公开(公告)号：US6149122A

公开(公告)日：2000-11-21

申请号：US169854

申请日：1998-10-09

申请人： Daniel George Berger ,  Guy Paul Brouillette ,  David Hirsch Danovitch ,  Peter Alfred Gruber ,  Rajesh Shankerlal Patel ,  Stephen Roux ,  Carlos Juan Sambucetti ,  James Louis Speidell

发明人： Daniel George Berger ,  Guy Paul Brouillette ,  David Hirsch Danovitch ,  Peter Alfred Gruber ,  Rajesh Shankerlal Patel ,  Stephen Roux ,  Carlos Juan Sambucetti ,  James Louis Speidell

IPC分类号： H01L21/60 ,  H01L21/68 ,  H01L23/485 ,  H05K3/34 ,  B29C33/00

CPC分类号： H05K3/3468 ,  H01L21/6835 ,  H01L24/11 ,  H01L2224/11003 ,  H01L2224/111 ,  H01L2224/1111 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12042 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/128

摘要： A method for forming solder bumps on an electronic structure including the steps of first providing a mold made by a sheet of a mold material having a thickness greater than that of the solder bumps to be formed, the mold material has sufficient optical transparency so as to allow the inspection of a solder material subsequently filled into the mold cavities that are formed in the mold material, and a coefficient of thermal expansion that is substantially similar to the substrate which the mold will be mated to, forming a multiplicity of mold cavities in the sheet of mold material, filling the multiplicity of mold cavities with a solder material, cooling the mold to a temperature that is sufficient to solidify the solder material in the multiplicity of mold cavities, positioning the mold intimately with the electronic structure such that the cavities facing the structure, and heating the mold and the structure together to a temperature sufficiently high such that the solder material transfers onto the electronic structure.

摘要翻译： 一种用于在电子结构上形成焊料凸块的方法，包括以下步骤：首先提供由具有大于待形成的焊料凸块的厚度的模具材料的片材制成的模具，所述模具材料具有足够的光学透明度，以便 允许检查随后填充到模具材料中形成的模腔中的焊料材料，以及与模具将被配合到的基板基本相似的热膨胀系数，在该模具中形成多个模腔 模具材料片材，用焊料材料填充多个模腔，将模具冷却到足以固化多个模腔中的焊料材料的温度，将模具与电子结构紧密地定位，使得空腔面向 结构，并将模具和结构加热到足够高的温度，使得焊料材料tr 在电子结构上。

公开(公告)号：US6133633A

公开(公告)日：2000-10-17

申请号：US169249

申请日：1998-10-09

申请人： Daniel George Berger ,  Guy Paul Brouillette ,  David Hirsch Danovitch ,  Peter Alfred Gruber ,  Rajesh Shankerlal Patel ,  Stephen Roux ,  Carlos Juan Sambucetti ,  James Louis Speidell

发明人： Daniel George Berger ,  Guy Paul Brouillette ,  David Hirsch Danovitch ,  Peter Alfred Gruber ,  Rajesh Shankerlal Patel ,  Stephen Roux ,  Carlos Juan Sambucetti ,  James Louis Speidell

IPC分类号： H01L21/60 ,  H01L21/68 ,  H01L23/485 ,  H05K3/34 ,  H01L23/48

CPC分类号： H05K3/3468 ,  H01L21/6835 ,  H01L24/11 ,  H01L2224/11003 ,  H01L2224/111 ,  H01L2224/1111 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12042 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/128

摘要： A method for forming solder bumps on an electronic structure including the steps of first providing a mold made by a sheet of a mold material having a thickness greater than that of the solder bumps to be formed, the mold material has sufficient optical transparency so as to allow the inspection of a solder material subsequently filled into the mold cavities that are formed in the mold material, and a coefficient of thermal expansion that is substantially similar to the substrate which the mold will be mated to, forming a multiplicity of mold cavities in the sheet of mold material, filling the multiplicity of mold cavities with a solder material, cooling the mold to a temperature that is sufficient to solidify the solder material in the multiplicity of mold cavities, positioning the mold intimately with the electronic structure such that the cavities facing the structure, and heating the mold and the structure together to a temperature sufficiently high such that the solder material transfers onto the electronic structure.

