公开(公告)号：US06394334B1

公开(公告)日：2002-05-28

申请号：US09536810

申请日：2000-03-28

申请人： Guy Paul Brouillette ,  Peter Alfred Gruber ,  Frederic Maurer

发明人： Guy Paul Brouillette ,  Peter Alfred Gruber ,  Frederic Maurer

IPC分类号： B23K100

CPC分类号： B23K3/00 ,  B23K1/00 ,  B23K3/0623 ,  B33Y30/00 ,  H01L24/11 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/13099 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/3457 ,  H05K2203/0113 ,  H01L2924/00014

摘要： The present invention discloses a method and apparatus for forming solder bumps by a molten solder screening technique in which a flexible die head constructed of a metal sheet is utilized for maintaining an intimate contact between the die head and a solder receiving mold surface, The flexible die head, when used in combination with a pressure means, is capable of conforming to any curved mold surface as long as the curvature is not more than 2.5 &mgr;m per inch of die length. The present invention further provides a method and apparatus for filling a multiplicity of cavities in a mold surface by providing a stream of molten solder and then intimately contacting the surface of the molten solder with a multiplicity of cavities such that the molten solder readily fills the cavities. The apparatus further provides means for removing excess molten solder from the surface of the mold without disturbing the molten solder already filled in the cavities. The present invention further discloses a flexible die for dispensing molten solder consisting of a die body that is constructed of a metal sheet capable of flexing of not less than 1.5 &mgr;m per inch of die length, a gate opening for receiving a supply of molten solder, a slot opening for dispensing the molten solder onto a solder receiving surface, and a pressure means associated with the die body for providing adequate pressure such that the die body intimately contacting the solder receiving mold surface.

摘要翻译： 本发明公开了一种通过熔融焊料筛选技术形成焊料凸块的方法和装置，其中使用由金属板构成的柔性模头来保持模头和焊料接收模具表面之间的紧密接触。柔性模具 当与压力装置组合使用时，头部能够符合任何弯曲的模具表面，只要曲率不超过2.5英寸/英寸的模头长度。 本发明还提供了一种用于通过提供熔融焊料流来填充模具表面中的多个空腔并随后使熔融焊料的表面与多个空腔紧密接触的方法和装置，使得熔融焊料容易地填充空腔 。 该装置还提供了用于从模具表面去除多余的熔融焊料而不干扰已经填充在空腔中的熔融焊料的装置。 本发明还公开了一种用于分配熔融焊料的柔性模具，其由由能够弯曲不小于1.5mum /英寸的模具长度的金属板构成的模具本体构成，用于接收熔融焊料的供给的闸门开口， 用于将熔融焊料分配到焊料接收表面上的槽口，以及与模具主体相关联的压力装置，用于提供足够的压力，使得模具体与焊料接收模具表面紧密接触。

公开(公告)号：US6133633A

公开(公告)日：2000-10-17

申请号：US169249

申请日：1998-10-09

申请人： Daniel George Berger ,  Guy Paul Brouillette ,  David Hirsch Danovitch ,  Peter Alfred Gruber ,  Rajesh Shankerlal Patel ,  Stephen Roux ,  Carlos Juan Sambucetti ,  James Louis Speidell

发明人： Daniel George Berger ,  Guy Paul Brouillette ,  David Hirsch Danovitch ,  Peter Alfred Gruber ,  Rajesh Shankerlal Patel ,  Stephen Roux ,  Carlos Juan Sambucetti ,  James Louis Speidell

IPC分类号： H01L21/60 ,  H01L21/68 ,  H01L23/485 ,  H05K3/34 ,  H01L23/48

CPC分类号： H05K3/3468 ,  H01L21/6835 ,  H01L24/11 ,  H01L2224/11003 ,  H01L2224/111 ,  H01L2224/1111 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12042 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/128

摘要： A method for forming solder bumps on an electronic structure including the steps of first providing a mold made by a sheet of a mold material having a thickness greater than that of the solder bumps to be formed, the mold material has sufficient optical transparency so as to allow the inspection of a solder material subsequently filled into the mold cavities that are formed in the mold material, and a coefficient of thermal expansion that is substantially similar to the substrate which the mold will be mated to, forming a multiplicity of mold cavities in the sheet of mold material, filling the multiplicity of mold cavities with a solder material, cooling the mold to a temperature that is sufficient to solidify the solder material in the multiplicity of mold cavities, positioning the mold intimately with the electronic structure such that the cavities facing the structure, and heating the mold and the structure together to a temperature sufficiently high such that the solder material transfers onto the electronic structure.

