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公开(公告)号：US20230063019A1
公开(公告)日：2023-03-02
申请号：US17455148
申请日：2021-11-16
Applicant: Shanghai Tianma Micro-Electronics Co., Ltd.
Inventor： Kaidi ZHANG , Baiquan LIN , Wei LI , Yunfei BAI , Kerui XI , Feng QIN
Abstract: A driving circuit, a driving method and a microfluidic substrate are provided. The driving circuit includes a first switching unit, a second switching unit, a reset unit, a first capacitor, and a second capacitor. In a first stage of a driving process of the driving circuit, the first switching unit is turned on, a first voltage signal is transmitted to a first node, the second switching unit is turned on, a second voltage signal is input to an output terminal of the driving circuit, and the driving circuit outputs an AC signal. In a second stage of the driving process, the first switching unit is turned off, the valid signal output by the second scan signal terminal controls the reset unit to be turned on, a third voltage signal is input to the output terminal of the driving circuit for reset, and the driving circuit outputs a DC signal.
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公开(公告)号：US20210351042A1
公开(公告)日：2021-11-11
申请号：US16913020
申请日：2020-06-26
Inventor： Xuhui PENG , Kerui XI , Tingting CUI , Feng QIN , Jie ZHANG
IPC: H01L21/48 , H01L23/498 , H01L23/00 , H01L21/56
Abstract: A semiconductor package and a method of forming the semiconductor package are provided. The method includes providing a first substrate, forming a wiring structure containing at least two first wiring layers, disposing a first insulating layer between adjacent two first wiring layers, and patterning the first insulating layer to form a plurality of first through-holes. The adjacent two first wiring layers are electrically connected to each other through the plurality of first through-holes. The method also includes providing at least one semiconductor element each including a plurality of pins. In addition, the method includes disposing the plurality of pins of the each semiconductor element on a side of the wiring structure away from the first substrate. Further, the method includes encapsulating the at least one semiconductor element, and placing a ball on a side of the wiring structure away from the at least one semiconductor element.
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33.发明申请公开(公告)号：US20210334494A1
公开(公告)日：2021-10-28
申请号：US16910840
申请日：2020-06-24
Inventor： Kerui XI , Tingting CUI , Feng QIN , Xuhui PENG , Linzhi WANG
Abstract: Fingerprint recognition circuit, fingerprint recognition structure, fingerprint recognition device, display panel, and display device are provided. The circuit includes: a fingerprint recognition driving transistor; a first capacitor; a driving signal input terminal; and a sensing signal output terminal. The first capacitor has a terminal electrically connected to a gate of the fingerprint recognition driving transistor and another terminal electrically connected to a ground. The driving signal input terminal is electrically connected to an input terminal of the fingerprint recognition driving transistor. An output terminal of the fingerprint recognition driving transistor is electrically connected to the sensing signal output terminal.
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公开(公告)号：US20200306750A1
公开(公告)日：2020-10-01
申请号：US16438796
申请日：2019-06-12
Applicant: Shanghai Tianma Micro-Electronics Co.,Ltd.
Inventor： Baiquan LIN , Kerui XI , Junting OUYANG , Jinyu LI , Xiaohe LI
Abstract: An electrowetting panel includes a base substrate; an electrode array layer, including a plurality of electrodes arranged into an array; an insulating hydrophobic layer; a microfluidic channel layer located on the base substrate. Each electrode of the plurality of electrodes is connected to a driving circuit, and a droplet can move along a first direction by applying an electric voltage on each electrode. The insulating hydrophobic layer is located on the electrode array layer, and the microfluidic channel layer is located on the insulating hydrophobic layer. The electrodes includes a plurality of driving electrodes and a plurality of detecting electrodes. Along the first direction, a number N of the driving electrodes is located between every two adjacent detecting electrodes, where N is a natural number. The electrowetting panel also includes a detecting chip electrically connected to the detecting electrodes.
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公开(公告)号：US20250085253A1
公开(公告)日：2025-03-13
申请号：US18613167
申请日：2024-03-22
Applicant: Shanghai Tianma Micro-electronics Co., Ltd.
Inventor： Yukun HUANG , Shun GONG , Haotian LU , Linzhi WANG , Kaidi ZHANG , Baiquan LIN , Kerui XI , Feng QIN
IPC: G01N27/414 , B01L3/00
Abstract: A micro-fluidic detection device includes a first base plate, a second base plate opposite to the first base plate, and a droplet travel layer located between the first and second base plates. The first base plate includes a first substrate, a drive array layer, a first electrode layer, and a first hydrophobic layer. The second base plate includes a second substrate, a second electrode layer, and a second hydrophobic layer. Drive electrodes of the first electrode layer are at first units. The first unit includes a micro-fluidic unit circuit. A second unit includes a detection unit circuit. The detection unit circuit includes inorganic transistors and organic transistors. A sensitive electrode is at the second unit. The sensitive electrode is on a side of a layer where the inorganic transistor is located away from the first substrate. A first hollow hole of the first base plate exposes the sensitive electrode.
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Patent Agency Ranking
公开(公告)号：US20240213687A1
公开(公告)日：2024-06-27
申请号：US18122455
申请日：2023-03-16
Applicant: Shanghai Tianma Micro-electronics Co., Ltd.
