the system, and to remove the heat dissipated by the electronics. A cooled electronics system includes a frame with drawers containing electronics components to be cooled. The frame includes a front with an air inlet and a back with an air outlet. A cabinet encases the frame, and includes a front cover positioned over the air inlet, a back cover positioned over the air outlet, and first and second side air returns at opposite sides of the frame. At least one air moving device establishes air flow across the electronics drawers. The air flow bifurcates at the back cover and returns to the air inlet via the first and second side air returns and the front cover. An air-to-liquid heat exchanger cools the air flowing across the electronics drawers.

摘要翻译： 使用冷却液增强电子系统的空气冷却，以冷却进入系统的空气，并消除由电子设备消散的热量。 冷却的电子系统包括具有抽屉的框架，其中包含要冷却的电子元件。 框架包括一个带空气入口的前部和一个带有空气出口的后部。 框架包围框架，并且包括位于空气入口上方的前盖，位于空气出口上方的后盖，并且第一和第二侧面空气在框架的相对侧返回。 至少一个空气移动装置在电子抽屉之间建立空气流。 空气流在后盖处分叉并经由第一和第二侧面空气返回和前盖返回到进气口。 空气对液体的热交换器冷却流过电子抽屉的空气。

公开(公告)号：US07486512B2

公开(公告)日：2009-02-03

申请号：US12020688

申请日：2008-01-28

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

IPC分类号： H05K7/20 ,  F28F7/00

CPC分类号： H05K7/20745 ,  F24F13/04 ,  H05K7/20736

摘要： An apparatus is provided for facilitating cooling of an electronics rack employing an air delivery structure coupled to the electronics rack. The air delivery structure delivers air flow at a location external to the electronics rack and in a direction to facilitate mixing thereof with re-circulating exhausted inlet-to-outlet air flow from the air outlet side of the electronics rack to the air inlet side thereof. The delivered air flow is cooler than the re-circulating exhausted inlet-to-outlet air flow and when mixed with the re-circulating air flow facilitates lowering air inlet temperature at a portion of the air inlet side of the electronics rack, thereby enhancing cooling of the electronics rack.

摘要翻译： 提供了一种用于便于冷却电子机架的设备，该电子机架采用联接到电子机架的空气输送结构。 空气输送结构在电子机架外部的位置处和在促进其混合的方向上传送空气流，并且从电子机架的空气出口侧到其进气侧再循环排出的入口到出口空气流 。 输送的空气流比再循环排出的入口到出口空气流更冷，并且当与再循环空气流混合时，有助于降低电子机架的空气入口侧的一部分处的进气温度，从而增强冷却 的电子机架。

公开(公告)号：US07450385B1

公开(公告)日：2008-11-11

申请号：US11763678

申请日：2007-06-15

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

IPC分类号： H05K7/20 ,  F28F7/00

CPC分类号： H05K7/20781 ,  F28F9/0275 ,  H05K7/20772 ,  Y10T29/5313

摘要： A cooling apparatus is provided for facilitating cooling of electronics drawers of an electronics rack. The apparatus includes a bi-fold door assembly configured for mounting to the electronics rack. The door assembly includes a first door and a second door, each configured for separate, hinged mounting to the electronics rack. The apparatus further includes a coolant distribution apparatus, wherein a coolant supply manifold thereof is mounted to the first door and a coolant return manifold thereof is mounted to the second door. Separate swivel connections are coupled in fluid communication with the coolant supply and return manifolds for facilitating supply and return of coolant to and from the manifolds, and for facilitating pivotal movement of the doors relative to the electronics rack. A plurality of coolant distribution ports are provided within the supply and return manifolds, and disposed to facilitate supply and return of coolant to the electronics drawers.

摘要翻译： 提供了一种用于促进电子机架的电子抽屉的冷却的冷却装置。 该装置包括构造成用于安装到电子机架的双折门组件。 门组件包括第一门和第二门，每个门被配置为单独地铰接安装到电子机架上。 该装置还包括冷却剂分配装置，其中冷却剂供应歧管安装到第一门，并且其冷却剂返回歧管安装到第二门。 单独的旋转连接件与冷却剂供应和返回歧管流体连通地联接，以便于冷却剂供给和从歧管返回并且用于促进门相对于电子机架的枢转运动。 多个冷却剂分配端口设置在供应和返回歧管内，并且设置成便于冷却剂供应和返回到电子抽屉。

公开(公告)号：US07408776B2

公开(公告)日：2008-08-05

申请号：US11539905

申请日：2006-10-10

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Randall G. Kemink ,  Roger R. Schmidt ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Randall G. Kemink ,  Roger R. Schmidt ,  Robert E. Simons

IPC分类号： H05K7/20 ,  F28F7/00

CPC分类号： H05K7/20509 ,  H01L23/473 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K7/20009 ,  H05K7/20772 ,  H01L2224/0401

摘要： A conductive heat transport cooling system and method are provided for cooling primary and secondary heat generating components of an electronics system. The cooling system includes a liquid-based cooling subsystem including at least one liquid-cooled cold plate physically coupled to at least one primary heat generating component of the electronics system, and a thermally conductive coolant-carrying tube coupled to and in fluid communication with the at least one liquid-cooled cold plate. A thermally conductive auxiliary structure is coupled to the coolant-carrying tube and to at least one secondary heat generating component of the electronics system. When in use, the thermally conductive auxiliary structure provides conductive heat transport from the at least one secondary heat generating component to the at least one thermally conductive coolant-carrying tube coupled thereto, and hence via convection to liquid coolant passing therethrough.

