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1.发明授权公开(公告)号：US09890038B2
公开(公告)日：2018-02-13
申请号：US15049339
申请日：2016-02-22
申请人： Versana Micro Inc
CPC分类号： B81B7/02 , B81B2201/0207 , B81B2201/0214 , B81B2201/0228 , B81B2201/0257 , B81B2201/0264 , B81B2201/0278 , B81B2207/012 , B81B2207/05 , B81B2207/09 , H01L27/14 , H01L27/16 , H01L27/22 , H01L41/1132 , H01L41/1138 , H01L2924/00 , H05K7/02
摘要： A monolithically integrated multi-sensor (MIMS) is disclosed. A MIMs integrated circuit comprises a plurality of sensors. For example, the integrated circuit can comprise three or more sensors where each sensor measures a different parameter. The three or more sensors can share one or more layers to form each sensor structure. In one embodiment, the three or more sensors can comprise MEMs sensor structures. Examples of the sensors that can be formed on a MIMs integrated circuit are an inertial sensor, a pressure sensor, a tactile sensor, a humidity sensor, a temperature sensor, a microphone, a force sensor, a load sensor, a magnetic sensor, a flow sensor, a light sensor, an electric field sensor, an electrical impedance sensor, a galvanic skin response sensor, a chemical sensor, a gas sensor, a liquid sensor, a solids sensor, and a biological sensor.
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2.发明申请公开(公告)号：US20160167954A1
公开(公告)日：2016-06-16
申请号：US15050388
申请日：2016-02-22
申请人： Versana Micro Inc
IPC分类号： B81B7/02
CPC分类号： B81B7/02 , B81B2201/0207 , B81B2201/0214 , B81B2201/0228 , B81B2201/0257 , B81B2201/0264 , B81B2201/0278 , B81B2207/012 , B81B2207/05 , B81B2207/09 , H01L27/14 , H01L27/16 , H01L27/22 , H01L41/1132 , H01L41/1138 , H01L2924/00 , H05K7/02
摘要： A monolithically integrated multi-sensor (MIMS) is disclosed. A MIMs integrated circuit comprises a plurality of sensors. For example, the integrated circuit can comprise three or more sensors where each sensor measures a different parameter. The three or more sensors can share one or more layers to form each sensor structure. In one embodiment, the three or more sensors can comprise MEMs sensor structures. Examples of the sensors that can be formed on a MIMs integrated circuit are an inertial sensor, a pressure sensor, a tactile sensor, a humidity sensor, a temperature sensor, a microphone, a force sensor, a load sensor, a magnetic sensor, a flow sensor, a light sensor, an electric field sensor, an electrical impedance sensor, a galvanic skin response sensor, a chemical sensor, a gas sensor, a liquid sensor, a solids sensor, and a biological sensor.
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公开(公告)号：US20170313579A1
公开(公告)日：2017-11-02
申请号：US15362556
申请日：2016-11-28
CPC分类号： B81B7/02 , B81B7/0061 , B81B2201/0257 , B81B2207/012 , B81B2207/05 , B81B2207/07 , B81B2207/092 , B81B2207/096 , B81C1/0023 , H04R1/04 , H04R1/406 , H04R19/005 , H04R2201/003
摘要： A transducer module, comprising: a supporting substrate, having a first side and a second side; a cap, which extends over the first side of the supporting substrate and defines therewith a first chamber and a second chamber internally isolated from one another; a first transducer in the first chamber; a second transducer in the second chamber; and a control chip, which extends at least partially in the first chamber and/or in the second chamber and is functionally coupled to the first and second transducers for receiving, in use, the signals transduced by the first and second transducers.
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4.发明申请TRANSPORTATION DEVICE HAVING A MONOLITHICALLY INTEGRATED MULTI-SENSOR DEVICE ON A SEMICONDUCTOR SUBSTRATE AND METHOD THEREFOR 有权在半导体基板上具有单一集成多传感器器件的传输器件及其方法公开(公告)号：US20140264659A1
公开(公告)日：2014-09-18
申请号：US14207443
申请日：2014-03-12
IPC分类号： B81B7/02
CPC分类号： B81B7/02 , B81B2201/0207 , B81B2201/0214 , B81B2201/0228 , B81B2201/0257 , B81B2201/0264 , B81B2201/0278 , B81B2207/012 , B81B2207/05 , B81B2207/09 , H01L27/14 , H01L27/16 , H01L27/22 , H01L41/1132 , H01L41/1138 , H01L2924/00 , H05K7/02
摘要： A transportation device is provided having multiple sensors configured to detect and measure different parameters of interest. The transportation device includes at least one monolithic integrated multi-sensor (MIMS) device. The MIMS device comprises at least two sensors of different types formed on a common semiconductor substrate. For example, the MIMS device can comprise an indirect sensor and a direct sensor. The transportation device couples a first parameter to be measured directly to the direct sensor. Conversely, the transportation device can couple a second parameter to be measured to the indirect sensor indirectly. Other sensors can be added to the transportation device by stacking a sensor to the MIMS device or to another substrate coupled to the MIMS device. This supports integrating multiple sensors such as a microphone, an accelerometer, and a temperature sensor to reduce cost, complexity, simplify assembly, while increasing performance.
