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公开(公告)号:US10587032B2
公开(公告)日:2020-03-10
申请号:US15846544
申请日:2017-12-19
发明人: Woosup Lee , Yeonwoo Kim , Jungsik Park , Seunggil Jeon , Juseok Noh , Jaebong Chun , Hyunju Hong
摘要: An electronic device having a housing formed of a conductive material, and an antenna device thereof. The electronic device includes a housing provided with a plurality of housing modules, and a printed circuit board positioned inside the housing, and having an antenna power feeding unit electrically connected to the printed circuited board. The plurality of housing modules may be at least partially formed of a conductive material. At least one of the conductive materials of the plurality of housing modules may be electrically connected to the antenna power feeding unit of the printed circuit board so as to function as an antenna of the electronic device. Various embodiments may be made based on the technical idea of the present disclosure.
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公开(公告)号:US09549103B2
公开(公告)日:2017-01-17
申请号:US14192270
申请日:2014-02-27
发明人: Sangbong Sung , Seunghwan Kim , Joonho Byun , Jaebong Chun
CPC分类号: H04N5/2251 , G03B2217/002 , H01Q1/242 , H01Q5/378 , H01Q5/40 , H01Q9/145 , H01Q9/42 , H01Q13/10 , H01Q21/28
摘要: An antenna for a camera, comprising a camera having a communication module provided therein, a first radiator provided in a predetermined position of a lens barrel of the camera and having a length and a width for receiving a signal from a first wireless communication system, a power feeding line configured to feed a power from the communication module of the camera to the first radiator, and a ground line configured to ground the first radiator.
摘要翻译: 一种用于相机的天线,包括设置在其中的具有通信模块的相机,设置在相机的镜筒的预定位置的第一散热器,并且具有用于接收来自第一无线通信系统的信号的长度和宽度, 馈电线,被配置为将来自所述摄像机的通信模块的电力馈送到所述第一散热器;以及接地线,其被配置为将所述第一辐射体接地。
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公开(公告)号:US09318830B2
公开(公告)日:2016-04-19
申请号:US14152559
申请日:2014-01-10
发明人: Jongchul Choi , Myunggeun Koh , Jaebong Chun , Hyoungwook Yi
IPC分类号: H01R13/193 , H01R13/639 , H04B1/38 , H04M1/02 , G06K7/00 , G06K13/08 , H04B1/3816
CPC分类号: G06K7/0043 , G06K7/0021 , G06K7/0052 , G06K13/085 , H01R13/193 , H01R13/639 , H04B1/3816 , H04M1/026
摘要: A SIM card socket is provided, includes a first contact part having first contact terminals electrically contacting a first SIM card when the first SIM card is received; a second contact part having second contact terminals electrically contacting a second SIM card when the second SIM card is received, wherein the second SIM card has a size different from that of the first SIM card; a first stopper disposed on the second contact part and being movable by a predetermined distance in a lengthwise direction of the second contact part along a surface of the second contact part to support insertion of the first SIM card or insertion of the second SIM card; and a cover covering the first contact part, the second contact part, and the first stopper.
摘要翻译: 提供SIM卡插座,包括第一接触部分,当接收到第一SIM卡时,第一接触端子电接触第一SIM卡; 第二接触部分,当接收到第二SIM卡时,具有与第二SIM卡电接触的第二接触端子,其中第二SIM卡具有与第一SIM卡不同的尺寸; 第一止动件,其设置在所述第二接触部上,并且沿着所述第二接触部的表面在所述第二接触部的长度方向上移动预定距离以支撑所述第一SIM卡的插入或所述第二SIM卡的插入; 以及覆盖所述第一接触部,所述第二接触部和所述第一止挡的盖。
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公开(公告)号:US20140240581A1
公开(公告)日:2014-08-28
申请号:US14192270
申请日:2014-02-27
发明人: Sangbong SUNG , Seunghwan Kim , Joonho Byun , Jaebong Chun
IPC分类号: H04N5/225
CPC分类号: H04N5/2251 , G03B2217/002 , H01Q1/242 , H01Q5/378 , H01Q5/40 , H01Q9/145 , H01Q9/42 , H01Q13/10 , H01Q21/28
摘要: An antenna for a camera, comprising a camera having a communication module provided therein, a first radiator provided in a predetermined position of a lens barrel of the camera and having a length and a width for receiving a signal from a first wireless communication system, a power feeding line configured to feed a power from the communication module of the camera to the first radiator, and a ground line configured to ground the first radiator.