摘要翻译： 提供导电热传输冷却系统和方法来冷却电子系统的一次和二次发热部件。 冷却系统包括液体冷却子系统，其包括物理耦合到电子系统的至少一个主要发热部件的至少一个液体冷却冷却板，以及耦合到流体连通的流体传导冷却剂管 至少一个液冷冷板。 导热辅助结构耦合到冷却剂承载管和电子系统的至少一个二次发热部件。 当使用时，导热辅助结构提供从至少一个二次发热部件到耦合到其上的至少一个导热冷却剂输送管的导热传输，并且因此通过对流通过其中的液体冷却剂。

公开(公告)号：US07362574B2

公开(公告)日：2008-04-22

申请号：US11462735

申请日：2006-08-07

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

IPC分类号： H05K7/20 ,  H01L23/24 ,  F28D15/00

CPC分类号： H01L23/4735 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  Y10S165/908 ,  H01L2224/0401

摘要： A cooling apparatus and a direct cooling impingement module are provided, along with a method of fabrication thereof. The cooling apparatus and direct impingement cooling module include a manifold structure and a jet orifice plate for injecting coolant onto a surface to be cooled. The jet orifice plate, which includes a plurality of jet orifices for directing coolant at the surface to be cooled, is a unitary plate configured with a plurality of jet orifice structures. Each jet orifice structure projects from a lower surface of the jet orifice plate towards the surface to be cooled, and includes a respective jet orifice. The jet orifice structures are spaced to define coolant effluent removal regions therebetween which facilitate removal of coolant effluent from over a center region of the electronic component being cooled to a peripheral region thereof, thereby reducing pressure drop across the jet orifice plate.

摘要翻译： 提供冷却装置和直接冷却冲击模块，以及其制造方法。 冷却装置和直接冲击冷却模块包括歧管结构和用于将冷却剂喷射到待冷却表面上的喷射孔板。 喷射孔板包括用于在要冷却的表面引导冷却剂的多个喷射孔，其是配置有多个喷射孔结构的整体板。 每个喷射孔结构从喷射孔板的下表面朝向要冷却的表面突出，并且包括相应的喷射孔。 喷射孔结构被间隔开以限定其间的冷却剂流出物去除区域，其有助于将冷却剂流出物从被冷却到其周边区域的电子部件的中心区域上方移除，从而减少喷射孔板上的压降。

公开(公告)号：US20080084667A1

公开(公告)日：2008-04-10

申请号：US11539902

申请日：2006-10-10

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

IPC分类号： H05K7/20 ,  F28F7/00

CPC分类号： H05K7/20736 ,  F28F1/20 ,  F28F1/22 ,  H05K7/20009 ,  H05K7/20554 ,  H05K7/20772

摘要： A hybrid cooling system and method of fabrication are provided for a multi-component electronics system. The cooling system includes an air moving device for establishing air flow across at least one primary and at least one secondary heat generating component to be cooled; and a liquid-based cooling subsystem including at least one cold plate, physically coupled to the at least one primary heat generating component, and a thermally conductive coolant-carrying tube in fluid communication with the at least one cold plate. A thermally conductive auxiliary structure is coupled to the coolant-carrying tube and includes a plurality of thermally conductive fins extending from a surface thereof. The plurality of thermally conductive fins are disposed at least partially over the at least one secondary heat generating component to be cooled, and provide supplemental cooling of at least a portion of the air flow established across the multiple components of the electronics system.

摘要翻译： 为多组件电子系统提供混合冷却系统和制造方法。 该冷却系统包括用于建立穿过要被冷却的至少一个主要和至少一个次要发热部件的空气流的空气移动装置; 以及液体冷却子系统，其包括物理耦合到所述至少一个主发热部件的至少一个冷板和与所述至少一个冷板流体连通的导热冷却剂供给管。 导热辅助结构联接到冷却剂承载管并且包括从其表面延伸的多个导热翅片。 多个导热翅片至少部分地设置在待冷却的至少一个二次发热组件上，并且为跨越电子系统的多个部件建立的空气流的至少一部分提供补充冷却。

公开(公告)号：US20080049396A1

公开(公告)日：2008-02-28

申请号：US11467245

申请日：2006-08-25

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

IPC分类号： H05K7/20

CPC分类号： H05K7/20754

摘要： Augmenting air cooling of electronics system using a cooling fluid to cool air entering the system, and to remove the heat dissipated by the electronics. A cooled electronics system includes a frame with drawers containing electronics components to be cooled. The frame includes a front with an air inlet and a back with an air outlet. A cabinet encases the frame, and includes a front cover positioned over the air inlet, a back cover positioned over the air outlet, and first and second side air returns at opposite sides of the frame. At least one air moving device establishes air flow across the electronics drawers. The air flow bifurcates at the back cover and returns to the air inlet via the first and second side air returns and the front cover. An air-to-liquid heat exchanger cools the air flowing across the electronics drawers.