摘要翻译： 提供了具有多个传感器的运输装置，其被配置为检测和测量不同的感兴趣的参数。 运输装置包括至少一个单片集成多传感器（MIMS）装置。 MIMS器件包括形成在公共半导体衬底上的至少两种不同类型的传感器。 例如，MIMS装置可以包括间接传感器和直接传感器。 运输装置将待测量的第一参数直接耦合到直接传感器。 相反，运输装置可间接地将待测量的第二参数耦合到间接传感器。 可以通过将传感器堆叠到MIMS装置或耦合到MIMS装置的另一基板上而将其它传感器添加到运输装置。 这支持集成多个传感器，如麦克风，加速度计和温度传感器，以降低成本，复杂性，简化组装，同时提高性能。
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公开(公告)号：US20240359968A1
公开(公告)日：2024-10-31
申请号：US18689085
申请日：2022-07-23
发明人： Raj CN Thiagarajan
CPC分类号： B81B3/0021 , B81C1/00182 , H04R19/005 , B81B2203/0127 , B81B2203/04 , B81B2207/05
摘要： The present disclosure provides a Capacitive Micromachined Ultrasound Transducer cell, comprising a membrane (203, 303, 403), a substrate (204, 304, 404), a top electrode (201, 301, 401) in contact with the membrane (203, 303, 403), a bottom electrode (202, 302, 402) in contact with the substrate (204, 304, 404) and a layer (206, 306, 406) of material filled in the Capacitive Micromachined Ultrasound Transducer cell extending from the membrane (203, 303, 403), thereby eliminating a gap.
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6.发明公开公开(公告)号：US20240302169A1
公开(公告)日：2024-09-12
申请号：US18179609
申请日：2023-03-07
发明人： Christopher J. Mauer , Shuang Li , Zhizhen Shen , Jingwei Li
CPC分类号： G01C21/188 , B81B7/02 , G01C21/18 , B81B2201/0235 , B81B2201/0242 , B81B2207/05 , G01C21/166
摘要： An inertial measurement unit (IMU). The IMU includes: a plurality of micro-electromechanical system (MEMS) sensors, each having an output; a memory for storing calibration coefficients separately for each of the plurality of MEMS sensors, blending weights for each of the plurality of MEMS sensors, and data blending instructions for blending the outputs of the plurality of MEMS sensors; and a processor, coupled to the memory and the plurality of MEMS sensors, configured to execute the data blending instructions to apply the calibration coefficients separately to each of the plurality of MEMS sensors and the blending weights to the outputs of the plurality of MEMS sensors to create a blended output for the IMU; wherein the blending weights are calculated based on a plurality of test parameters for the plurality of MEMS sensors using at least one of a harmonic and a geometric mean of the plurality of test parameters.
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公开(公告)号：US20230212001A1
公开(公告)日：2023-07-06
申请号：US17941380
申请日：2022-09-09
发明人： Choongho RHEE , Sungchan KANG , Cheheung KIM , Yongseop YOON
IPC分类号： B81B3/00
CPC分类号： B81B3/0021 , B81B2201/0271 , B81B2203/0118 , B81B2203/0315 , B81B2207/05 , B81B2207/03
摘要： Provided is a micro electro-mechanical system (MEMS) sensor including a substrate including a first cavity, a first frame including a second cavity at least partially overlapping the first cavity, at least a portion of the first frame being spaced apart from the substrate, a plurality of resonators, each of the plurality of resonators including a first end connected to the first frame and a second end extending into the second cavity, and a second frame including a first region connected to the first frame and a second region spaced apart from the first frame and connected to the substrate.
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公开(公告)号：US09862594B2
公开(公告)日：2018-01-09
申请号：US14207461
申请日：2014-03-12
申请人： Versana Micro Inc.
CPC分类号： B81B7/02 , B81B2201/0207 , B81B2201/0214 , B81B2201/0228 , B81B2201/0257 , B81B2201/0264 , B81B2201/0278 , B81B2207/012 , B81B2207/05 , B81B2207/09 , H01L27/14 , H01L27/16 , H01L27/22 , H01L41/1132 , H01L41/1138 , H01L2924/00 , H05K7/02
摘要： A wearable device is provided having multiple sensors configured to detect and measure different parameters of interest. The wearable device includes at least one monolithic integrated multi-sensor (MIMS) device. The MIMS device comprises at least two sensors of different types formed on a common semiconductor substrate. For example, the MIMS device can comprise an indirect sensor and a direct sensor. The wearable device couples a first parameter to be measured directly to the direct sensor. Conversely, the wearable device can couple a second parameter to be measured to the indirect sensor indirectly. Other sensors can be added to the wearable device by stacking a sensor to the MIMS device or to another substrate coupled to the MIMS device.
