DELIVERY DEVICE FOR DEPOSITION
    31.
    发明申请
    DELIVERY DEVICE FOR DEPOSITION 有权
    递送装置用于沉积

    公开(公告)号:US20120219712A1

    公开(公告)日:2012-08-30

    申请号:US13466507

    申请日:2012-05-08

    IPC分类号: C23C16/455 F15D1/02 B23P11/00

    摘要: A delivery device for thin-film material deposition has at least first, second, and third inlet ports for receiving a common supply for a first, a second and a third gaseous material, respectively. Each of the first, second, and third elongated emissive channels allow gaseous fluid communication with one of corresponding first, second, and third inlet ports. The delivery device can be formed from apertured plates, superposed to define a network of interconnecting supply chambers and directing channels for routing each of the gaseous materials from its corresponding inlet port to a corresponding plurality of elongated emissive channels. The delivery device comprises a diffusing channel formed by a relief pattern between facing plates. Also disclosed is a process for thin film deposition. Finally, more generally, a flow diffuser and a corresponding method of diffusing flow is disclosed.

    摘要翻译: 用于薄膜材料沉积的递送装置具有至少第一,第二和第三入口端口,用于分别接收用于第一,第二和第三气态材料的共同供应。 第一,第二和第三细长发射通道中的每一个允许与对应的第一,第二和第三入口端口之一的气态流体连通。 输送装置可以由孔板形成,叠加以限定互连供应室的网络,并且引导通道,用于将每个气态材料从其对应的入口端口路由到相应的多个细长的发射通道。 输送装置包括由相对板之间的浮雕图案形成的扩散通道。 还公开了一种用于薄膜沉积的方法。 最后,更一般地,公开了一种流扩散器和相应的扩散流的方法。

    FLUID CONVEYANCE SYSTEM INCLUDING FLEXIBLE RETAINING MECHANISM
    32.
    发明申请
    FLUID CONVEYANCE SYSTEM INCLUDING FLEXIBLE RETAINING MECHANISM 审中-公开
    流体输送系统,包括柔性保持机构

    公开(公告)号:US20110097494A1

    公开(公告)日:2011-04-28

    申请号:US12606231

    申请日:2009-10-27

    IPC分类号: C23C16/458 C23C16/00

    摘要: A fluid conveyance system for thin film material deposition includes a fluid distribution manifold and a substrate transport mechanism. The fluid distribution manifold includes an output face that includes a plurality of elongated slots. The output face of the fluid distribution manifold is positioned opposite a first surface of the substrate such that the elongated slots face the first surface of the substrate and are positioned proximate to the first surface of the substrate. The substrate transport mechanism causes a substrate to travel in a direction and includes a flexible mechanism that contacts a second surface of the substrate in a region that is proximate to the output face of the fluid distribution manifold.

    摘要翻译: 用于薄膜材料沉积的流体输送系统包括流体分配歧管和基底输送机构。 流体分配歧管包括包括多个细长槽的输出面。 流体分配歧管的输出面与衬底的第一表面相对定位,使得细长的槽面对衬底的第一表面并且靠近衬底的第一表面定位。 衬底传送机构使衬底沿一个方向行进,并且包括在靠近流体分配歧管的输出面的区域中接触衬底的第二表面的柔性机构。

    FLUID DISTRIBUTION MANIFOLD INCLUDING NON-PARALLEL NON-PERPENDICULAR SLOTS
    33.
    发明申请
    FLUID DISTRIBUTION MANIFOLD INCLUDING NON-PARALLEL NON-PERPENDICULAR SLOTS 审中-公开
    流体分配分配包括非平行非平滑柱

    公开(公告)号:US20110097493A1

    公开(公告)日:2011-04-28

    申请号:US12606223

    申请日:2009-10-27

    IPC分类号: C23C16/458 C23C16/00

    摘要: A fluid conveyance device for thin film material deposition includes a substrate transport mechanism that causes a substrate to travels in a direction. A fluid distribution manifold includes an output face. The output face includes a plurality of elongated slots. At least one of the elongated slots includes a portion that is non-perpendicular and non-parallel relative to the direction of substrate travel.