摘要翻译： 使用冷却液增强电子系统的空气冷却，以冷却进入系统的空气，并消除由电子设备消散的热量。 冷却的电子系统包括具有抽屉的框架，其中包含要冷却的电子元件。 框架包括一个带空气入口的前部和一个带有空气出口的后部。 框架包围框架，并且包括位于空气入口上方的前盖，位于空气出口上方的后盖，并且第一和第二侧面空气在框架的相对侧返回。 至少一个空气移动装置在电子抽屉之间建立空气流。 空气流在后盖处分叉并经由第一和第二侧面空气返回和前盖返回到进气口。 空气对液体的热交换器冷却流过电子抽屉的空气。

公开(公告)号：US20080017360A1

公开(公告)日：2008-01-24

申请号：US11458696

申请日：2006-07-20

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

IPC分类号： F28D1/04

CPC分类号： F28F1/126 ,  F28D2001/0266 ,  F28D2021/0031 ,  F28F1/30 ,  F28F1/32 ,  F28F2009/228 ,  G06F1/20 ,  G06F2200/201 ,  H01L23/3672 ,  H01L23/473 ,  H01L2924/0002 ,  Y10T29/4935 ,  Y10T29/49359 ,  Y10T29/49377 ,  Y10T29/49378 ,  Y10T29/4938 ,  H01L2924/00

摘要： A heat exchanger, method of fabrication and cooled electronics system employing the heat exchanger are provided. The heat exchanger, which in one embodiment cools air provided to heat generating components of a computer system, is disposed at an angle with respect to a direction of airflow. The heat exchanger includes a plurality of primary fins oriented parallel, and at least one plurality of secondary fins extending from at least one of a leading edge and a trailing edge of the plurality of primary fins. Each secondary fin extends from a respective primary fin at an angle other than 0° to facilitate airflow through the heat exchanger. Additionally, the secondary fins are fixedly positioned relative to and integral with the primary fins, thereby providing an increased heat transfer surface area.

摘要翻译： 提供了一种使用热交换器的热交换器，制造方法和冷却电子系统。 在一个实施例中，将提供给计算机系统的发热部件的空气冷却的热交换器相对于气流方向以一定角度设置。 热交换器包括平行定向的多个主翅片，以及从多个主翅片的前缘和后缘中的至少一个延伸的至少多个辅助翅片。 每个辅助翅片以相对于一个主翅片以0°以外的角度延伸，以便气流通过热交换器。 此外，副散热片相对于主翅片固定地定位并且与主翅片成一体，从而提供增加的传热表面积。

公开(公告)号：US20070295481A1

公开(公告)日：2007-12-27

申请号：US11426431

申请日：2006-06-26

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

IPC分类号： H05K7/20

CPC分类号： H05K7/20218

摘要： A dual-chamber fluid pump is provided for a multi-fluid electronics cooling system and method. The pump has a first fluid path for pumping a first fluid coolant and a second fluid path for pumping a second fluid coolant, with the first fluid path including a first pumping chamber and the second fluid path including a second pumping chamber. The first and second pumping chambers are separated by at least one diaphragm, and an actuator is coupled to the diaphragm for transitioning the diaphragm between a first position and a second position. Transitioning of the diaphragm to the first position pumps first fluid coolant from the first pumping chamber while concurrently drawing second fluid coolant into the second pumping chamber, and transitioning of the diaphragm to the second position pumps second fluid coolant from the second pumping chamber while concurrently drawing first fluid coolant into the first pumping chamber.

摘要翻译： 为多流体电子冷却系统和方法提供双室流体泵。 泵具有用于泵送第一流体冷却剂的第一流体路径和用于泵送第二流体冷却剂的第二流体路径，其中第一流体路径包括第一泵送室，第二流体路径包括第二泵送室。 第一和第二泵送室由至少一个隔膜隔开，并且致动器联接到隔膜，用于在第一位置和第二位置之间转换隔膜。 将隔膜转换到第一位置将第一流体冷却剂从第一泵送室抽出，同时将第二流体冷却剂拉入第二泵送室，并且将膜片转移到第二位置，从第二泵送室泵送第二流体冷却剂，同时拉伸 第一流体冷却剂进入第一泵送室。