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    SYSTEMS AND DEVICES HAVING SINGLE-SIDED WAFER-LEVEL OPTICS
    33.
    发明申请
    SYSTEMS AND DEVICES HAVING SINGLE-SIDED WAFER-LEVEL OPTICS 审中-公开

    公开(公告)号：US20170285308A1

    公开(公告)日：2017-10-05

    申请号：US15275148

    申请日：2016-09-23

    Applicant: QUALCOMM Incorporated

    Inventor： Todor Georgiev Georgiev ,  Wen-Yu Sun ,  Zheng-wu Li ,  Jon Lasiter

    IPC: G02B13/00 ,  B32B37/12

    CPC classification number: G02B13/0085 ,  B32B37/12 ,  B32B2307/40 ,  G02B5/005 ,  G02B13/0045 ,  G02B27/0025

    Abstract: An optical system may include a lens assembly that has two or more single-sided wafer level optics (WLO) lenses arranged to propagate light. The optical system can further include an image sensor, wherein the lens assembly is arranged relative to the image sensor to propagate light received at a first surface of the lens assembly, through the two or more single-sided WLO lenses and to the image sensor. In some embodiments, the optical system further includes a camera which includes the lens assembly and the image sensor. In various embodiments, a smart phone, a tablet computer, or another mobile computing device may include such a camera. In some embodiments, the at least two single-sided wafer level optics (WLO) lenses are each separated by a gap G, wherein the gap may be different between each of the single-sided lenses, and the gap G may be zero.

    SUBMICRON WAFER ALIGNMENT
    36.
    发明申请
    SUBMICRON WAFER ALIGNMENT 有权
    子波形对准

    公开(公告)号：US20170038552A1

    公开(公告)日：2017-02-09

    申请号：US15188635

    申请日：2016-06-21

    Applicant: QUALCOMM Incorporated

    Inventor： Todor Georgiev Georgiev

    IPC: G02B7/00 ,  G02B21/00 ,  G06T7/00 ,  G02B21/36 ,  G02B27/10 ,  H04N5/225 ,  G02B13/00 ,  G02B27/60

    CPC classification number: G02B7/003 ,  G01M11/00 ,  G02B13/0085 ,  G02B21/0016 ,  G02B21/365 ,  G02B27/1073 ,  G02B27/144 ,  G02B27/60 ,  G02B27/62 ,  G06T7/0004 ,  G06T7/70 ,  G06T7/73 ,  G06T2207/30148 ,  H04N5/2254

    Abstract: Certain aspects relate to systems and techniques for submicron alignment in wafer optics. One disclosed method of alignment between wafers to produce an integrated lens stack employs a beam splitter (that is, a 50% transparent mirror) that reflects the alignment mark of the top wafer when the microscope objective is focused on the alignment mark of the bottom wafer. Another disclosed method of alignment between wafers to produce an integrated lens stack implements complementary patterns that can produce a Moiré effect when misaligned in order to aid in visually determining proper alignment between the wafers. In some embodiments, the methods can be combined to increase precision.

    Abstract translation: 某些方面涉及晶片光学器件中亚微米对准的系统和技术。 一种公开的在晶片之间进行对准以产生集成透镜堆叠的方法采用当显微镜物镜聚焦在底部晶片的对准标记上时反射顶部晶片的对准标记的分束器（即，50％透明反射镜） 。 在晶片之间进行对准以产生集成透镜叠层的另一公开的方法实现了互补图案，当未对准时可产生莫尔效应，以便有助于在视觉上确定晶片之间的正确对准。 在一些实施例中，可以组合这些方法以提高精度。

    MULTI-CAMERA SYSTEM USING FOLDED OPTICS
    37.
    发明申请
    MULTI-CAMERA SYSTEM USING FOLDED OPTICS 有权
    使用折叠光学的多相机系统

    公开(公告)号：US20160295112A1

    公开(公告)日：2016-10-06

    申请号：US15183043

    申请日：2016-06-15

    Applicant: QUALCOMM Incorporated

    Inventor： Todor Georgiev Georgiev ,  Thomas Wesley Osborne ,  Sergiu Radu Goma

    IPC: H04N5/232 ,  G06T3/40 ,  G02B13/00 ,  H04N5/247

    CPC classification number: H04N5/23238 ,  G02B13/0065 ,  G06T3/4038 ,  H04N5/2254 ,  H04N5/2257 ,  H04N5/247 ,  H04N5/3415 ,  H04N7/18

    Abstract: Described herein are methods and devices that employ a plurality of image sensors to capture a target image of a scene. As described, positioning at least one reflective or refractive surface near the plurality of image sensors enables the sensors to capture together an image of wider field of view and longer focal length than any sensor could capture individually by using the reflective or refractive surface to guide a portion of the image scene to each sensor. The different portions of the scene captured by the sensors may overlap, and may be aligned and cropped to generate the target image.

    Abstract translation: 这里描述了使用多个图像传感器来捕获场景的目标图像的方法和装置。 如上所述，在多个图像传感器附近定位至少一个反射或折射表面使得传感器能够将比较任何传感器可以通过使用反射或折射表面单独捕获的更宽视野和更长焦距的图像一起捕获以引导 图像场景的一部分到每个传感器。 由传感器捕获的场景的不同部分可以重叠，并且可以对准和裁剪以生成目标图像。

    MULTI-CAMERA SYSTEM USING FOLDED OPTICS FREE FROM PARALLAX ARTIFACTS
    39.
    发明申请
    MULTI-CAMERA SYSTEM USING FOLDED OPTICS FREE FROM PARALLAX ARTIFACTS 有权
    使用折射光学的多摄像机系统免费从PARALLAX ARTIFACTS

    公开(公告)号：US20150373263A1

    公开(公告)日：2015-12-24

    申请号：US14611045

    申请日：2015-01-30

    Applicant: QUALCOMM Incorporated

    Inventor： Todor Georgiev Georgiev ,  Thomas Wesley Osborne ,  Sergiu Radu Goma

    IPC: H04N5/232 ,  H04N5/335 ,  H04N5/225

    CPC classification number: G02B17/023 ,  G02B27/1066 ,  G02B27/40 ,  G03B17/00 ,  G03B17/17 ,  G06T3/4038 ,  H04N5/2252 ,  H04N5/2253 ,  H04N5/2254 ,  H04N5/2258 ,  H04N5/23238 ,  H04N5/2355 ,  H04N5/247 ,  H04N13/00 ,  H04N13/243

    Abstract: Aspects relate to an array camera exhibiting little or no parallax artifacts in captured images. For example, the planes of the central mirror surfaces of the array camera can be located at a midpoint along, and orthogonally to, a line between the corresponding camera location and the virtual camera location. Accordingly, the cones of all of the cameras in the array appear as if coming from the virtual camera location after folding by the mirrors. Each sensor in the array “sees” a portion of the image scene using a corresponding facet of the central mirror prism, and accordingly each individual sensor/mirror pair represents only a sub-aperture of the total array camera. The complete array camera has a synthetic aperture generated based on the sum of all individual aperture rays.

    Abstract translation: 方面涉及在捕获的图像中显示很少或没有视差伪像的阵列相机。 例如，阵列相机的中央镜面的平面可以位于相应的相机位置和虚拟相机位置之间的直线的正中心处。 因此，阵列中的所有摄像机的锥体看起来好像在被镜子折叠之后来自虚拟摄像机位置。 阵列中的每个传感器使用中心镜棱镜的相应小面“看到”图像场景的一部分，因此每个单独的传感器/镜对仅表示总阵列照相机的子孔径。 完整的阵列相机具有基于所有单独光阑的总和产生的合成孔径。

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