    摘要翻译: 用于薄膜材料沉积的流体输送装置包括使基板沿一个方向行进的基板输送机构。 流体分配歧管包括输出面。 输出面包括多个细长槽。 细长槽中的至少一个包括相对于衬底移动方向非垂直和非平行的部分。

    DEPOSITION SYSTEM FOR THIN FILM FORMATION
    35.
    发明申请
    DEPOSITION SYSTEM FOR THIN FILM FORMATION 审中-公开
    薄膜形成沉积系统

    公开(公告)号:US20140206137A1

    公开(公告)日:2014-07-24

    申请号:US13747505

    申请日:2013-01-23

    IPC分类号: C23C16/455 H01L21/02

    CPC分类号: C23C16/45551

    摘要: A process for depositing a thin film material on a substrate is disclosed, comprising simultaneously directing a series of gas flows from the output face of a delivery head of a thin film deposition system toward the surface of a substrate, and wherein the series of gas flows comprises at least a first reactive gaseous material, an inert purge gas, and a second reactive gaseous material, wherein the first reactive gaseous material is capable of reacting with a substrate surface treated with the second reactive gaseous material, wherein one or more of the gas flows provides a pressure that at least contributes to the separation of the surface of the substrate from the face of the delivery head. A system capable of carrying out such a process is also disclosed.

    摘要翻译: 公开了一种在衬底上沉积薄膜材料的方法,包括同时引导一系列气体流从薄膜沉积系统的输送头的输出面朝向衬底的表面,并且其中一系列气体流动 包括至少第一反应性气体材料,惰性吹扫气体和第二反应性气体材料,其中第一反应性气体材料能够与用第二反应性气态材料处理的基底表面反应,其中一个或多个气体 流动提供至少有助于将衬底的表面与输送头的表面分离的压力。 还公开了能够进行这种处理的系统。

    Deposition system for thin film formation
    36.
    发明授权
    Deposition system for thin film formation 有权
    薄膜形成沉积系统

    公开(公告)号:US08398770B2

    公开(公告)日:2013-03-19

    申请号:US11861359

    申请日:2007-09-26

    摘要: A process for depositing a thin film material on a substrate is disclosed, comprising simultaneously directing a series of gas flows from the output face of a delivery head of a thin film deposition system toward the surface of a substrate, and wherein the series of gas flows comprises at least a first reactive gaseous material, an inert purge gas, and a second reactive gaseous material, wherein the first reactive gaseous material is capable of reacting with a substrate surface treated with the second reactive gaseous material, wherein one or more of the gas flows provides a pressure that at least contributes to the separation of the surface of the substrate from the face of the delivery head. A system capable of carrying out such a process is also disclosed.

    摘要翻译: 公开了一种在衬底上沉积薄膜材料的方法,包括同时引导一系列气体流从薄膜沉积系统的输送头的输出面朝向衬底的表面,并且其中一系列气体流动 包括至少第一反应性气体材料,惰性吹扫气体和第二反应性气体材料,其中第一反应性气体材料能够与用第二反应性气态材料处理的基底表面反应,其中一个或多个气体 流动提供至少有助于将衬底的表面与输送头的表面分离的压力。 还公开了能够进行这种处理的系统。

    FLUID DISTRIBUTION MANIFOLD INCLUDING COMPLIANT PLATES
    37.
    发明申请
    FLUID DISTRIBUTION MANIFOLD INCLUDING COMPLIANT PLATES 审中-公开
    流体分配管理包括合规板

    公开(公告)号:US20110097490A1

    公开(公告)日:2011-04-28

    申请号:US12606228

    申请日:2009-10-27

    IPC分类号: C23C16/44 C23C16/00 B32B37/00

    摘要: A fluid distribution manifold includes a first plate and a second plate. The first plate includes a length dimension, a width dimension, and a thickness that allows the first plate to be deformable over at least one of the length dimension and the width dimension of the first plate. The second plate includes a length dimension, a width dimension, and a thickness that allows the second plate to be deformable over at least one of the length dimension and the width dimension of the second plate. At least a portion of at least the first plate and the second plate define a relief pattern that defines a fluid flow directing path. The first plate and the second plate are bonded together to form a non-planar shape in a height dimension along at least one of the length dimension and the width dimension.

