公开(公告)号：US20190064892A1

公开(公告)日：2019-02-28

申请号：US16109176

申请日：2018-08-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Heetae KIM ,  Kuntak Kim ,  Mansu Yang ,  Seungchul Choi ,  Kyungha Koo ,  Soongyu Kwon ,  Soohyun Moon ,  Kyungsoo Seo ,  Myungkee Lee ,  Jihwan Lim ,  Hyuntae Jang ,  Kyejeong Jeong

IPC: G06F1/20

Abstract: A control method by an electronic device is provided. The control method includes monitoring current consumption for each of a plurality of components of the electronic device, predicting a first surface temperature of the electronic device and detecting a location where heat is generated, predicting a second surface temperature by analyzing power consumption of a component corresponding to the location where heat is generated, determining whether the predicted second surface temperature is greater than or equal to a predetermined temperature, setting a target temperature when the predicted second surface temperature is greater than or equal to the predetermined temperature, and controlling the component to reduce the power consumption.

公开(公告)号：US11709530B2

公开(公告)日：2023-07-25

申请号：US17554389

申请日：2021-12-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Heetae Kim ,  Kuntak Kim ,  Mansu Yang ,  Seungchul Choi ,  Kyungha Koo ,  Soongyu Kwon ,  Soohyun Moon ,  Kyungsoo Seo ,  Myungkee Lee ,  Jihwan Lim ,  Hyuntae Jang ,  Kyejeong Jeong

IPC: G06F1/32 ,  G06F1/20 ,  G06F1/3296 ,  G06F1/324 ,  G06F1/26

CPC classification number: G06F1/206 ,  G06F1/324 ,  G06F1/3296 ,  G06F1/26

Abstract: A method of an electronic device are provided in which current consumption for one or more components of the electronic device is compared with a predetermined current. A first surface temperature of the electronic device is determined based on the comparison and power consumption of the one or more components. A location is detected where heat corresponding to the first surface temperature is generated. A second surface temperature of the electronic device is obtained based on power consumption of a component disposed in the electronic device corresponding to the location where the heat is generated. A target temperature is set based on the obtained second surface temperature. The component is controlled to reduce the power consumption of the component based on the target temperature.

公开(公告)号：US11262823B2

公开(公告)日：2022-03-01

申请号：US16109176

申请日：2018-08-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Heetae Kim ,  Kuntak Kim ,  Mansu Yang ,  Seungchul Choi ,  Kyungha Koo ,  Soongyu Kwon ,  Soohyun Moon ,  Kyungsoo Seo ,  Myungkee Lee ,  Jihwan Lim ,  Hyuntae Jang ,  Kyejeong Jeong

IPC: G06F1/20 ,  G06F1/3296 ,  G06F1/324 ,  G06F1/26

Abstract: A control method by an electronic device is provided. The control method includes monitoring current consumption for each of a plurality of components of the electronic device, predicting a first surface temperature of the electronic device and detecting a location where heat is generated, predicting a second surface temperature by analyzing power consumption of a component corresponding to the location where heat is generated, determining whether the predicted second surface temperature is greater than or equal to a predetermined temperature, setting a target temperature when the predicted second surface temperature is greater than or equal to the predetermined temperature, and controlling the component to reduce the power consumption.

公开(公告)号：US11221655B2

公开(公告)日：2022-01-11

申请号：US16109176

申请日：2018-08-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Heetae Kim ,  Kuntak Kim ,  Mansu Yang ,  Seungchul Choi ,  Kyungha Koo ,  Soongyu Kwon ,  Soohyun Moon ,  Kyungsoo Seo ,  Myungkee Lee ,  Jihwan Lim ,  Hyuntae Jang ,  Kyejeong Jeong

IPC: G06F1/20 ,  G06F1/3296 ,  G06F1/324 ,  G06F1/26

Abstract: A control method by an electronic device is provided. The control method includes monitoring current consumption for each of a plurality of components of the electronic device, predicting a first surface temperature of the electronic device and detecting a location where heat is generated, predicting a second surface temperature by analyzing power consumption of a component corresponding to the location where heat is generated, determining whether the predicted second surface temperature is greater than or equal to a predetermined temperature, setting a target temperature when the predicted second surface temperature is greater than or equal to the predetermined temperature, and controlling the component to reduce the power consumption.