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公开(公告)号：US11603311B2
公开(公告)日：2023-03-14
申请号：US17072813
申请日：2020-10-16
Applicant: STMicroelectronics S.r.l.
Inventor： Enri Duqi , Fabrizio Cerini , Lorenzo Baldo
Abstract: A MEMS switch is actuatable by a fluid, and includes a piezoelectric pressure sensor that detects the movement of a fluid generating a negative pressure. The piezoelectric pressure sensor is formed by a chip of semiconductor material having a through cavity and a sensitive membrane, which extends over the through cavity and has a first and a second surface. The piezoelectric pressure sensor is mounted on a face of a board having a through hole so that the through cavity overlies and is in fluid connection with the through hole. The board has a fixing structure, which enables securing in an opening of a partition wall separating a first and a second space from each other. The board is arranged so that the first surface of the sensitive membrane faces the first space, and the second surface of the sensitive membrane faces the second space.
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公开(公告)号：US11079298B2
公开(公告)日：2021-08-03
申请号：US16260723
申请日：2019-01-29
Applicant: STMicroelectronics S.r.l.
Inventor： Enri Duqi , Lorenzo Baldo
Abstract: A MEMS pressure sensor includes a monolithic body of semiconductor material having a first face and a second face and housing a first buried cavity and a second buried cavity, arranged under the first buried cavity and projecting laterally therefrom. A first sensitive region is formed between the first buried cavity and the first face at a first depth, and a second sensitive region is formed between the second buried cavity and the first face at a second depth greater than the first depth. The monolithic body also houses a first piezoresistive sensing element and a second piezoresistive sensing element, integrated in the first and second sensitive regions, respectively.
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公开(公告)号：US10961117B2
公开(公告)日：2021-03-30
申请号：US16431485
申请日：2019-06-04
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Enri Duqi , Lorenzo Baldo , Flavio Francesco Villa , Gabriele Barlocchi
Abstract: A process for manufacturing a microelectromechanical device envisages: providing a wafer of semiconductor material; forming a buried cavity, completely contained within the wafer, and a structural layer formed by a surface portion of the wafer and suspended over the buried cavity; forming first trenches through the structural layer as far as the buried cavity, which define the suspended structure in the structural layer; filling the first trenches and the buried cavity with sacrificial material; forming a closing structure above the structural layer; removing the sacrificial material from the first trenches and from the buried cavity to release the suspended structure, the suspended structure being isolated and buried within the wafer in a buried environment formed by the first trenches and by the buried cavity.
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公开(公告)号：US10906801B2
公开(公告)日：2021-02-02
申请号：US16509367
申请日：2019-07-11
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Enri Duqi , Lorenzo Baldo , Domenico Giusti
Abstract: An integrated device includes: a first die; a second die coupled in a stacked way on the first die along a vertical axis; a coupling region arranged between facing surfaces of the first die and of the second die, which face one another along the vertical axis and lie in a horizontal plane orthogonal to the vertical axis, for mechanical coupling of the first and second dies; electrical-contact elements carried by the facing surfaces of the first and second dies, aligned in pairs along the vertical axis; and conductive regions arranged between the pairs of electrical-contact elements carried by the facing surfaces of the first and second dies, for their electrical coupling. Supporting elements are arranged at the facing surface of at least one of the first and second dies and elastically support respective electrical-contact elements.
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公开(公告)号：US10527511B2
公开(公告)日：2020-01-07
申请号：US16101987
申请日：2018-08-13
Applicant: STMICROELECTRONICS S.r.l.
Inventor： Enri Duqi , Lorenzo Baldo
Abstract: Microelectromechanical transducer comprising a semiconductor body, four cavities buried within the semiconductor body and four membranes, each membrane being suspended over a respective cavity and being capable of being deflected by the action of a pressure external to the microelectromechanical transducer; the microelectromechanical transducer further comprising four transducer elements housed by a respective membrane and electrically coupled to one another in a Wheatstone bridge configuration to convert said external pressure into an electrical signal.