Inventor： Yifan XING , Zhenyu JIA , Xiaonan HAN , Baiquan LIN , Kerui XI , Jiayin TANG , Qiongqin MAO , Yifan BAO , Zuocai YANG , Qinyi DUAN , Aowen LI
CPC classification number: H01Q21/0087 , H01Q1/38
Abstract: An antenna and its fabrication method, and a display device are provided. The antenna includes a substrate, a radiation electrode, a first dummy electrode, and a feed line. The radiation electrode, the first dummy electrode, and the feed line are disposed on the substrate. The feed line is coupled and connected to the radiation electrode. The first dummy electrode and the radiation electrode are adjacent but not connected to each other. Along a first direction, an orthographic projection of the radiation electrode to a plane where the substrate is located is a first projection, and an orthographic projection of the first dummy electrode to the plane where the substrate is located is a second projection. There is a first interval between the first projection and the second projection; and the first direction is perpendicular to the plane where the substrate is located.
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公开(公告)号：US20240165616A1
公开(公告)日：2024-05-23
申请号：US17758359
申请日：2021-06-30
Applicant: Shanghai Tianma Micro-Electronics Co., Ltd.
Inventor： Baiquan LIN , Kerui XI , Yunfei BAI , Wei LI , Dengming LEI , Zhen LIU , Zhenyu JIA , Junting OUYANG
IPC: B01L3/00
CPC classification number: B01L3/50273 , B01L2200/10 , B01L2300/0645 , B01L2400/0427
Abstract: Provided is a microfluidic chip. The microfluidic chip includes a first substrate and a second substrate disposed opposite to each other and drive electrodes, first sensing electrodes and second sensing electrodes disposed on a side of the first substrate. A microfluidic channel is formed between the first substrate and the second substrate and configured to accommodate at least one droplet. Different drive voltage signals are applied to adjacent drive electrodes, so as to drive the at least one droplet to move. Detection signals are applied to the first sensing electrodes and the second sensing electrodes, and a position of the at least one droplet is determined according to a change in capacitance between one first sensing electrode and an electrode corresponding thereto and a change in capacitance between one second sensing electrode and an electrode corresponding thereto when the at least one droplet flows by.
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公开(公告)号：US20240165610A1
公开(公告)日：2024-05-23
申请号：US17758357
申请日：2021-07-19
Applicant: Shanghai Tianma Micro-Electronics Co., Ltd.
Inventor： Baiquan LIN , Kerui XI , Ping SU , Linzhi WANG , Yian ZHOU , Feng QIN , Junting OUYANG
IPC: B01L3/00
CPC classification number: B01L3/502715 , B01L2300/0645 , B01L2400/0427
Abstract: Provided is a microfluidic chip. The microfluidic chip includes a first substrate and a second substrate disposed opposite to each other, a microfluidic channel formed between the first substrate and the second substrate and configured to accommodate at least one droplet, drive electrodes arranged in an array and sensing electrodes disposed on a side of the first substrate. Each sensing electrode includes at least one first branch electrode and at least one second branch electrode. The first branch electrode extends along a first direction, and the second branch electrode extends along a second direction. Different drive voltage signals are applied to adjacent drive electrodes to drive the droplet to move. Detection signals are applied to the sensing electrodes, and a position of the droplet is determined according to a change in capacitance between one sensing electrode and an electrode corresponding thereto when the droplet flows by.
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公开(公告)号：US20230213474A1
公开(公告)日：2023-07-06
申请号：US17682979
申请日：2022-02-28
Applicant: Shanghai Tianma Micro-Electronics Co., Ltd.
Inventor： Kaidi ZHANG , Baiquan LIN , Huihui JIANG , Luning YANG , Wei LI , Yunfei BAI , Zhenyu JIA , Kerui XI , Feng QIN
IPC: G01N27/414 , G01N27/333 , H01L21/768
CPC classification number: G01N27/414 , G01N27/333 , H01L21/76829
Abstract: A detection device and a detection method are provided. The detection device includes at least one detection unit. The detection unit includes a first transistor, a second transistor, a third transistor and a fourth transistor that are electrically connected to each other, a gate is disposed above a channel of each of the first transistor, the second transistor, and the third transistor, and an ion-sensitive membrane is covered above a channel of the fourth transistor. The detection device also includes a first voltage signal terminal, a second voltage signal terminal, and a third voltage signal terminal. Further, the detection device includes a first power supply terminal, a first potential output terminal, a second potential output terminal, and a second power supply terminal.
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公开(公告)号：US20230137800A1
公开(公告)日：2023-05-04
申请号：US18090918
申请日：2022-12-29
Inventor： Xuhui PENG , Kerui XI , Tingting CUI , Feng QIN , Jie ZHANG
IPC: H01L21/48 , H01L21/56 , H01L23/498 , H01L23/00
Abstract: A semiconductor package includes a semiconductor element, a wiring structure, an encapsulation structure, and a solder ball. The semiconductor element includes a plurality of pins. A side of the wiring structure is electrically connected to the plurality of pins of the semiconductor element. The wiring structure includes at least two first wiring layers. A first insulating layer is disposed between adjacent two first wiring layers of the at least two first wiring layers. The first insulating layer includes a plurality of first through-holes. The adjacent two first wiring layers are electrically connected to each other through the plurality of first through-holes. The encapsulation structure at least partially surrounds the semiconductor element. The solder ball is located on a side of the wiring structure away from the semiconductor element. The solder ball is electrically connected to the at least two first wiring layers.
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