摘要翻译: 一种用于相机的天线,包括设置在其中的具有通信模块的相机,设置在相机的镜筒的预定位置的第一散热器,并且具有用于接收来自第一无线通信系统的信号的长度和宽度, 馈电线,被配置为将来自所述摄像机的通信模块的电力馈送到所述第一散热器;以及接地线,其被配置为将所述第一辐射体接地。
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公开(公告)号:US12132250B2
公开(公告)日:2024-10-29
申请号:US17941218
申请日:2022-09-09
发明人: Gunbae Lim , Yongsang Yun , Seongjin Park , Jaebong Chun
CPC分类号: H01Q1/243 , H01Q9/0407 , H01Q21/08
摘要: Electronic devices including an antenna module and the antenna module are presented. The electronic devices may include a housing, a wireless communication module, a plurality of slits provided in the housing, and an antenna module disposed inside the housing to correspond to the plurality of slits and operatively connected to the wireless communication module. The antenna module may include a printed circuit board, a plurality of conductive patches disposed on a first surface of the printed circuit board, and an RFIC disposed on a second surface of the printed circuit board. The plurality of conductive patches are configured to be disposed in the plurality of slits. As a result, it is possible to secure a space for disposing different electronic components included in the electronic device.
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公开(公告)号:US12081246B2
公开(公告)日:2024-09-03
申请号:US17268753
申请日:2019-09-03
发明人: Jaehyung Kim , Jinkyu Bang , Jaebong Chun
CPC分类号: H04B1/0067 , H01Q1/2283 , H01Q1/243 , H01Q21/20 , H04B1/40 , H04M1/026
摘要: An electronic device may include a first PCB including a non-conductive region and a conductive region operating as a ground, a first wireless communication circuit disposed on the first PCB, and a 5th generation (5G) antenna module disposed adjacent to the first PCB. The 5G antenna module may include at least one second PCB including an antenna array and a conductive layer operating as a ground of the antenna array and a second wireless communication circuit electrically connected to the antenna array. The second PCB may include a first portion and a second portion having a predetermined angle with the first portion. The first portion may be disposed adjacent to the non-conductive region and at least part of the second portion may be disposed adjacent to the conductive region. The first wireless communication circuit may be electrically connected to a first point of the conductive layer included in the first portion and transmitting or receiving a first RF signal in a first frequency band by using the conductive region and at least part of the conductive layer. The second wireless communication circuit may transmit or receive a second RF signal in a second frequency band by using the antenna array. Besides, various embodiments as understood from the specification are also possible.
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公开(公告)号:US12062843B2
公开(公告)日:2024-08-13
申请号:US17821109
申请日:2022-08-19
发明人: Kyungmoon Seol , Hyunsuk Kim , Seongyong An , Hojin Jung , Jaebong Chun , Hochul Hwang
摘要: An electronic device of various embodiments of the present disclosure may include a housing, a cylindrical support member disposed in the housing, a first printed circuit board disposed in the housing, a first antenna disposed in the housing, and a first wireless communication circuit disposed on the first printed circuit board. The housing may include a first surface, a second surface parallel to the first surface, and a side surface surrounding at least one portion of a space between the first surface and the second surface. The side surface may include a first side surface and a second side surface forming an angle with the first side surface at a first edge. The first antenna may be disposed adjacent to at least one portion of the first edge and spaced apart from the cylindrical support member by a predetermined distance. The first wireless communication circuit may be configured to feed power to the first antenna and transmit and receive a signal of a frequency band.
