公开(公告)号：US11244918B2

公开(公告)日：2022-02-08

申请号：US15679666

申请日：2017-08-17

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Sw Wang ,  CH Chew ,  Eiji Kurose ,  How Kiat Liew

IPC: H01L23/00 ,  H01L23/31 ,  H01L21/56

Abstract: Implementations of semiconductor packages may include: a semiconductor die having a first side and a second side; one or more bumps included on the first side of the wafer, the bumps comprising a first layer having a first metal and a second layer including a second metal. The first layer may have a first thickness and the second layer may have a second thickness. The semiconductor package may also have a mold compound encapsulating all the semiconductor die except for a face of the one or more bumps.

公开(公告)号：US20190115275A1

公开(公告)日：2019-04-18

申请号：US15783533

申请日：2017-10-13

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Atapol PRAJUCKAMOL ,  CH Chew ,  Yushuang YAO

IPC: H01L23/32 ,  H01L23/13 ,  H01L23/58 ,  H01L23/498 ,  H01L21/48 ,  H01L21/56 ,  H01L23/40 ,  H01L23/04

Abstract: Implementations of semiconductor packages may include: a substrate comprising a first side and a second side and a hole in the substrate. The hole extending from the first side to the second side of the substrate and positioned in a center of the substrate. The semiconductor packages may also include a bushing around the hole to the first side of the substrate. The semiconductor packages may also include a plurality of pin holders arranged and coupled on the substrate. The semiconductor package may also include a molding compound at least partially encapsulating the substrate, encapsulating a side surface of the bushing, and encapsulating a plurality of side surfaces of the plurality of pin holders.

公开(公告)号：US10319639B2

公开(公告)日：2019-06-11

申请号：US15679664

申请日：2017-08-17

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Shutesh Krishnan ,  Sw Wang ,  CH Chew ,  How Kiat Liew ,  Fui Fui Tan

IPC: H01L21/78 ,  H01L21/00 ,  H01L21/306 ,  H01L23/482

Abstract: Implementations of a method of forming a semiconductor package may include forming a plurality of notches into a first side of a wafer, the first side of the wafer including a plurality of electrical contacts. The method may also include coating the first side of the wafer and an interior of the plurality of notches with a molding compound, grinding a second side of the wafer to thin the wafer to a desired thickness, forming a back metal on a second side of the wafer, exposing the plurality of electrical contacts through grinding a first side of the molding compound, and singulating the wafer at the plurality of notches to form a plurality of semiconductor packages.