公开(公告)号：US20190109299A1

公开(公告)日：2019-04-11

申请号：US16087306

申请日：2017-03-20

Applicant: OSRAM OLED GmbH

Inventor： Daniel Riedel ,  Nina Riegel ,  Thomas Wehlus ,  Arne Fleissner ,  Armin Heinrichsdobler

IPC: H01L51/52

CPC classification number: H01L51/5268 ,  H01L51/5253

Abstract: An organic optoelectronic component includes an organic functional layer stack between a first electrode and a second electrode including a light-emitting layer formed to emit a radiation during operation of the component, and a coupling-out layer arranged above the first electrode and/or the second electrode which is in a beam path of the radiation of the light-emitting layer, wherein the coupling-out layer includes a structured layer and a planarization layer arranged thereabove and the structured layer has a structured surface structured at least in places, the planarization layer planarizes the structured surface of the structured layer, and a difference in the refractive indices of the structured layer and the planarization layer is smaller than 0.3 at least in places.

公开(公告)号：US10217940B2

公开(公告)日：2019-02-26

申请号：US15507221

申请日：2015-08-12

Applicant: OSRAM OLED GmbH

Inventor： Thomas Wehlus ,  Daniel Riedel ,  Nina Riegel ,  Silke Scharner ,  Johannes Rosenberger ,  Arne Fleissner

IPC: H01L29/08 ,  H01L35/24 ,  H01L51/00 ,  H01L51/44 ,  H01L51/52 ,  H01L51/50 ,  H01L51/56

Abstract: An optoelectronic device is disclosed. In an embodiment the optoelectronic device includes a light-transmissive first electrode, an electrically conductive track including a metal, and a functional organic region having at least one active region, wherein the electrically conductive track is arranged between the first electrode and the functional organic region and wherein the electrically conductive track is in direct contact with the first electrode and the functional organic region.

公开(公告)号：US09941486B2

公开(公告)日：2018-04-10

申请号：US15022992

申请日：2014-09-18

Applicant: OSRAM OLED GmbH

Inventor： Daniel Riedel ,  Johannes Rosenberger ,  Thomas Wehlus ,  Nina Riegel ,  Silke Scharner ,  Arne Fleissner

IPC: H01L51/52 ,  H01L21/66 ,  H01L51/56 ,  H01L51/44

CPC classification number: H01L51/5268 ,  H01L22/20 ,  H01L51/441 ,  H01L51/5203 ,  H01L51/5246 ,  H01L51/5253 ,  H01L51/5281 ,  H01L51/56 ,  H01L2251/308 ,  H01L2251/5361

Abstract: Various embodiments may relate to a component. The component includes an optically active region designed for electrically controllably transmitting, reflecting, absorbing, emitting and/or converting an electromagnetic radiation, and an optically inactive region formed alongside the optically active region, wherein the optically inactive region and/or the optically active region have/has an adaptation structure designed to adapt the value of an optical variable in the optically inactive region to a value of the optical variable in the optically active region.

公开(公告)号：US20170346040A1

公开(公告)日：2017-11-30

申请号：US15603536

申请日：2017-05-24

Applicant: Osram OLED GmbH

Inventor： Arne Fleissner

IPC: H01L51/52 ,  H01L51/56

CPC classification number: H01L51/5253 ,  H01L51/0022 ,  H01L51/5203 ,  H01L51/56

Abstract: Various embodiments provide a process for producing an optoelectronic component. The process includes forming a first electrode and at least one contact section atop a carrier, forming an optically functional layer structure atop the first electrode, forming a second electrode atop the optically functional layer structure, the first electrode or the second electrode being electrically connected to the contact section, applying a protective layer to at least a subregion of the contact section, the protective layer being formed by a material which is repellent to a substance for production of an encapsulation layer, and forming the encapsulation layer atop the second electrode and atop the contact section, the subregion remaining free of the encapsulation layer because of the protective layer.

公开(公告)号：US20170324065A1

公开(公告)日：2017-11-09

申请号：US15527336

申请日：2015-11-04

Applicant: OSRAM OLED GmbH

Inventor： Erwin Lang ,  Arne Fleissner

IPC: H01L51/52 ,  H01L27/32 ,  H01L33/40 ,  H01L33/38

CPC classification number: H01L51/5268 ,  G04C17/0091 ,  H01L27/3202 ,  H01L27/3293 ,  H01L33/38 ,  H01L33/405 ,  H01L51/0014 ,  H01L51/003 ,  H01L51/5203 ,  H01L51/5246 ,  H01L51/5253 ,  H01L2251/5361 ,  H01L2251/566

Abstract: An organic light-emitting diode provides a substrate having a top side and one or a plurality of substrate side surfaces running transversely to the top side and connected thereto via a substrate edge; and an organic layer sequence applied to the top side with an emitter layer, which generates electromagnetic radiation coupled out from the diode via a luminous surface during intended operation of the diode. In a plan view of the luminous surface, the sequence adjoins at least a partial region of substrate edge(s), and in the region the luminous surface extends at least as far as the corresponding edge. An encapsulation formed in an uninterrupted and continuous fashion is applied to the sequence. The encapsulation, at least in the region of the edge adjoining the sequence, is led onto the associated substrate side surface, at least partly covers the latter and is in direct contact with the surface.

