Abstract:
A magnetic powder includes magnetic metal particles, a first insulating layer disposed on a surface of each magnetic metal particle and containing silicon (Si) and oxygen (O), and a second insulating layer disposed on the first insulating layer and containing phosphorus (P). A coil electronic component includes a body in which a coil part is disposed, and external electrodes connected to the coil part. The body of the coil electronic component contains the magnetic powder.
Abstract:
A coil electronic component includes a substrate; a coil pattern formed on at least one of first and second main surfaces of the substrate; and a body region filling a core region of the coil pattern and having a magnetic material, wherein a part formed at an outermost portion of the coil pattern and a part of the coil pattern closest to the core region have a thickness less than that of internal patterns positioned therebetween.
Abstract:
A coil electronic component includes a substrate; a coil pattern formed on at least one of first and second main surfaces of the substrate; a body region filling at least a core region of the coil pattern and having a magnetic material; and a lead portion forming a portion of an outermost region of the coil pattern and exposed to the outside of the body region. A distance between the lead portion and a portion of the coil pattern which is immediately adjacent to the lead portion and which is disposed between the lead portion and a center of the coil pattern is larger than a distance between adjacent patterns of the coil pattern.
Abstract:
An electronic component includes at least one current path blocking part formed in a surface of a magnetic body in a direction crossing a direction in which terminals of a coil part are exposed. The current path of the fine current flowing on the surface of the magnetic body may be blocked by the current path blocking part, when a high voltage is applied. The current path of the current flowing in the magnetic body may be formed as long as possible, whereby the fine current flowing on the surface of the inductor may be removed or decreased.
Abstract:
An electronic component includes a magnetic body; internal coil parts including coil conductors disposed on one surface and the other surface of a support member; and a spacer part disposed between the internal coil parts, wherein the internal coil parts include: first and second internal coil parts embedded in the magnetic body to be spaced apart from each other by a predetermined distance in a thickness direction of the magnetic body; and third and fourth internal coil parts embedded in the magnetic body to be spaced apart from each other by a predetermined distance in the thickness direction and to be spaced apart from the first and second internal coil parts by a predetermined distance in a length direction of the magnetic body, and the spacer part is disposed between the first and second internal coil parts and the third and fourth internal coil parts.
Abstract:
An electronic component includes a magnetic body and an internal coil structure embedded in the magnetic body. The internal coil structure includes a first coil pattern part and a second coil pattern part formed on the first coil pattern part.An outermost coil pattern portion of the first coil pattern part is thicker than an inner coil pattern portion thereof.
Abstract:
An electronic component includes a body including internal electrodes and a filler containing a metal component, a first insulating layer enclosing the internal electrodes, and a second insulating layer enclosing the first insulating layer.
Abstract:
An electronic component includes a body including internal electrodes; an insulating layer disposed on side surfaces of the body and at least one of an upper surface of the body and a lower surface of the body; and an external electrode disposed on an end surface of the body and connected to the internal electrodes. The external electrode extends to at least one of the upper surface of the body, the lower surface of the body, and the side surfaces of the body, and partially overlaps the insulating layer.
Abstract:
There is provided a chip electronic component including: an insulating substrate; a first internal coil part which is disposed on one surface of the insulating substrate; a second internal coil part which is disposed on the other surface of the insulating substrate opposing one surface of the insulating substrate; a via penetrating through the insulating substrate and connecting the first and second internal coil parts to each other; and first and second via pads disposed on one surface and the other surface of the insulating substrate, respectively, so as to cover the via, wherein when a width of each of a coil pattern of the first and second coil parts is a and a maximum width of each of the first and second via pads is b, 1≦b/a
Abstract translation:提供了一种芯片电子部件,包括:绝缘基板; 第一内部线圈部,其设置在所述绝缘基板的一个表面上; 第二内部线圈部,其设置在与所述绝缘基板的一个面相对的所述绝缘基板的另一个面上; 穿过所述绝缘基板并将所述第一和第二内部线圈部彼此连接的通孔; 以及分别设置在所述绝缘基板的一个表面和另一个表面上以便覆盖所述通孔的第一和第二通孔焊盘,其中当所述第一和第二线圈部件的每个线圈图案的宽度为a且最大值 第一和第二通孔焊盘中的每一个的宽度为b,1&nlE; b / a <2.3。
Abstract:
There is provided a chip electronic component including: a magnetic body including an insulating substrate and having a size thereof in a length direction thereof larger than that in a width direction thereof; and an internal coil part provided on at least one surface of the insulating substrate, wherein a width of the internal coil part measured in the length direction of the magnetic body on the basis of the center of the magnetic body in the width direction thereof is larger than a width of the internal coil part measured in the width direction of the magnetic body on the basis of the center of the magnetic body in the length direction thereof.