    摘要翻译: 流体分配歧管包括第一板和第二板。 第一板包括长度尺寸,宽度尺寸和允许第一板可在第一板的长度尺寸和宽度尺寸中的至少一个上变形的厚度。 第二板包括长度尺寸,宽度尺寸和允许第二板在第二板的长度尺寸和宽度尺寸中的至少一个上可变形的厚度。 至少第一板和第二板的至少一部分限定了限定流体流动引导路径的浮雕图案。 第一板和第二板被结合在一起,以沿长度尺寸和宽度尺寸中的至少一个在高度尺寸上形成非平面形状。

    System for thin film deposition utilizing compensating forces
    38.
    发明授权
    System for thin film deposition utilizing compensating forces 有权
    利用补偿力的薄膜沉积系统

    公开(公告)号:US07850780B2

    公开(公告)日:2010-12-14

    申请号:US12464904

    申请日:2009-05-13

    IPC分类号: C23C16/00 C23C16/458

    摘要: A process for depositing a thin film material on a substrate is disclosed, comprising simultaneously directing a series of gas flows from the output face of a delivery head of a thin film deposition system toward the surface of a substrate, and wherein the series of gas flows comprises at least a first reactive gaseous material, an inert purge gas, and a second reactive gaseous material, wherein the first reactive gaseous material is capable of reacting with a substrate surface treated with the second reactive gaseous material. A system capable of carrying out such a process is also disclosed.

    摘要翻译: 公开了一种在衬底上沉积薄膜材料的方法,包括同时引导一系列气体流从薄膜沉积系统的输送头的输出面朝向衬底的表面,并且其中一系列气体流动 包括至少第一反应性气体材料,惰性吹扫气体和第二反应性气态材料,其中第一反应性气体材料能够与用第二反应性气态材料处理的基底表面反应。 还公开了能够进行这种处理的系统。

    System for thin film deposition utilizing compensating forces
    39.
    发明授权
    System for thin film deposition utilizing compensating forces 有权
    利用补偿力的薄膜沉积系统

    公开(公告)号:US07572686B2

    公开(公告)日:2009-08-11

    申请号:US11861372

    申请日:2007-09-26

    摘要: A process for depositing a thin film material on a substrate is disclosed, comprising simultaneously directing a series of gas flows from the output face of a delivery head of a thin film deposition system toward the surface of a substrate, and wherein the series of gas flows comprises at least a first reactive gaseous material, an inert purge gas, and a second reactive gaseous material, wherein the first reactive gaseous material is capable of reacting with a substrate surface treated with the second reactive gaseous material. A system capable of carrying out such a process is also disclosed.

    摘要翻译: 公开了一种在衬底上沉积薄膜材料的方法,包括同时引导一系列气体流从薄膜沉积系统的输送头的输出面朝向衬底的表面,并且其中一系列气体流动 包括至少第一反应性气体材料,惰性吹扫气体和第二反应性气态材料,其中第一反应性气体材料能够与用第二反应性气态材料处理的基底表面反应。 还公开了能够进行这种处理的系统。

    Delivery device for deposition
    40.
    发明授权
    Delivery device for deposition 有权
    用于沉积的输送装置

    公开(公告)号:US08211231B2

    公开(公告)日:2012-07-03

    申请号:US11861402

    申请日:2007-09-26

    摘要: A delivery device for thin-film material deposition has at least first, second, and third inlet ports for receiving a common supply for a first, a second and a third gaseous material, respectively. Each of the first, second, and third elongated emissive channels allow gaseous fluid communication with one of corresponding first, second, and third inlet ports. The delivery device can be formed from apertured plates, superposed to define a network of interconnecting supply chambers and directing channels for routing each of the gaseous materials from its corresponding inlet port to a corresponding plurality of elongated emissive channels. The delivery device comprises a diffusing channel formed by a relief pattern between facing plates. Also disclosed is a process for thin film deposition. Finally, more generally, a flow diffuser and a corresponding method of diffusing flow is disclosed.

    摘要翻译: 用于薄膜材料沉积的递送装置具有至少第一,第二和第三入口端口,用于分别接收用于第一,第二和第三气态材料的共同供应。 第一,第二和第三细长发射通道中的每一个允许与对应的第一,第二和第三入口端口之一的气态流体连通。 输送装置可以由孔板形成,叠加以限定互连供应室的网络,并且引导通道,用于将每个气态材料从其对应的入口端口路由到相应的多个细长的发射通道。 输送装置包括由相对板之间的浮雕图案形成的扩散通道。 还公开了一种用于薄膜沉积的方法。 最后,更一般地,公开了一种流扩散器和相应的扩散流的方法。