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公开(公告)号:US11355365B2
公开(公告)日:2022-06-07
申请号:US16761905
申请日:2018-12-03
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Changjoon Lee , Byunghoon Lee , Min Park , Kyungwoon Jang , Jeonggen Yoon , Hyuntae Jang
IPC: H01L21/67 , B65G47/90 , H01L25/075
Abstract: Introduced is a micro-chip gripper comprising: a pin plate of which one surface is coupled to another apparatus; a hole plate of which one surface faces the other surface of the pin plate while being disposed to be spaced apart therefrom by a fixed distance, and which is driven together with the drive of the pin plate, and in which a plurality of holes making a fixed pattern are formed; pins which are inserted into the holes of the hole plate and of which one end part is supported by the pin plate; and an adhesion layer which covers the other surface of the hole plate. Other embodiments are possible.
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公开(公告)号:US11632881B2
公开(公告)日:2023-04-18
申请号:US16952595
申请日:2020-11-19
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Chihwan Jeong , Kyungha Koo , Jihong Kim , Dongku Kang , Kuntak Kim , Yunjeong Park , Kyuhwan Lee , Haejin Lee , Seyoung Jang , Hyuntae Jang
Abstract: The disclosure relates to a wireless charging device including a cooling fan, and the wireless charging device according to an embodiment of the disclosure includes: a housing including a holding portion configured to hold an external electronic device; a first bracket positioned in the holding portion; a conductive coil disposed in the first bracket; a second bracket positioned in the holding portion and including a penetrating hole; a first cooling fan positioned in the penetrating hole; a second cooling fan positioned in the penetrating hole and spaced apart from the first cooling fan; and a partition formed in the penetrating hole to isolate the first cooling fan and the second cooling fan from each other, the penetrating hole being divided into a first area having the first cooling fan disposed therein and a second area having the second cooling fan positioned therein, at least one protrusion having a volute shape formed on at least a portion of the second bracket or at least a portion of the partition, a first opening formed on at least an area of the first bracket to allow air cooled by the first cooling fan and/or the second cooling fan to move to the holding portion, and a second opening formed on at least an area of the holding portion to allow the air transmitted from the first opening to move outside the wireless charging device.
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公开(公告)号:US20220013489A1
公开(公告)日:2022-01-13
申请号:US17368194
申请日:2021-07-06
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Won Choi , Sangkyun Im , Sanghoon Roh , Jihyeon Son , Joowhan Lee , Hyuntae Jang
IPC: H01L23/00 , H01L33/62 , H01L33/60 , H01L25/075
Abstract: A display module and a method for manufacturing thereof are provided. The display module includes a substrate including a pad, a conduction film which is bonded to the substrate including the pad, wherein at least one of a surface of the conduction film and an inner portion of the conduction film is black color treated, and a display device mounted on the pad to which the conduction film is bonded.
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公开(公告)号:US11817414B2
公开(公告)日:2023-11-14
申请号:US17368194
申请日:2021-07-06
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Won Choi , Sangkyun Im , Sanghoon Roh , Jihyeon Son , Joowhan Lee , Hyuntae Jang
IPC: H01L23/00 , H01L33/60 , H01L25/075 , H01L33/62
CPC classification number: H01L24/29 , H01L24/32 , H01L24/83 , H01L25/0753 , H01L33/60 , H01L33/62 , H01L2224/2929 , H01L2224/2957 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29371 , H01L2224/29411 , H01L2224/29439 , H01L2224/29455 , H01L2224/29499 , H01L2224/32227 , H01L2224/8302 , H01L2224/83091 , H01L2224/83099 , H01L2224/83192 , H01L2224/83851 , H01L2924/12041 , H01L2924/20105
Abstract: A display module and a method for manufacturing thereof are provided. The display module includes a substrate including a pad, a conduction film which is bonded to the substrate including the pad, wherein at least one of a surface of the conduction film and an inner portion of the conduction film is black color treated, and a display device mounted on the pad to which the conduction film is bonded.
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公开(公告)号:US11520387B2
公开(公告)日:2022-12-06
申请号:US15734060
申请日:2020-09-25
Applicant: Samsung Electronics Co., Ltd.
Inventor: Kyungha Koo , Kuntak Kim , Hajoong Yun , Seungjoo Lee , Seyoung Jang , Hyuntae Jang
Abstract: An electronic device and method of operating an electronic device are provided. The electronic device includes a temperature measurement unit configured to measure a temperature of each of multiple components of the electronic device, and a controller configured to change, based on a first reference temperature, an operating frequency of the controller to a first operating frequency when a temperature of the controller, measured by the temperature measurement unit, reaches the first reference temperature and change, based on a third reference temperature that is lower than the first reference temperature, the operating frequency of the controller to a second operating frequency when a temperature of at least one component of the multiple components reaches a second reference temperature while the controller operates at the first operating frequency.