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9.发明授权Transportation device having a monolithically integrated multi-sensor device on a semiconductor substrate and method therefor 有权在半导体衬底上具有单片集成多传感器装置的运输装置及其方法公开(公告)号：US09327965B2
公开(公告)日：2016-05-03
申请号：US14207443
申请日：2014-03-12
申请人： Versana Micro Inc.
CPC分类号： B81B7/02 , B81B2201/0207 , B81B2201/0214 , B81B2201/0228 , B81B2201/0257 , B81B2201/0264 , B81B2201/0278 , B81B2207/012 , B81B2207/05 , B81B2207/09 , H01L27/14 , H01L27/16 , H01L27/22 , H01L41/1132 , H01L41/1138 , H01L2924/00 , H05K7/02
摘要： A transportation device is provided having multiple sensors configured to detect and measure different parameters of interest. The transportation device includes at least one monolithic integrated multi-sensor (MIMS) device. The MIMS device comprises at least two sensors of different types formed on a common semiconductor substrate. For example, the MIMS device can comprise an indirect sensor and a direct sensor. The transportation device couples a first parameter to be measured directly to the direct sensor. Conversely, the transportation device can couple a second parameter to be measured to the indirect sensor indirectly. Other sensors can be added to the transportation device by stacking a sensor to the MIMS device or to another substrate coupled to the MIMS device. This supports integrating multiple sensors such as a microphone, an accelerometer, and a temperature sensor to reduce cost, complexity, simplify assembly, while increasing performance.
摘要翻译： 提供了具有多个传感器的运输装置，其被配置为检测和测量不同的感兴趣的参数。 运输装置包括至少一个单片集成多传感器（MIMS）装置。 MIMS器件包括形成在公共半导体衬底上的至少两种不同类型的传感器。 例如，MIMS装置可以包括间接传感器和直接传感器。 运输装置将待测量的第一参数直接耦合到直接传感器。 相反，运输装置可间接地将待测量的第二参数耦合到间接传感器。 可以通过将传感器堆叠到MIMS装置或耦合到MIMS装置的另一基板上而将其它传感器添加到运输装置。 这支持集成多个传感器，如麦克风，加速度计和温度传感器，以降低成本，复杂性，简化组装，同时提高性能。
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10.发明申请MONOLITHICALLY INTEGRATED MULTI-SENSOR DEVICE ON A SEMICONDUCTOR SUBSTRATE AND METHOD THEREFOR 有权半导体基板上的单片集成多传感器器件及其方法公开(公告)号：US20140264657A1
公开(公告)日：2014-09-18
申请号：US14207419
申请日：2014-03-12
CPC分类号： B81B7/02 , B81B2201/0207 , B81B2201/0214 , B81B2201/0228 , B81B2201/0257 , B81B2201/0264 , B81B2201/0278 , B81B2207/012 , B81B2207/05 , B81B2207/09 , H01L27/14 , H01L27/16 , H01L27/22 , H01L41/1132 , H01L41/1138 , H01L2924/00 , H05K7/02
摘要： An integrated circuit having an indirect sensor and a direct sensor formed on a common semiconductor substrate is disclosed. The direct sensor requires the parameter being measured to be directly applied to the direct sensor. Conversely, the indirect sensor can have the parameter being measured to be indirectly applied to the indirect sensor. The parameter being measured by the direct sensor is different than the parameter being measured by the indirect sensor. In other words, the direct sensor and indirect sensor are of different types. An example of a direct sensor is a pressure sensor. The pressure being measured by the pressure sensor must be applied to the pressure sensor. An example of an indirect sensor is an accelerometer. The rate of change of velocity does not have to be applied directly to the accelerometer. In one embodiment, the direct and indirect sensors are formed using photolithographic techniques.
摘要翻译： 公开了一种具有间接传感器和形成在公共半导体衬底上的直接传感器的集成电路。 直接传感器需要测量的参数直接应用于直接传感器。 相反，间接传感器可以将被测量的参数间接地应用于间接传感器。 由直接传感器测量的参数与由间接传感器测量的参数不同。 换句话说，直接传感器和间接传感器是不同的类型。 直接传感器的一个例子是压力传感器。 由压力传感器测量的压力必须应用于压力传感器。 间接传感器的一个例子是加速度计。 速度变化率不必直接应用于加速度计。 在一个实施例中，使用光刻技术形成直接和间接传感器。
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