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Patent Agency Ranking
公开(公告)号：US10407301B2
公开(公告)日：2019-09-10
申请号：US15870429
申请日：2018-01-12
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Enri Duqi , Lorenzo Baldo , Roberto Carminati
Abstract: MEMS device, in which a body made of semiconductor material contains a chamber, and a first column inside the chamber. A cap of semiconductor material is attached to the body and forms a first membrane, a first cavity and a first channel. The chamber is closed on the side of the cap. The first membrane, the first cavity, the first channel and the first column form a capacitive pressure sensor structure. The first membrane is arranged between the first cavity and the second face, the first channel extends between the first cavity and the first face or between the first cavity and the second face and the first column extends towards the first membrane and forms, along with the first membrane, plates of a first capacitor element.
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公开(公告)号：US10392245B2
公开(公告)日：2019-08-27
申请号：US15591652
申请日：2017-05-10
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Enri Duqi , Lorenzo Baldo , Domenico Giusti
Abstract: An integrated device includes: a first die; a second die coupled in a stacked way on the first die along a vertical axis; a coupling region arranged between facing surfaces of the first die and of the second die, which face one another along the vertical axis and lie in a horizontal plane orthogonal to the vertical axis, for mechanical coupling of the first and second dies; electrical-contact elements carried by the facing surfaces of the first and second dies, aligned in pairs along the vertical axis; and conductive regions arranged between the pairs of electrical-contact elements carried by the facing surfaces of the first and second dies, for their electrical coupling. Supporting elements are arranged at the facing surface of at least one of the first and second dies and elastically support respective electrical-contact elements.
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公开(公告)号：US10125009B2
公开(公告)日：2018-11-13
申请号：US15636380
申请日：2017-06-28
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Enri Duqi , Mikel Azpeitia Urquia , Lorenzo Baldo
Abstract: Method of manufacturing a transducer module, comprising the steps of: forming, on a substrate, a first MEMS transducer, in particular a gyroscope, and a second MEMS transducer, in particular an accelerometer, having a suspended membrane; forming, on the substrate, a conductive layer and defining the conductive layer in order to provide, simultaneously, at least one conductive strip electrically coupled to the first MEMS transducer and the membrane of the second MEMS transducer.
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39.发明授权公开(公告)号：US10048148B2
公开(公告)日：2018-08-14
申请号：US15276617
申请日：2016-09-26
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Lorenzo Baldo , Sarah Zerbini , Enri Duqi
Abstract: A process for manufacturing a MEMS pressure sensor having a micromechanical structure envisages: providing a wafer having a substrate of semiconductor material and a top surface; forming a buried cavity entirely contained within the substrate and separated from the top surface by a membrane suspended above the buried cavity; forming a fluidic-communication access for fluidic communication of the membrane with an external environment, set at a pressure the value of which has to be determined; forming, suspended above the membrane, a plate region made of conductive material, separated from the membrane by an empty space; and forming electrical-contact elements for electrical connection of the membrane and of the plate region, which are designed to form the plates of a sensing capacitor, the value of capacitance of which is indicative of the value of pressure to be detected. A corresponding MEMS pressure sensor having the micromechanical structure is moreover described.
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公开(公告)号：USRE46671E1
公开(公告)日：2018-01-16
申请号：US14069136
申请日：2013-10-31
Applicant: STMicroelectronics S.r.l.
Inventor： Chantal Combi , Benedetto Vigna , Federico Giovanni Ziglioli , Lorenzo Baldo , Manuela Magugliani , Ernesto Lasalandra , Caterina Riva
CPC classification number: B81B7/0061 , B81B7/02 , B81B2201/0235 , B81B2201/0264 , B81C1/0023 , H01L2224/48091 , H01L2224/73265 , H01L2924/1461 , H01L2924/3025 , H04R1/04 , H04R19/005 , H01L2924/00014 , H01L2924/00
Abstract: A substrate-level assembly having a device substrate of semiconductor material with a top face and housing a first integrated device, including a buried cavity formed within the device substrate, and with a membrane suspended over the buried cavity in the proximity of the top face. A capping substrate is coupled to the device substrate above the top face so as to cover the first integrated device in such a manner that a first empty space is provided above the membrane. Electrical-contact elements electrically connect the integrated device with the outside of the substrate-level assembly. In one embodiment, the device substrate integrates at least a further integrated device provided with a respective membrane, and a further empty space, fluidly isolated from the first empty space, is provided over the respective membrane of the further integrated device.
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