摘要:
A rupture panel of three layers employs a lower layer (e.g. foam) that is adhesive, a middle layer (e.g. metallic) and a hold down layer. The middle layer has a weakened portion (scoring, openings, for example) that defines the panel burst pressure. A part of the lower layer does not connect to the middle layer. That part that does not connect to the middle layer adheres to the hold down layer. The hold down layer can be in the form of a ring with an open center, the weakened portion of the middle layer occupying a position within the open center of the hold down layer.
摘要:
Methods of operating a memory device and memory devices are provided. For example, a method of operating a memory array is provided that includes a synchronous path and an asynchronous path. A Write-with-Autoprecharge signal is provided to the synchronous path, and various bank address signals are provided to the asynchronous path. In another embodiment, the initiation of the bank address signals may be provided asynchronously to the assertion of the Write-with-Autoprecharge signal.
摘要:
A method includes: receiving a burst including payload and a synchronization field, wherein the synchronization field contains a synchronization pattern; selecting, from a plurality of expected synchronization patterns, a target synchronization pattern dependent on an operating mode; comparing the received synchronization pattern against the target synchronization pattern; and if the received synchronization pattern is of the target synchronization pattern, processing the payload; otherwise, discarding the burst.
摘要:
There is provided a method of forming a tablet product. The method comprises closing off a perforation in a perforated plate; directing powder into said closed-off perforation by the sweeping action of a first director blade spaced from said perforated plate; compacting the powder to form a tablet; and transferring the so-formed tablet from the closed-off perforation. The method is characterized by relative rotary motion of the perforated plate and said first director blade. Suitable apparatus is also provided.
摘要:
A micro-electronic bond degradation sensor includes a sensor substrate having sensor circuitry and a sensor stud and a power stud extending therefrom. The sensor circuitry includes a voltage-to-current amplifier having an input coupled to sensor stud and an output coupled to the power stud. The voltage-to-current amplifier is operable to convert a voltage signal occurring along the sensor stud to a current signal output along the power stud.