公开(公告)号：US5775569A

公开(公告)日：1998-07-07

申请号：US741453

申请日：1996-10-31

申请人： Daniel George Berger ,  Guy Paul Brouillette ,  David Hirsch Danovitch ,  Peter Alfred Gruber ,  Rajesh Shankerlal Patel ,  Stephen Roux ,  Carlos Juan Sambucetti ,  James Louis Speidell

发明人： Daniel George Berger ,  Guy Paul Brouillette ,  David Hirsch Danovitch ,  Peter Alfred Gruber ,  Rajesh Shankerlal Patel ,  Stephen Roux ,  Carlos Juan Sambucetti ,  James Louis Speidell

IPC分类号： H01L21/60 ,  H01L21/68 ,  H01L23/485 ,  H05K3/34

CPC分类号： H05K3/3468 ,  H01L21/6835 ,  H01L24/11 ,  H01L2224/11003 ,  H01L2224/111 ,  H01L2224/1111 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12042 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/128

摘要： A method for forming solder bumps on an electronic structure including the steps of first providing a mold made by a sheet of a mold material having a thickness greater than that of the solder bumps to be formed, the mold material has sufficient optical transparency so as to allow the inspection of a solder material subsequently filled into the mold cavities that are formed in the mold material, and a coefficient of thermal expansion that is substantially similar to the substrate which the mold will be mated to, forming a multiplicity of mold cavities in the sheet of mold material, filling the multiplicity of mold cavities with a solder material, cooling the mold to a temperature that is sufficient to solidify the solder material in the multiplicity of mold cavities, positioning the mold intimately with the electronic structure such that the cavities facing the structure, and heating the mold and the structure together to a temperature sufficiently high such that the solder material transfers onto the electronic structure.

公开(公告)号：US6105852A

公开(公告)日：2000-08-22

申请号：US19396

申请日：1998-02-05

申请人： Steven A. Cordes ,  Peter Alfred Gruber ,  Egon Max Kummer ,  Stephen Roux ,  Carlos Juan Sambucetti ,  James Louis Speidell

发明人： Steven A. Cordes ,  Peter Alfred Gruber ,  Egon Max Kummer ,  Stephen Roux ,  Carlos Juan Sambucetti ,  James Louis Speidell

IPC分类号： B23K35/12 ,  H01L21/60 ,  H05K3/00 ,  H05K3/34 ,  H01L29/40 ,  H01L2/44

CPC分类号： H01L24/11 ,  H05K3/3468 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01072 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/128 ,  H05K3/002

摘要： A precise volume, precisely registerable carrier is provided for use with injection molding for producing integrated circuit bump contacts in the "flip chip" technology. A hemispherical cavity is produced by etching through and undercutting a registered opening into a transparent carrier. The hemispherical cavity has related specific volume and visible peripheral shape that permits simple optical quality control when the injection molding operation has filled the cavity and simple optical registration for fusing to the pads on the integrated circuit.

摘要翻译： 提供精确的体积，精确对准的载体，用于注射成型，用于在“倒装芯片”技术中制造集成电路凸块触点。 通过将注册的开口蚀刻穿透并切割成透明载体来制造半球形腔。 半球形腔体具有相关的体积和可见的周边形状，当注射成型操作已经填充空腔时，允许简单的光学质量控制，并且简单的光学配准用于熔合到集成电路上的焊盘。

公开(公告)号：US06332569B1

公开(公告)日：2001-12-25

申请号：US09578319

申请日：2000-05-24

申请人： Steven A. Cordes ,  Peter Alfred Gruber ,  Egon Max Kummer ,  Stephen Roux ,  Carlos Juan Sambucetti ,  James Louis Speidell

发明人： Steven A. Cordes ,  Peter Alfred Gruber ,  Egon Max Kummer ,  Stephen Roux ,  Carlos Juan Sambucetti ,  James Louis Speidell

IPC分类号： B23K3102

CPC分类号： H01L24/11 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01072 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/002 ,  H05K3/3468 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/128 ,  H01L2224/05599

摘要： A precise volume, precisely registerable carrier is provided for use with injection molding for producing integrated circuit bump contacts in the “flip chip” technology. A hemispherical cavity is produced by etching through and undercutting a registered opening into a transparent carrier. The hemispherical cavity has related specific volume and visible peripheral shape that permits simple optical quality control when the injection molding operation has filled the cavity and simple optical registration for fusing to the pads on the integrated circuit.

