公开(公告)号：US11710708B2

公开(公告)日：2023-07-25

申请号：US17406541

申请日：2021-08-19

Applicant: Raytheon Company

Inventor： Matthew DeJarld ,  Jeffrey R. LaRoche ,  Susan C. Trulli

IPC: H01L23/552 ,  H01L27/144

CPC classification number: H01L23/552 ,  H01L27/144

Abstract: An integrated circuit structure including a substrate having an upper surface; a gallium nitride layer disposed on the upper surface of the substrate; and a photoconductive semiconductor switch laterally disposed alongside a transistor on the gallium nitride layer integrated into the integrated circuit structure; an EMF shield enclosing the substrate, the gallium nitride layer and the photoconductive semiconductor switch laterally disposed alongside the transistor on the gallium nitride layer integrated into the integrated circuit structure; and a signal line electronically coupled with the photoconductive semiconductor switch, the signal line penetrating the EMF shield.

公开(公告)号：US11146223B2

公开(公告)日：2021-10-12

申请号：US16458902

申请日：2019-07-01

Applicant: Raytheon Company

Inventor： Christopher M. Laighton ,  Susan C. Trulli ,  Elicia K. Harper

IPC: H03F3/21 ,  H03F1/32

Abstract: A power amplifier having: a plurality of N amplifier modules, where N is an integer greater than one; an M:N power splitter having M inputs, where M is an integer less than N, and N outputs, each one of the N outputs being coupled to an input of a corresponding one of the plurality of N power amplifiers; a plurality of M delay lines, each one the M delay lines having an output coupled to a corresponding one of the M inputs of the M:N power splitter, each one of the plurality of M delay lines being coupled to a common input of the power amplifier.

公开(公告)号：US20210259095A1

公开(公告)日：2021-08-19

申请号：US16794487

申请日：2020-02-19

Applicant: Raytheon Company

Inventor： Christopher M. Laighton ,  Susan C. Trulli ,  Elicia K. Harper

IPC: H05K1/02 ,  H01L23/367

Abstract: A radio frequency (RF) energy transmission line transition for coupling RF energy between a pair of RF transmission line sections disposed on intersecting surfaces of a corresponding one of a pair of conductive members, a first one of the pair of conductive members having a wall with a jog therein for receiving an end portion of a second one of the pair of conductive members, the end portion of an electrically conductive strip of the first one of the pair of radio frequency transmission line sections being disposed on, and electrically connected to, an electrically conductive strip of a second one of the pair of radio frequency transmission line sections.

公开(公告)号：US10785863B2

公开(公告)日：2020-09-22

申请号：US15948404

申请日：2018-04-09

Applicant: Raytheon Company

Inventor： Susan C. Trulli ,  Christopher M. Laighton

IPC: H05K1/02 ,  H05K1/18 ,  H01L23/66 ,  H01L23/367 ,  H01L25/065 ,  H01L25/00 ,  H05K3/12 ,  H01L23/538 ,  H01L21/48 ,  H03F3/195 ,  H03F3/21 ,  H03F3/213 ,  H01L25/16 ,  H01L21/56 ,  H05K3/34 ,  H01L25/18 ,  H03F1/30 ,  H01L23/373 ,  H01P3/08 ,  H01P11/00 ,  H01L23/42

Abstract: A MMIC support and cooling structure having a three-dimensional, thermally conductive support structure having a plurality of surfaces and a circuit having a plurality of heat generating electrical components disposed on a first portion of the surfaces and interconnected by microwave transmission lines disposed on a second portion of the plurality of surfaces of the thermally conductive support structure.

公开(公告)号：US20190239340A1

公开(公告)日：2019-08-01

申请号：US15884756

申请日：2018-01-31

Applicant: Raytheon Company

Inventor： Susan C. Trulli ,  Christopher M. Laighton ,  Elicia K. Harper

IPC: H05K1/02 ,  H01R13/719 ,  H05K9/00 ,  G06F1/18

Abstract: An electrically conductive shield for a microwave transmission line-electrical connector interconnect region wherein the microwave transmission line is connected to the electrical connector. An elastic, dielectric material is disposed between opposing surfaces of the dielectric structure and the housing. An electrically conductive material is disposed on an outer surface of the elastic, dielectric material to provide an electrically conductive shield. The electrically conductive shield is disposed over the opposing surfaces of the dielectric structure and the housing.

公开(公告)号：US20160276242A1

公开(公告)日：2016-09-22

申请号：US14664310

申请日：2015-03-20

Applicant: Raytheon Company

Inventor： Susan C. Trulli

IPC: H01L23/34 ,  F28F21/08

CPC classification number: H01L23/34 ,  F28F21/085 ,  F28F21/087 ,  F28F21/089 ,  H01L23/373 ,  H01L23/3731 ,  H01L23/3735

Abstract: A heat spreader provided having: as ceramic substrate; and metallization layer structure disposed on at least one surface of the substrate. The metallization layer structure includes: a thick film layer disposed on the at least one surface of the substrate; a diffusion barrier layer on, and in direct contact with the thick film layer; and as heat conducting layer disposed on, and in direct contact with, the diffusion barrier layer. The diffusion barrier layer inhibits material in the thick film layer and material in the heat conducting layer from diffusing between the thick film layer and the heat conductive layer. The metallization layer structure is disposed on a plurality of sides of the substrate.

Abstract translation: 散热器具有：作为陶瓷基板; 以及设置在所述基板的至少一个表面上的金属化层结构。 金属化层结构包括：设置在基板的至少一个表面上的厚膜层; 在厚膜层上并与之直接接触的扩散阻挡层; 以及作为设置在扩散阻挡层上并与扩散阻挡层直接接触的导热层。 扩散阻挡层抑制厚膜层中的材料和导热层中的材料在厚膜层和导热层之间的扩散。 金属化层结构设置在基板的多个侧面上。