摘要:
A method of forming an integrated circuit device that includes a plurality of MuGFETs is disclosed. A PMOS fin of a MuGFET is formed on a substrate. The PMOS fin includes a channel of a first surface of a first crystal orientation. A NMOS fin of another MuGFET is formed on the substrate. The NMOS fin includes a channel on the substrate at one of 0° and 90° to the PMOS fin and includes a second surface of a second crystal orientation.
摘要:
The present invention provides a trench isolation structure, a method of manufacture therefor and a method for manufacturing an integrated circuit including the same. The trench isolation structure (130), in one embodiment, includes a trench located within a substrate (110), the trench having a buffer layer (133) located on sidewalls thereof. The trench isolation structure (130) further includes a barrier layer (135) located over the buffer layer (133), and fill material (138) located over the barrier layer (135) and substantially filling the trench.
摘要:
A post-in-crown capacitor is disclosed. The post-in-crown capacitor (60) includes a crown (44) coupled to a conductive via (20). A post (48) is disposed within the crown (44) and a capacitor insulation layer (50) is formed outwardly from the crown (44) and the post (48). A capacitor plate layer (52) is then formed outwardly from the capacitor insulation layer (50).
摘要:
Gas purification resins are encapsulated in deformable, permeable polymer sheaths to form purification rings, gaskets or seals. A primary source of contaminants in advanced vacuum processors equipped with vacuum load-lock systems and process gas purifiers is from the leakage of outside ambient contaminants around O-ring seals. Using gas purification rings, gaskets or seals properly placed inside or outside of the outer O-ring seal, the level of contaminants (particularly hydrocarbons, oxygen and moisture) may be significantly reduced or eliminated. The gas purification ring is preferably a hydrocarbon and/or oxygen and/or moisture absorbing and/or adsorbing material encased within a contaminant permeable casing. The gas purification ring can be round or flattened and is preferably more resilient than the O-rings adjacent thereto which form the seal. An adhesive can be placed around the casing holding the purification resin to prevent movement from its purifying location.