Electronic device having heat collection/diffusion structure

    公开(公告)号:US11047628B2

    公开(公告)日:2021-06-29

    申请号:US15999729

    申请日:2017-02-14

    Abstract: An electronic device having an improved heating state is disclosed. The disclosed electronic device can comprise: a housing including a first surface facing a first direction, and a second surface facing a second direction opposite to the first direction; a printed circuit board inserted between the first surface and the second surface; an electronic component disposed on the printed circuit board; a shielding structure mounted on the printed circuit board, and including a conductive structure for at least partially surrounding the electronic device; and a heat pipe including a first end portion and a second end portion, wherein the first end portion is thermally coupled to a portion of the shielding structure, and the first end portion is disposed closer to the shielding structure than the second end portion. Additionally, other examples are possible.

    Electronic device having heat collection/diffusion structure

    公开(公告)号:US11555657B2

    公开(公告)日:2023-01-17

    申请号:US17375626

    申请日:2021-07-14

    Abstract: An electronic device having an improved heating state is disclosed. The disclosed electronic device can comprise: a housing including a first surface facing a first direction, and a second surface facing a second direction opposite to the first direction; a printed circuit board inserted between the first surface and the second surface; an electronic component disposed on the printed circuit board; a shielding structure mounted on the printed circuit board, and including a conductive structure for at least partially surrounding the electronic device; and a heat pipe including a first end portion and a second end portion, wherein the first end portion is thermally coupled to a portion of the shielding structure, and the first end portion is disposed closer to the shielding structure than the second end portion. Additionally, other examples are possible.

    ELECTRONIC DEVICE INCLUDING COOLING FUNCTION AND CONTROLLING METHOD THEREOF

    公开(公告)号:US20180288898A1

    公开(公告)日:2018-10-04

    申请号:US15938192

    申请日:2018-03-28

    Abstract: According to various embodiments an electronic device may include a first housing comprising a hollow portion configured to receive an external electronic device, and a second housing disposed at an angle defined by a portion coupled with at least part of the hollow portion. The second housing may include a first cover facing at least part of the hollow portion and comprising a plurality of first openings, a second cover received in the first cover and comprising a plurality of second openings, and an electric fan motor disposed in a space between the first cover and the second cover, the electric fan motor configured to discharge at least part of intake air from at least some of the first openings to at least some of the second openings.

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