LED lamp
    33.
    发明授权
    LED lamp 有权
    点灯

    公开(公告)号:US08405307B2

    公开(公告)日:2013-03-26

    申请号:US12836219

    申请日:2010-07-14

    IPC分类号: H05B33/00

    摘要: An LED lamp 100 includes: an LED chip 10; a phosphor resin portion 12 that covers the LED chip 10; and a light-transmissive member 20 that covers the phosphor resin portion 12. The phosphor resin portion 12 includes: a phosphor for converting the emission of the LED chip 10 into light that has a longer wavelength than the emission; and a resin in which the phosphor is dispersed. The surface of the light-transmissive member 20 includes an upper surface portion 22 located over the LED chip 10 and a side surface portion 24 located around and below the upper surface portion 22. At least a part (low-transmittance part 26) of the side surface portion 24 of the light-transmissive member 20 has lower transmittance than the upper surface portion 22.

    摘要翻译: LED灯100包括:LED芯片10; 覆盖LED芯片10的荧光体树脂部12; 以及覆盖荧光体树脂部分12的透光构件20.荧光体树脂部分12包括:用于将LED芯片10的发射转换成具有比发射更长波长的光的荧光体; 和分散有荧光体的树脂。 透光构件20的表面包括位于LED芯片10上的上表面部分22和位于上表面部分22周围和下方的侧表面部分24.至少一部分(低透射率部分26) 透光性部件20的侧面部24的透过率比上表面部22低。

    Power semiconductor module
    35.
    发明申请
    Power semiconductor module 有权
    功率半导体模块

    公开(公告)号:US20120001227A1

    公开(公告)日:2012-01-05

    申请号:US13067607

    申请日:2011-06-14

    IPC分类号: H01L29/739

    摘要: A power semiconductor module includes a plurality of sets of semiconductor switching elements, a molded resin casing containing the semiconductor switching elements, screw holders for receiving mounting screws formed at bottom regions of four corners of the molded resin casing, first terminal blocks having main circuit terminals, and arranged on a central region of a top surface of the molded resin casing, and second terminal blocks having control terminals arranged at a side edge of the molded resin casing apart. Insulating separation walls having a configuration of a rib erect from a surface of the second terminal blocks, and are interposed between groups of the control terminals corresponding to the sets of semiconductor switching elements, and between the screw holder including the mounting screw therein on the molded resin casing and the control terminal at a high voltage side adjacent to the screw holder.

    摘要翻译: 功率半导体模块包括多组半导体开关元件,包含半导体开关元件的模制树脂外壳,用于接收形成在模制树脂外壳的四个角的底部区域的安装螺钉的螺钉保持器,具有主电路端子 并且配置在模制树脂壳体的顶表面的中心区域上,并且具有布置在模制树脂壳体的侧边缘处的控制端子的第二端子块分开。 绝缘隔离壁具有从第二端子块的表面直立的肋的构造,并且插入到对应于该组半导体开关元件的控制端子的组之间,并且在包括其中的安装螺钉的螺钉保持器之间插入模制 树脂壳体和控制端子在与螺钉保持器相邻的高压侧。

    Process for Producing O-Methyl-N-Nitroisourea
    37.
    发明申请
    Process for Producing O-Methyl-N-Nitroisourea 失效
    生产O-甲基-N-硝基异脲的方法

    公开(公告)号:US20090036711A1

    公开(公告)日:2009-02-05

    申请号:US12278498

    申请日:2007-02-07

    IPC分类号: C07C273/18

    摘要: Disclosed is an industrially advantageous process for producing O-methyl-N-nitroisourea. Disclosed is a process for obtaining O-methyl-N-nitroisourea represented by the following chemical formula (1) or a salt thereof in a high yield by performing the nitration of O-methylisourea represented by the following chemical formula (2) or a salt thereof with nitrating agents in the presence of fuming sulfuric acid.

    摘要翻译: 公开了用于生产O-甲基-N-硝基异脲的工业上有利的方法。 公开了以下化学式(1)表示的O-甲基-N-硝基异脲或以下列化学式(2)表示的O-甲基异脲的硝化作用,以高收率获得的O-甲基-N-硝基异脲或其盐 在硝酸化剂存在发烟硫酸的情况下。

    LED lamp and method for manufacturing the same
    38.
    发明授权
    LED lamp and method for manufacturing the same 有权
    LED灯及其制造方法

    公开(公告)号:US07397177B2

    公开(公告)日:2008-07-08

    申请号:US10932417

    申请日:2004-09-02

    IPC分类号: H01J1/62

    CPC分类号: H01L33/505 H01L33/54

    摘要: An LED lamp includes at least one LED chip mounted on the principal surface of a substrate and an optical wavelength converting portion, which includes a phosphor for converting the emission of the LED chip into light having a longer wavelength than that of the emission and which covers at least a portion of the LED chip. The side surface of the optical wavelength converting portion has at least one concave curved surface portion.

    摘要翻译: LED灯包括安装在基板的主表面上的至少一个LED芯片和光波长转换部分,其包括用于将LED芯片的发射转换成具有比发光的波长更长的波长的光的荧光体, 至少一部分LED芯片。 光波长转换部分的侧表面具有至少一个凹曲面部分。