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公开(公告)号:US20190064892A1
公开(公告)日:2019-02-28
申请号:US16109176
申请日:2018-08-22
Applicant: Samsung Electronics Co., Ltd.
Inventor: Heetae KIM , Kuntak Kim , Mansu Yang , Seungchul Choi , Kyungha Koo , Soongyu Kwon , Soohyun Moon , Kyungsoo Seo , Myungkee Lee , Jihwan Lim , Hyuntae Jang , Kyejeong Jeong
IPC: G06F1/20
Abstract: A control method by an electronic device is provided. The control method includes monitoring current consumption for each of a plurality of components of the electronic device, predicting a first surface temperature of the electronic device and detecting a location where heat is generated, predicting a second surface temperature by analyzing power consumption of a component corresponding to the location where heat is generated, determining whether the predicted second surface temperature is greater than or equal to a predetermined temperature, setting a target temperature when the predicted second surface temperature is greater than or equal to the predetermined temperature, and controlling the component to reduce the power consumption.
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公开(公告)号:US11709530B2
公开(公告)日:2023-07-25
申请号:US17554389
申请日:2021-12-17
Applicant: Samsung Electronics Co., Ltd.
Inventor: Heetae Kim , Kuntak Kim , Mansu Yang , Seungchul Choi , Kyungha Koo , Soongyu Kwon , Soohyun Moon , Kyungsoo Seo , Myungkee Lee , Jihwan Lim , Hyuntae Jang , Kyejeong Jeong
IPC: G06F1/32 , G06F1/20 , G06F1/3296 , G06F1/324 , G06F1/26
CPC classification number: G06F1/206 , G06F1/324 , G06F1/3296 , G06F1/26
Abstract: A method of an electronic device are provided in which current consumption for one or more components of the electronic device is compared with a predetermined current. A first surface temperature of the electronic device is determined based on the comparison and power consumption of the one or more components. A location is detected where heat corresponding to the first surface temperature is generated. A second surface temperature of the electronic device is obtained based on power consumption of a component disposed in the electronic device corresponding to the location where the heat is generated. A target temperature is set based on the obtained second surface temperature. The component is controlled to reduce the power consumption of the component based on the target temperature.
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公开(公告)号:US11262823B2
公开(公告)日:2022-03-01
申请号:US16109176
申请日:2018-08-22
Applicant: Samsung Electronics Co., Ltd.
Inventor: Heetae Kim , Kuntak Kim , Mansu Yang , Seungchul Choi , Kyungha Koo , Soongyu Kwon , Soohyun Moon , Kyungsoo Seo , Myungkee Lee , Jihwan Lim , Hyuntae Jang , Kyejeong Jeong
IPC: G06F1/20 , G06F1/3296 , G06F1/324 , G06F1/26
Abstract: A control method by an electronic device is provided. The control method includes monitoring current consumption for each of a plurality of components of the electronic device, predicting a first surface temperature of the electronic device and detecting a location where heat is generated, predicting a second surface temperature by analyzing power consumption of a component corresponding to the location where heat is generated, determining whether the predicted second surface temperature is greater than or equal to a predetermined temperature, setting a target temperature when the predicted second surface temperature is greater than or equal to the predetermined temperature, and controlling the component to reduce the power consumption.
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公开(公告)号:US11221655B2
公开(公告)日:2022-01-11
申请号:US16109176
申请日:2018-08-22
Applicant: Samsung Electronics Co., Ltd.
Inventor: Heetae Kim , Kuntak Kim , Mansu Yang , Seungchul Choi , Kyungha Koo , Soongyu Kwon , Soohyun Moon , Kyungsoo Seo , Myungkee Lee , Jihwan Lim , Hyuntae Jang , Kyejeong Jeong
IPC: G06F1/20 , G06F1/3296 , G06F1/324 , G06F1/26
Abstract: A control method by an electronic device is provided. The control method includes monitoring current consumption for each of a plurality of components of the electronic device, predicting a first surface temperature of the electronic device and detecting a location where heat is generated, predicting a second surface temperature by analyzing power consumption of a component corresponding to the location where heat is generated, determining whether the predicted second surface temperature is greater than or equal to a predetermined temperature, setting a target temperature when the predicted second surface temperature is greater than or equal to the predetermined temperature, and controlling the component to reduce the power consumption.
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