公开(公告)号：US20190156837A1

公开(公告)日：2019-05-23

申请号：US16134529

申请日：2018-09-18

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION

Inventor： Sangha PARK ,  Namsoo KIM ,  Hyungyong KIM ,  Sungchan KANG ,  Cheheung KIM ,  Yongseop YOON ,  Choongho RHEE ,  Hyeokki HONG

IPC: G10L17/18 ,  G06N3/08 ,  G06N3/04 ,  G10L17/02 ,  G10L17/06

Abstract: Provided are a neural network device and a method of operation thereof. The neural network device for speaker recognition may include: a memory configured to store one or more instructions; and a processor configured to generate a trained second neural network by training a first neural network, for separating a mixed voice signal into individual voice signals by executing the one or more instructions, generate a second neural network by adding at least one layer to the trained first neural network, and generate a trained second neural network by training the second neural network, for separating the mixed voice signal into the individual voice signals and for recognizing a speaker of each of the individual voice signals.

公开(公告)号：US20190122690A1

公开(公告)日：2019-04-25

申请号：US15994171

申请日：2018-05-31

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Cheheung KIM ,  Sungchan KANG ,  Sangha PARK ,  Yongseop YOON ,  Choongho RHEE ,  Hyeokki HONG

IPC: G10L21/0388 ,  G10L21/0232 ,  H03G5/16

Abstract: Sound signal processing apparatuses and methods of operating the same are provided. The sound signal processing apparatus includes: a band separator configured to separate sound signals into frequency bands; an adder configured to add sound signals; and a signal processor that is arranged between the band separator and the adder and comprises a plurality of signal processing blocks. The band separator includes elements for separating the sound signals into frequency bands, and the elements correspond one to one to the signal processing blocks.

公开(公告)号：US20180138886A1

公开(公告)日：2018-05-17

申请号：US15477203

申请日：2017-04-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yongseop YOON ,  Sungchan KANG ,  Cheheung KIM ,  Sangha PARK ,  Choongho RHEE

IPC: H03H9/02 ,  H03H9/17 ,  H01L41/047

CPC classification number: H03H9/02244 ,  G01H1/00 ,  G01H11/08 ,  H01L41/047 ,  H01L41/0477 ,  H01L41/1136 ,  H03H9/17 ,  H03H2009/155

Abstract: A piezoelectric micromechanical resonator includes a supporting beam including a fixed edge that is fixed to a supporting member and a free edge opposite the fixed edge, a piezoelectric sensor including an edge attached to the supporting member, the piezoelectric sensor further including a lower electrode, a piezoelectric unit, and an upper electrode sequentially stacked on a surface of the supporting beam, and a lumped mass provided on the surface of the supporting beam at a side of the supporting beam including the free edge, the upper electrode having a Young's modulus smaller than a Young's modulus of the lower electrode.

公开(公告)号：US20180131347A1

公开(公告)日：2018-05-10

申请号：US15492494

申请日：2017-04-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Choongho RHEE ,  Sungchan KANG ,  Cheheung KIM ,  Sangha PARK ,  Yongseop YOON

IPC: H03H9/24 ,  H03H9/02 ,  H01L41/113 ,  H01L41/083 ,  H01L41/187

CPC classification number: H03H9/2405 ,  H01L41/083 ,  H01L41/1132 ,  H01L41/187 ,  H03H9/02259

Abstract: A multi resonator system is provided including a support substrate and a plurality of multi resonators. Each of the plurality of multi resonators includes a plurality of resonators, and one end of each of the plurality of resonators is fixed to the support substrate. Center frequencies of different ones of the plurality of multi resonators are different from each other, and the plurality of resonators within each individual multi resonator all have a same center frequency.

公开(公告)号：US20250105093A1

公开(公告)日：2025-03-27

申请号：US18616721

申请日：2024-03-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Daehyuk SON ,  Sungchan KANG ,  Dongkyun KIM ,  Hotaik LEE ,  Seogwoo HONG

IPC: H01L23/427

Abstract: A semiconductor device may include: a semiconductor chip may include a heat radiation part; a pressure chamber formed on the heat radiation part, wherein the pressure chamber is configured to contain coolant such that an internal pressure in the pressure chamber increases as the coolant absorbs heat from the heat radiation part, and the coolant is ejected in a first direction away from the heat radiation part as the internal pressure of the pressure chamber increases; and a cooling channel providing a flow path configured such that the coolant ejected from the pressure chamber flows through the flow path and back into the pressure chamber.