公开(公告)号：US5775569A

公开(公告)日：1998-07-07

申请号：US741453

申请日：1996-10-31

申请人： Daniel George Berger ,  Guy Paul Brouillette ,  David Hirsch Danovitch ,  Peter Alfred Gruber ,  Rajesh Shankerlal Patel ,  Stephen Roux ,  Carlos Juan Sambucetti ,  James Louis Speidell

发明人： Daniel George Berger ,  Guy Paul Brouillette ,  David Hirsch Danovitch ,  Peter Alfred Gruber ,  Rajesh Shankerlal Patel ,  Stephen Roux ,  Carlos Juan Sambucetti ,  James Louis Speidell

IPC分类号： H01L21/60 ,  H01L21/68 ,  H01L23/485 ,  H05K3/34

CPC分类号： H05K3/3468 ,  H01L21/6835 ,  H01L24/11 ,  H01L2224/11003 ,  H01L2224/111 ,  H01L2224/1111 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12042 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/128

摘要： A method for forming solder bumps on an electronic structure including the steps of first providing a mold made by a sheet of a mold material having a thickness greater than that of the solder bumps to be formed, the mold material has sufficient optical transparency so as to allow the inspection of a solder material subsequently filled into the mold cavities that are formed in the mold material, and a coefficient of thermal expansion that is substantially similar to the substrate which the mold will be mated to, forming a multiplicity of mold cavities in the sheet of mold material, filling the multiplicity of mold cavities with a solder material, cooling the mold to a temperature that is sufficient to solidify the solder material in the multiplicity of mold cavities, positioning the mold intimately with the electronic structure such that the cavities facing the structure, and heating the mold and the structure together to a temperature sufficiently high such that the solder material transfers onto the electronic structure.

公开(公告)号：US5673846A

公开(公告)日：1997-10-07

申请号：US518736

申请日：1995-08-24

申请人： Peter Alfred Gruber

发明人： Peter Alfred Gruber

IPC分类号： B23K35/02 ,  H01L21/48 ,  H01L21/60 ,  H05K3/34 ,  B23K35/14

CPC分类号： B23K35/0222 ,  H01L21/4853 ,  H01L24/11 ,  H05K3/3436 ,  H05K3/3468 ,  H01L2224/11003 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19043 ,  H05K2201/10378 ,  H05K2201/10424 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/128 ,  Y02P70/613

摘要： A solder decal is produced by a method wherein a decal strip having a plurality of anchor holes is aligned with a mold having a plurality of cells. Liquid solder is injected into the anchor holes and mold cells, and is then allowed to cool to solidify therein. The mold may be separated from the decal strip to form the solder decal containing solder beads each having a stem mechanically joined to the strip at respective ones of the anchor holes. Various forms of the solder decal are used for transferring the solder beads to a substrate or chip, or effecting temporary connections for conducting burn-in and testing, or accommodating thermal mismatch for example.

摘要翻译： 通过一种方法产生焊锡贴花，其中具有多个锚定孔的贴花带与具有多个电池的模具对准。 将液体焊料注入锚定孔和模具细胞中，然后使其冷却固化。 模具可以与贴花带分离以形成含有焊料珠的焊料贴花，每个焊料珠都具有在相应的锚定孔处机械连接到带材的茎。 使用各种形式的焊锡贴花将焊料珠转移到基板或芯片，或者实现用于进行老化和测试的临时连接，或者例如适应热失配。