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31.发明申请公开(公告)号：US20090197203A1
公开(公告)日：2009-08-06
申请号：US12320410
申请日：2009-01-26
申请人： Atsushi Nagai , Kazutaka Nakayama
发明人： Atsushi Nagai , Kazutaka Nakayama
IPC分类号： G03F7/004
CPC分类号： G03F7/0047 , Y10S430/114 , Y10S430/151
摘要： A photosensitive conductive paste for transferring including a metal powder, an inorganic material powder, a photosensitive resin and a polymerization initiator, and to be applied onto a surface of a transfer support, comprising an acrylic resin or a rosin-based resin.
摘要翻译： 一种用于转印的感光性导电糊剂，其包含金属粉末，无机材料粉末，感光性树脂和聚合引发剂，并且涂布在转印支撑体的表面上，其包含丙烯酸树脂或松香系树脂。
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公开(公告)号：US06946036B2
公开(公告)日：2005-09-20
申请号：US10085753
申请日：2002-02-28
申请人： Toshihito Tsuga , Minoru Fube , Kazutaka Nakayama
发明人： Toshihito Tsuga , Minoru Fube , Kazutaka Nakayama
IPC分类号： B08B3/08 , B08B3/12 , H01L21/00 , H01L21/304 , H01L21/308 , B08B3/00
CPC分类号： H01L21/67057 , B08B3/08 , B08B3/12 , Y10S438/906
摘要： The method for removing particles that adhere to the surface of semiconductor wafers is constituted so as to sequentially carry out a first cleaning process in which semiconductor wafers 100 are cleaned for a prescribed time in cleaning tank 104 containing a first cleaning solution consisting of ozone water, and, after said first cleaning process, a second cleaning process in which said semiconductor wafers 100 are cleaned for a prescribed time in cleaning tank 106 containing a second cleaning solution consisting of hydrogen water.
摘要翻译： 构成除去附着在半导体晶片表面上的颗粒的方法，以便依次进行第一清洗处理，其中半导体晶片100在包含由臭氧水构成的第一清洗溶液的清洗槽104中清洗规定时间， 并且在所述第一清洗处理之后，进行第二清洗处理，其中将所述半导体晶片100在含有由氢水组成的第二清洗溶液的清洗槽106中清洗规定时间。
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公开(公告)号：US4697885A
公开(公告)日：1987-10-06
申请号：US898776
申请日：1986-08-19
IPC分类号： G02F1/1345 , H05K1/00 , H05K1/09 , H05K3/20 , H05K3/24 , H05K3/36 , G02F1/13 , H01B13/10 , H01R4/00
CPC分类号： G02F1/1345 , H05K3/207 , H05K1/0393 , H05K1/095 , H05K2201/0326 , H05K2201/0338 , H05K2203/0156 , H05K2203/0531 , H05K3/245 , H05K3/363 , Y10S359/90
摘要： After the process of manufacturing a cell of a display device, a thick film conductor is bonded onto the terminal portion of a transparent electrode of the display panel by a dry or wet transfer mounting method and a flexible printed circuit board for a driver is soldered on the thick film conductor, such a display device; a process for producing the display device; and a decal for dry or wet transfer mounting method to form a display panel terminal are disclosed.
摘要翻译： 在制造显示装置的单元的过程之后，通过干式或湿式转印安装方法将厚膜导体结合到显示面板的透明电极的端子部分上，并将用于驱动器的柔性印刷电路板焊接在 厚膜导体，这样的显示装置; 一种制造该显示装置的方法; 并且公开了用于形成显示面板端子的干式或湿式传送安装方法的贴花。
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34.发明授权公开(公告)号：US08021821B2
公开(公告)日：2011-09-20
申请号：US12320410
申请日：2009-01-26
申请人： Atsushi Nagai , Kazutaka Nakayama
发明人： Atsushi Nagai , Kazutaka Nakayama
CPC分类号： G03F7/0047 , Y10S430/114 , Y10S430/151
摘要： A photosensitive conductive paste for transferring including a metal powder, an inorganic material powder, a photosensitive resin and a polymerization initiator, and to be applied onto a surface of a transfer support, comprising an acrylic resin or a rosin-based resin.
摘要翻译： 一种用于转印的感光性导电糊剂，其包含金属粉末，无机材料粉末，感光性树脂和聚合引发剂，并且涂布在转印支撑体的表面上，其包含丙烯酸树脂或松香系树脂。
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公开(公告)号：US06973934B2
公开(公告)日：2005-12-13
申请号：US10072073
申请日：2002-02-08
申请人： Toshihito Tsuga , Minoru Fube , Kazutaka Nakayama
发明人： Toshihito Tsuga , Minoru Fube , Kazutaka Nakayama
IPC分类号： H01L21/304 , B08B3/12 , C25F5/00
CPC分类号： B08B3/12 , Y10S438/906
摘要： The purpose of the present invention is to remove minute particles adhered to the surface of semiconductor wafers effectively in the cleaning process of semiconductor wafers. In the final rinsing step using ultra-pure water or hydrogen water and carried out after cleaning of semiconductor wafers with HF solution, ultrasonic waves are irradiated in the cleaning solution after a prescribed time delay (preferably 20-30 sec or more).
摘要翻译： 本发明的目的是在半导体晶片的清洗过程中有效地去除附着在半导体晶片的表面上的微小颗粒。 在使用超纯水或氢水进行的最终漂洗步骤中，在用HF溶液清洗半导体晶片之后进行，在规定的时间延迟（优选20-30秒以上）之后，在清洗液中照射超声波。
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