Apparatus for and method for polishing workpiece
    31.
    发明授权
    Apparatus for and method for polishing workpiece 失效
    用于抛光工件的设备和方法

    公开(公告)号:US5762539A

    公开(公告)日:1998-06-09

    申请号:US807463

    申请日:1997-02-27

    IPC分类号: B24B37/30 B24B49/16 B24B5/00

    CPC分类号: B24B37/30 B24B49/16

    摘要: A polishing apparatus for polishing a workpiece such as a semiconductor wafer has a turntable with a polishing surface, and a top ring for holding a workpiece and pressing the workpiece against the polishing surface under a first pressing. The polishing apparatus has a pressurized fluid source for supplying pressurized fluid, and a plurality of openings provided in the holding surface of the top ring for ejecting the pressurized fluid supplied from the pressurized fluid source. A plurality of areas each having the openings are defined on the holding surface so that the pressurized fluid is selectively ejectable from the openings in the respective areas.

    摘要翻译: 用于抛光诸如半导体晶片的工件的抛光装置具有带有抛光表面的转台和用于保持工件的顶环,并且在第一次压制下将工件压靠在抛光表面上。 抛光装置具有用于供应加压流体的加压流体源和设置在顶环的保持表面中的多个开口,用于喷射从加压流体源供应的加压流体。 每个具有开口的多个区域被限定在保持表面上,使得加压流体可以选择性地从相应区域中的开口排出。