Resist material and pattern formation method
    33.
    发明申请
    Resist material and pattern formation method 失效
    抗蚀材料和图案形成方法

    公开(公告)号:US20050266338A1

    公开(公告)日:2005-12-01

    申请号:US11128441

    申请日:2005-05-13

    IPC分类号: G03F7/004 G03F7/039 G03C1/492

    摘要: A resist material includes a base polymer containing a compound having a unit represented by a general formula of the following Chemical Formula 1: wherein R1, R2 and R3 are the same or different and are a hydrogen atom, a fluorine atom, a straight-chain alkyl group, a branched or cyclic alkyl group or a fluoridated alkyl group with a carbon number not less than 1 and not more than 20; R4 is a straight-chain alkylene group or a branched or cyclic alkylene group with a carbon number not less than 0 and not more than 20; R5 is a hydrogen atom, a straight-chain alkyl group, a branched or cyclic alkyl group or a fluoridated alkyl group with a carbon number not less than 1 and not more than 20, or a protecting group released by an acid; and R6 is a group having a cyclic ester compound, a group having an alicyclic compound including a hydroxyl group or a group having a compound including hexafluoroisopropyl alcohol.

    摘要翻译: 抗蚀剂材料包括含有具有由以下化学式1的通式表示的单元的化合物的基础聚合物:其中R 1,R 2和R 2, 3个相同或不同,为氢原子,氟原子,直链烷基,支链或环状烷基或碳数不小于1且不大于1的氟化烷基 20; R 4是直链亚烷基或碳数不小于0且不大于20的支链或环状亚烷基; R 5是氢原子,直链烷基,支链或环状烷基或碳数不少于1的氟化烷基或保护基 由酸释放; R 6是具有环状酯化合物的基团,具有羟基的脂环式化合物的基团或具有包含六氟异丙醇的化合物的基团。

    Pattern formation method
    39.
    发明授权
    Pattern formation method 有权
    图案形成方法

    公开(公告)号:US06521393B1

    公开(公告)日:2003-02-18

    申请号:US09515334

    申请日:2000-02-29

    IPC分类号: G03F730

    摘要: A resist film is formed by applying, on a semiconductor substrate, a chemically amplified resist including an acid generator of an onium salt having a halogen atom both in the cation and the anion thereof. The resist film is irradiated with a F2 laser beam with a wavelength of a 157 nm band or an Ar2 laser beam with a wavelength of a 126 nm band for pattern exposure, and the resist film is developed after the pattern exposure, thereby forming a resist pattern.

    摘要翻译: 通过在半导体衬底上施加化学放大抗蚀剂,形成抗蚀剂膜,该抗蚀剂包括在其阳离子和阴离子中具有卤原子的鎓盐的酸产生剂。 用波长为157nm波长的F2激光束或波长为126nm波长的Ar2激光束照射抗蚀剂膜用于图案曝光,并且在图案曝光之后使抗蚀剂膜显影,从而形成抗蚀剂 模式。