公开(公告)号：US11304337B2

公开(公告)日：2022-04-12

申请号：US17001017

申请日：2020-08-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Haejin Lee ,  Kyungha Koo ,  Min Park ,  Jungje Bang

IPC: H05K7/20 ,  H05K9/00

Abstract: Various embodiments of the present invention relate to an electronic device comprising a shielding structure which is arranged on the periphery of an electronic component, and which has an improved heat-radiating performance. The electronic device comprises: a circuit board; a non-elastic shielding member arranged on one surface of the circuit board, the non-elastic shielding member having a concave portion and an opening formed on a part of the concave portion; a processor contained in the concave portion and arranged on the one surface so as to correspond to the opening; a first heat transfer member arranged to contact the outer surface of the processor in at least a partial area of the opening; an elastic shielding member arranged on the periphery of the opening; and a second heat transfer member arranged to contact the first heat transfer member and the elastic shielding member. The second heat transfer member comprises a metal plate and a heat transfer material having a thermal conductivity higher than 1 W/mK. The heat transfer material may be coupled to the metal plate. The present invention may further comprise various other embodiments.

公开(公告)号：US11047628B2

公开(公告)日：2021-06-29

申请号：US15999729

申请日：2017-02-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Haejin Lee ,  Kyungha Koo ,  Chunghyo Jung ,  Se-Young Jang ,  Jungje Bang ,  Jaeheung Ye ,  Chi-Hyun Cho

IPC: H05K7/20 ,  F28D15/02 ,  G06F1/20 ,  H04M1/02 ,  H05K9/00 ,  H01L23/427

Abstract: An electronic device having an improved heating state is disclosed. The disclosed electronic device can comprise: a housing including a first surface facing a first direction, and a second surface facing a second direction opposite to the first direction; a printed circuit board inserted between the first surface and the second surface; an electronic component disposed on the printed circuit board; a shielding structure mounted on the printed circuit board, and including a conductive structure for at least partially surrounding the electronic device; and a heat pipe including a first end portion and a second end portion, wherein the first end portion is thermally coupled to a portion of the shielding structure, and the first end portion is disposed closer to the shielding structure than the second end portion. Additionally, other examples are possible.

公开(公告)号：US20190064892A1

公开(公告)日：2019-02-28

申请号：US16109176

申请日：2018-08-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Heetae KIM ,  Kuntak Kim ,  Mansu Yang ,  Seungchul Choi ,  Kyungha Koo ,  Soongyu Kwon ,  Soohyun Moon ,  Kyungsoo Seo ,  Myungkee Lee ,  Jihwan Lim ,  Hyuntae Jang ,  Kyejeong Jeong

IPC: G06F1/20

Abstract: A control method by an electronic device is provided. The control method includes monitoring current consumption for each of a plurality of components of the electronic device, predicting a first surface temperature of the electronic device and detecting a location where heat is generated, predicting a second surface temperature by analyzing power consumption of a component corresponding to the location where heat is generated, determining whether the predicted second surface temperature is greater than or equal to a predetermined temperature, setting a target temperature when the predicted second surface temperature is greater than or equal to the predetermined temperature, and controlling the component to reduce the power consumption.