公开(公告)号：US20210219448A1

公开(公告)日：2021-07-15

申请号：US17216069

申请日：2021-03-29

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Atapol PRAJUCKAMOL ,  Chee Hiong CHEW ,  Yushuang YAO

IPC: H05K5/06 ,  H05K7/20

Abstract: A fin frame baseplate is disclosed. Specific implementations include a baseplate configured to be coupled to a substrate, a fin frame including a base portion coupled to the baseplate, and a plurality of fins extending from the base portion, the plurality of fins protruding from the base portion. The fin frame may include a plurality of openings therethrough.

公开(公告)号：US20190115275A1

公开(公告)日：2019-04-18

申请号：US15783533

申请日：2017-10-13

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Atapol PRAJUCKAMOL ,  CH Chew ,  Yushuang YAO

IPC: H01L23/32 ,  H01L23/13 ,  H01L23/58 ,  H01L23/498 ,  H01L21/48 ,  H01L21/56 ,  H01L23/40 ,  H01L23/04

Abstract: Implementations of semiconductor packages may include: a substrate comprising a first side and a second side and a hole in the substrate. The hole extending from the first side to the second side of the substrate and positioned in a center of the substrate. The semiconductor packages may also include a bushing around the hole to the first side of the substrate. The semiconductor packages may also include a plurality of pin holders arranged and coupled on the substrate. The semiconductor package may also include a molding compound at least partially encapsulating the substrate, encapsulating a side surface of the bushing, and encapsulating a plurality of side surfaces of the plurality of pin holders.

公开(公告)号：US20150189772A1

公开(公告)日：2015-07-02

申请号：US14568188

申请日：2014-12-12

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Atapol PRAJUCKAMOL ,  Chee Hiong CHEW ,  Yushuang YAO

IPC: H05K5/02 ,  H01L23/053 ,  H01L23/40 ,  H01L23/32

CPC classification number: H05K5/0213 ,  H01L23/053 ,  H01L23/40 ,  H01L23/4006 ,  H01L23/4093 ,  H01L2924/0002 ,  H05K5/0221 ,  Y10T29/41 ,  H01L2924/00

Abstract: In one embodiment, a semiconductor package may be formed having a first side and a second side that is substantially opposite to the first side. An embodiment may include forming an attachment clip extending substantially laterally between the first and second sides wherein the attachment clip is positioned near a distal end of the first and second sides. An embodiment may also include forming the attachment clip to have a flexible main portion that can bend away from a plane of the main portion toward a bottom side of the semiconductor package.

Abstract translation: 在一个实施例中，半导体封装可以形成为具有与第一侧基本相反的第一侧和第二侧。 实施例可以包括形成在第一和第二侧面之间基本上横向延伸的附接夹，其中附接夹定位在第一和第二侧的远端附近。 一个实施例还可以包括形成附接夹以具有可弯曲远离主体部分的平面朝向半导体封装的底侧的柔性主要部分。