摘要翻译： 提供精确的体积，精确对准的载体，用于注射成型，用于在“倒装芯片”技术中制造集成电路凸块触点。 通过将注册的开口蚀刻穿透并切割成透明载体来制造半球形腔。 半球形腔体具有相关的体积和可见的周边形状，当注射成型操作已经填充空腔时，允许简单的光学质量控制，并且简单的光学配准用于熔合到集成电路上的焊盘。

公开(公告)号：US07136214B2

公开(公告)日：2006-11-14

申请号：US10986076

申请日：2004-11-12

申请人： Erik Loopstra ,  Stephen Roux

发明人： Erik Loopstra ,  Stephen Roux

IPC分类号： G02B26/00

CPC分类号： G02B27/0977 ,  G02B7/1827 ,  G02B27/0905 ,  G03F7/70116 ,  G03F7/702 ,  G03F7/70291

摘要： An active faceted mirror system is disclosed. The active faceted mirror system includes a set of active facet mirror devices, a base plate and a set of pins for mounting the active facet mirror devices to the base plate. Each of the active facet mirror devices includes a mirror substrate with a reflective surface and a bearing hole on the reverse side for mounting. Additionally, each of the active facet mirror devices includes at least three actuator targets located on the back side of the mirror substrate, a jewel bearing and a flexure for supporting the mirror substrate. The base plate includes a series of bearing holes for mounting the active facet mirror devices and at least three actuators for each of the active facet mirror devices. A set of facet controllers located on the base plate can be used to control the positioning of the active facet mirror devices to produce a desired illumination effect.

摘要翻译： 公开了一种主动刻面镜系统。 主动分面镜系统包括一组主动分面镜装置，底板和一组用于将活动小面镜装置安装到基板的销。 每个活性刻面镜装置包括具有反射表面的反射镜基板和用于安装的反面上的轴承孔。 此外，每个活动刻面镜装置包括位于镜基板背面的至少三个致动器目标，宝石轴承和用于支撑镜面基板的挠曲件。 基板包括用于安装主动分面镜装置的一系列轴承孔和用于每个主动分面镜装置的至少三个致动器。 可以使用位于基板上的一组小面控制器来控制活动小面镜装置的定位以产生期望的照明效果。

公开(公告)号：US20060077372A1

公开(公告)日：2006-04-13

申请号：US10962550

申请日：2004-10-13

申请人： Stephen Roux ,  Erik Loopstra ,  Michael Nelson

发明人： Stephen Roux ,  Erik Loopstra ,  Michael Nelson

IPC分类号： G03B27/72

CPC分类号： G03F7/70558 ,  G03F7/70066

摘要： An apparatus for changing an aggregate intensity of a light within an illumination field of a photolithography system comprising a blade structure and a first actuator. The blade structure is configured to be positioned along an optical path of the photolithography system between an illumination system of the photolithography system and a reticle stage of the photolithography system so that, when the illumination system provides the light having the illumination field, the blade structure is substantially at a center of the illumination field and a first portion of the light within the illumination field impinges upon the blade structure. The blade structure is either translucent to a wavelength of the light or opaque to the wavelength. The first portion of the light has a first area. The first actuator is coupled between a first portion of the blade structure and a frame of the photolithography system and is configured to move at least the first portion of the blade structure in a first direction so that, when the illumination system provides the light having the illumination field, a second portion of the light within the illumination field impinges upon the blade structure. The second portion of the light has a second area. The second area is different from the first area.