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公开(公告)号:US11949149B2
公开(公告)日:2024-04-02
申请号:US17511910
申请日:2021-10-27
发明人: Seongyong An , Hyeonuk Kang , Jiho Kim , Kyungmoon Seol , Kyihyun Jang , Jaebong Chun
摘要: According to various embodiments, an electronic device includes: a first housing including a first area, a second housing coupled to be slidable in a first direction from the first housing and including a second area overlapping the first area in a slide-in state, an antenna structure disposed in the first housing to overlap the first area when the first housing is viewed from the top, a conductive part disposed in the second area and electromagnetically connected to the antenna structure in the slide-in state, and wireless communication circuitry electrically connected to the antenna structure. The wireless communication circuitry may be configured to transmit and/or receive radio signals in at least one designated frequency band through the antenna structure and the conductive part in the slide-in state.
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公开(公告)号:US11848563B2
公开(公告)日:2023-12-19
申请号:US17043145
申请日:2019-04-02
发明人: Yongyoun Kim , Kyungmoon Seol , Minsung Lee , Jinwoo Jung , Soyoung Lee , Jaebong Chun
IPC分类号: H05K1/02 , H05K1/03 , G06F3/041 , G09F9/00 , G09F9/30 , H02J50/00 , H02J50/10 , H02J50/70 , G06F1/16 , H02J7/02 , H05K5/00 , H05K5/02 , H05K9/00
CPC分类号: H02J50/005 , G06F1/1643 , G06F1/1652 , H02J7/02 , H02J50/10 , H02J50/70 , H05K5/0017 , H05K5/0086 , H05K5/0217 , H05K5/0247 , H05K9/0054 , G06F3/041 , G06F2203/04102
摘要: An electronic device of an embodiment of the present invention may comprise: a first structure comprising a first plate including a first surface and a second surface facing away from the first surface; a second structure comprising a second plate facing the second surface of the first plate, a first sidewall perpendicular to the second plate, a second sidewall perpendicular to the first sidewall and the second plate, and a third sidewall perpendicular to the first sidewall and the second plate and parallel to the second sidewall, wherein the first sidewall includes a conductive portion, and the second plate, the first sidewall, the second sidewall, and the third sidewall together form a trough with one side open to receive at least a portion of the first structure, and the first structure is movable between an open state and a closed state with respect to the second structure in a first direction parallel to the second plate and the second sidewall such that the first structure is located at a first distance from the first sidewall in the closed state and is located at a second distance greater than the first distance from the first sidewall in the open state; a flexible touch screen display layer comprising: a planar portion extending across at least a portion of the first surface and mounted to the first surface; and a bendable portion extending, during the closed state, from the planar portion into a space between the first sidewall and the first structure, wherein when the first structure is moved from the closed state to the open state, at least a portion of the bendable portion forms a substantially planar surface between the planar portion and the first sidewall as viewed from the top of the first plate; a conductive pattern mounted on the second plate between the second surface and the second plate; a first conductive path extending between the conductive portion of the first sidewall and the conductive pattern; a printed circuit board mounted on the first structure; a wireless charging circuit mounted on the printed circuit board; a wireless communication circuit mounted on the printed circuit board; and a flexible conductive path connected between the printed circuit board and the conductive pattern, wherein the flexible conductive path includes a second conductive path electrically connected between the wireless charging circuit and the conductive pattern, and a third conductive path electrically connected between the communication circuit and the first conductive path.
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公开(公告)号:US11502413B2
公开(公告)日:2022-11-15
申请号:US17104441
申请日:2020-11-25
发明人: Seongjin Park , Minhong Do , Kyungrok Lee , Seokwoo Lee , Sukchan Hong , Jaebong Chun , Hyunsuk Choi
摘要: Disclosed is an electronic device including a housing having a front surface, a rear surface, and a side surface partially surrounding a space between the front surface and the rear surface, wherein at least one of the front surface, the rear surface, and the side surface comprises a non-conductive portion, and at least a partial region of the non-conductive portion comprises a first through hole, a component at least partially overlapping the first through hole when the non-conductive portion is viewed from outside the housing, wherein the component is disposed at a position spaced apart from the non-conductive portion by a first distance, and an antenna structure disposed at a position spaced apart from the non-conductive portion by a second distance shorter than the first distance, wherein the antenna structure is configured to radiate radio waves through the non-conductive portion, and comprises at least one second through hole.
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