公开(公告)号：US20170284628A1

公开(公告)日：2017-10-05

申请号：US15513570

申请日：2015-09-22

Applicant: OSRAM OLED GmbH

Inventor： Thomas Wehlus ,  Daniel Riedel ,  Nina Riegel ,  Silke Scharner ,  Johannes Rosenberger ,  Arne Fleissner

IPC: F21V3/04 ,  F21V23/00 ,  F21V23/04 ,  F21V15/01

CPC classification number: F21V3/06 ,  F21V15/01 ,  F21V23/003 ,  F21V23/04 ,  F21Y2107/00 ,  F21Y2115/10 ,  H01L51/5036 ,  H01L51/5262 ,  H01L51/5268 ,  H01L2251/5338 ,  H01L2251/5361

Abstract: A light-emitting module including a light-emitting component and a resilient body is provided. The light-emitting component includes a light-emitting layer structure for generating light and includes a light-emitting main face through which the generated light leaves the light-emitting component. The resilient body, which is arranged over the light-emitting main face, is connected firmly to the light-emitting component, includes at least one light-deviating region, and includes a free-lying surface which includes at least one surface element, which lies at a distance greater than or equal to 4 mm from the light-emitting layer structure.

公开(公告)号：US20170214002A1

公开(公告)日：2017-07-27

申请号：US15326504

申请日：2015-07-03

Applicant: OSRAM OLED GmbH

Inventor： Daniel Riedel ,  Thomas Wehlus ,  Nina Riegel ,  Silke Scharner ,  Johannes Rosenberger ,  Arne Fleissner

IPC: H01L51/52 ,  H01L27/32 ,  H01L51/56 ,  H01L51/00 ,  H01L25/04

CPC classification number: H01L51/5271 ,  F21V7/0008 ,  F21V7/0016 ,  F21V7/05 ,  F21Y2105/00 ,  F21Y2115/15 ,  H01L25/048 ,  H01L27/3206 ,  H01L51/0096 ,  H01L51/5218 ,  H01L51/5221 ,  H01L51/5253 ,  H01L51/56 ,  H01L2251/5361

Abstract: An optoelectronic assembly includes an optoelectronic component having a surface light source for emitting a light on a substrate which is at least partly transmissive for the light emitted by the surface light source, wherein the optoelectronic component includes at least one first main emission surface and a second main emission surface wherein the second main emission surface is situated opposite the first main emission surface, and a reflective structure which is arranged at least partly in the beam path of the light emitted by the surface light source and is designed to reflect at least part of the light impinging on the reflective structure in the direction of the substrate, such that a laterally offset image of the surface light source is generatable. The reflective structure and the optoelectronic component are arranged at a distance from one another in a range of approximately 1 mm to approximately 1000 mm.

公开(公告)号：US11569479B2

公开(公告)日：2023-01-31

申请号：US17335534

申请日：2021-06-01

Applicant: OSRAM OLED GmbH

Inventor： Sebastian Wittmann ,  Arne Fleissner ,  Erwin Lang

IPC: H01L51/52 ,  H01L51/50

Abstract: A multilayer encapsulation, a method for encapsulating and an optoelectronic component are disclosed. In an embodiment an optoelectronic component includes a first electrode layer, an organic light-emitting layer stack abutting the first electrode layer, a second electrode layer abutting the light-emitting layer stack and a multilayer encapsulation abutting the second electrode layer, wherein the multilayer encapsulation comprises a barrier layer and a planarization layer, wherein the planarization layer abuts the second electrode layer, and wherein the planarization layer is arranged between the second electrode layer and the barrier layer.

公开(公告)号：US11043654B2

公开(公告)日：2021-06-22

申请号：US16830023

申请日：2020-03-25

Applicant: OSRAM OLED GmbH

Inventor： Sebastian Wittmann ,  Arne Fleissner ,  Erwin Lang

IPC: H01L51/52 ,  H01L51/50

Abstract: A multilayer encapsulation, a method for encapsulating and an optoelectronic component are disclosed. In an embodiment an optoelectronic component includes a first electrode layer, an organic light-emitting layer stack abutting the first electrode layer, a second electrode layer abutting the light-emitting layer stack and a multilayer encapsulation abutting the second electrode layer, wherein the multilayer encapsulation comprises a barrier layer and a planarization layer, wherein the planarization layer abuts the second electrode layer, and wherein the planarization layer is arranged between the second electrode layer and the barrier layer.

公开(公告)号：US20200381666A1

公开(公告)日：2020-12-03

申请号：US16995879

申请日：2020-08-18

Applicant: OSRAM OLED GmbH

Inventor： Daniel Riedel ,  Nina Riegel ,  Thomas Wehlus ,  Arne Fleissner ,  Armin Heinrichsdobler

IPC: H01L51/52

Abstract: An organic optoelectronic component includes an organic functional layer stack between a first electrode and a second electrode including a light-emitting layer formed to emit radiation during operation of the component; a coupling-out layer arranged above the first electrode and/or the second electrode which is in a beam path of the radiation of the light-emitting layer; and a protective layer above the coupling-out layer, wherein the coupling-out layer includes a structured layer and a planarization layer arranged thereabove and the structured layer has a structured surface structured at least in places, the planarization layer planarizes the structured surface of the structured layer, the protective layer cannot be removed without at least partially destroying the coupling-out layer, and adhesion of the structured layer to the planarization layer is smaller than adhesion of the protective layer to the planarization layer.