公开(公告)号：US20240321680A1

公开(公告)日：2024-09-26

申请号：US18514514

申请日：2023-11-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sungchan KANG ,  Daehyuk Son ,  Seogwoo Hong

IPC: H01L23/427 ,  H01L25/065

CPC classification number: H01L23/427 ,  H01L25/0652 ,  H01L2225/06589

Abstract: A semiconductor device includes: a semiconductor chip; a cooling channel configured to allow a coolant to (i) flow in liquid phase and (ii) absorb heat generated by the semiconductor chip during operation; and a wick structure configured to generate a capillary force for moving the coolant in the liquid phase along a wall surface of the cooling channel. The wick structure includes a suspended wick structure that is disposed apart from the wall surface by a capillary distance.

公开(公告)号：US20240203821A1

公开(公告)日：2024-06-20

申请号：US18202613

申请日：2023-05-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sungchan KANG ,  Daehyuk SON ,  Seogwoo HONG

IPC: H01L23/427 ,  H01L25/065

CPC classification number: H01L23/427 ,  H01L25/0657 ,  H01L24/16

Abstract: A semiconductor device includes a semiconductor chip including a semiconductor integrated circuit, and a cooling channel including at least a first portion that is inside the semiconductor chip, a wall surface including a fine pattern configured to generate a capillary force that causes a liquid coolant to flow in the cooling channel, a liquid channel area in a first area of the cooling channel where the fine pattern is formed and configured to pass the liquid coolant, and a gas channel area in a second area of the cooling channel where the fine pattern is not formed and configured to pass a gaseous coolant.

公开(公告)号：US20230212001A1

公开(公告)日：2023-07-06

申请号：US17941380

申请日：2022-09-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Choongho RHEE ,  Sungchan KANG ,  Cheheung KIM ,  Yongseop YOON

IPC: B81B3/00

CPC classification number: B81B3/0021 ,  B81B2201/0271 ,  B81B2203/0118 ,  B81B2203/0315 ,  B81B2207/05 ,  B81B2207/03

Abstract: Provided is a micro electro-mechanical system (MEMS) sensor including a substrate including a first cavity, a first frame including a second cavity at least partially overlapping the first cavity, at least a portion of the first frame being spaced apart from the substrate, a plurality of resonators, each of the plurality of resonators including a first end connected to the first frame and a second end extending into the second cavity, and a second frame including a first region connected to the first frame and a second region spaced apart from the first frame and connected to the substrate.

公开(公告)号：US20220268624A1

公开(公告)日：2022-08-25

申请号：US17740578

申请日：2022-05-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sungchan KANG ,  Cheheung KIM ,  Choongho RHEE ,  Hyeokki HONG

IPC: G01H3/00

Abstract: Disclosed are a directional acoustic sensor, a method of adjusting directional characteristics using the directional acoustic sensor, and a method of attenuating an acoustic signal in a specific direction using the directional acoustic sensor. The directional acoustic sensor includes a plurality of resonance units arranged to have different directionalities and a signal processor configured to adjust directional characteristics by calculating at least one of a sum of and a difference between outputs of the resonance units. In this state, the signal processor attenuates an acoustic signal in a specific direction by using a plurality of directional characteristics obtained by calculating at least one of the sum of and the difference between the outputs of the resonance units at a certain ratio.

公开(公告)号：US20220240006A1

公开(公告)日：2022-07-28

申请号：US17717968

申请日：2022-04-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Cheheung KIM ,  Sungchan KANG ,  Hyeokki HONG ,  Hyunwook KANG ,  Yongseop YOON ,  Choongho RHEE

IPC: H04R1/32 ,  H04R3/00 ,  H04R17/10

Abstract: A compact directional acoustic sensor having an improved signal-to-noise ratio is disclosed. The disclosed directional acoustic sensor includes a first sensing device configured to generate different output gains based on different input directions of external energy, and configured to generate at least one first output signal having a first polarity based on external energy received from an input direction; a second sensing device configured to generate different output gains based on different input directions of external energy, and configured to generate at least one second output signal having a second polarity, that is different than the first polarity, based on the external energy received from the input direction; and at least one signal processor configured to generate at least one final output signal based on the at least one first output signal and the at least one second output signal.