摘要翻译： 一种用于改变包括叶片结构和第一致动器的光刻系统的照明场内的光聚集强度的装置。 刀片结构被配置为沿着光刻系统的光路定位在光刻系统的照明系统和光刻系统的光罩台之间，使得当照明系统提供具有照明场的光时，叶片结构 基本上在照明场的中心，并且照明场内的光的第一部分撞击在叶片结构上。 叶片结构对于光的波长是半透明的或对于波长是不透明的。 光的第一部分具有第一区域。 第一致动器耦合在叶片结构的第一部分和光刻系统的框架之间，并且构造成在第一方向上至少移动叶片结构的第一部分，使得当照明系统提供具有 照明场，照明场内的光的第二部分照射在叶片结构上。 光的第二部分具有第二区域。 第二个区域与第一个区域不同。

公开(公告)号：US07016051B2

公开(公告)日：2006-03-21

申请号：US10965026

申请日：2004-10-15

申请人： Stephen Roux ,  Todd J. Bednarek

发明人： Stephen Roux ,  Todd J. Bednarek

IPC分类号： G01B9/02

CPC分类号： G03F9/7026 ,  G03F7/70716 ,  G03F7/70725

摘要： A first set of interferometric measuring beams is used to determine a location of a patterned surface of a reticle and a reticle focus plane for a reticle that is back clamped to a reticle stage. A second set of interferometric measuring beams is used to determine a map of locations of the reticle stage during scanning in a Y direction. The two sets of interferometric measuring beams are correlated to relate the reticle focal plane to the map of the reticle stage. The information is used to control the reticle stage during exposure of a pattern on the patterned surface of the reticle onto a wafer.

摘要翻译： 第一组干涉测量光束用于确定掩模版的图案化表面的位置和用于后夹紧到标线片台的掩模版的掩模版聚焦平面。 第二组干涉测量光束用于确定在Y方向扫描期间光罩台的位置的图。 两组干涉测量光束相关联，将标线片焦平面与标线片平台的图相关。 该信息用于在将掩模版的图案化表面上的图案曝光到晶片上时控制掩模版阶段。

公开(公告)号：US06919573B2

公开(公告)日：2005-07-19

申请号：US10392793

申请日：2003-03-20

申请人： Stephen Roux

发明人： Stephen Roux

IPC分类号： G21K5/00 ,  G03F7/20 ,  G21K5/02 ,  H01L21/027

CPC分类号： G03F7/70933 ,  B82Y10/00 ,  G03F7/70033 ,  G03F7/70841 ,  G03F7/70883

摘要： A system and method are used to recycle gases in a lithography tool. A first chamber includes an element that emits light based on a first gas. A second chamber uses the emitted light to perform a process and includes the second gas. The first and second gases converge between the two chambers, and at least one of the gases is pumped to a storage device. From the storage device, at least one of the two gases is recycled either within the system or remote from the system and possibly reused within the system. A gaslock can couple the first chamber to the second chamber. A gas source supplies a third gas between the first and the second gas in the gaslock, such that the first gas is isolated from the second gas in the gaslock. The first, second, and/or third gas can be pumped to the storage device and routed to the recycling device. The first, second, and/or third gas can be recycled for reuse to form the emitting light.

公开(公告)号：US20050062980A1

公开(公告)日：2005-03-24

申请号：US10965026

申请日：2004-10-15

申请人： Stephen Roux ,  Todd Bednarek

发明人： Stephen Roux ,  Todd Bednarek

IPC分类号： H01L21/027 ,  G03F7/20 ,  G03F7/207 ,  G03F9/00 ,  G01B9/02

CPC分类号： G03F9/7026 ,  G03F7/70716 ,  G03F7/70725

摘要： A first set of interferometric measuring beams is used to determine a location of a patterned surface of a reticle and a reticle focus plane for a reticle that is back clamped to a reticle stage. A second set of interferometric measuring beams is used to determine a map of locations of the reticle stage during scanning in a Y direction. The two sets of interferometric measuring beams are correlated to relate the reticle focal plane to the map of the reticle stage. The information is used to control the reticle stage during exposure of a pattern on the patterned surface of the reticle onto a wafer.

摘要翻译： 第一组干涉测量光束用于确定掩模版的图案化表面的位置和用于后夹紧到标线片台的掩模版的掩模版聚焦平面。 第二组干涉测量光束用于确定在Y方向扫描期间光罩台的位置的图。 两组干涉测量光束相关联，将标线片焦平面与标线片平台的图相关。 该信息用于在将掩模版的图案化表面上的图案曝光到晶片上时控制掩模版阶段。