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97 条记录 (耗时 0.036 秒)

    Sheet feeding device and image-forming apparatus
    31.
    发明授权
    Sheet feeding device and image-forming apparatus 有权
    送纸装置和成像装置

    公开(公告)号：US08074978B2

    公开(公告)日：2011-12-13

    申请号：US12403753

    申请日：2009-03-13

    申请人： Takayuki Takahashi

    发明人： Takayuki Takahashi

    IPC分类号： B65H3/14

    CPC分类号： B65H3/128 ,  B65H3/48 ,  B65H2220/09 ,  B65H2406/122 ,  B65H2406/36625 ,  B65H2406/40 ,  B65H2701/1315

    摘要： An image-forming apparatus and sheet feeding device capable of feeding sheets without skewing or multi-feeding of sheets using a small number of side air blowing drive sources. The sheet feeding device has a plurality of side discharge nozzles comprising side discharge outlets for blowing air onto the respective side edge surfaces of a paper stack, and two sirocco fans which are communicatively connected in series as a side air blowing drive source, and are communicatively connected, via a side discharge drive source chamber and a side discharge relay tube (duct), to the plurality of side discharge nozzles. The respective side discharge nozzles capable of moving in linkage with side fences, and an immovable fixed side discharge nozzle are disposed at different distances from the leading edge of the loaded and set paper stack with respect to a sheet feeding direction.

    摘要翻译： 一种图像形成装置和片材进给装置，其能够使用少量的侧吹风驱动源来进给片材而不会偏斜或多次进给片材。 片材进给装置具有多个侧排出喷嘴，其包括用于将空气吹送到纸叠的各个侧边缘的侧排出口，以及作为侧吹风驱动源串联连接的两个西洛克风扇，并且通信 通过侧排出驱动源室和侧排放中继管（管道）连接到多个侧排出喷嘴。 能够与侧栅栏连动移动的各个侧排出喷嘴和不可移动的固定侧排出喷嘴相对于纸张供给方向设置在与装载纸张堆叠的前缘不同的距离处。

    Metal/ceramic bonding substrate and method for producing same
    33.
    发明授权
    Metal/ceramic bonding substrate and method for producing same 有权
    金属/陶瓷接合基材及其制造方法

    公开(公告)号：US07189449B2

    公开(公告)日：2007-03-13

    申请号：US10964426

    申请日：2004-10-12

    申请人： Hideyo Osanai ,  Takayuki Takahashi ,  Makoto Namioka

    发明人： Hideyo Osanai ,  Takayuki Takahashi ,  Makoto Namioka

    IPC分类号： B32B3/00 ,  H01L23/24

    CPC分类号： H01L23/3735 ,  H01L2924/0002 ,  Y10T428/24802 ,  Y10T428/24917 ,  Y10T428/24926 ,  H01L2924/00

    摘要： In a metal/ceramic bonding substrate 10 wherein a circuit forming metal plate 14 is bonded to one side of a ceramic substrate 12 and a radiating metal base plate 16 is bonded to the other side thereof, a difference in level is provided along the entire circumference of the bonding surface of the ceramic substrate 12 to the metal base plate 16. The difference in level is provided by forming at least one of a rising portion 16a and a groove portion 116b on and in the metal base plate 16.

    摘要翻译： 在其中将电路形成金属板14接​​合到陶瓷基板12的一侧的金属/陶瓷接合基板10和散热金属基板16的另一侧接合，沿着整个圆周设置有水平差 陶瓷基板12的接合表面与金属基板16的接合面。通过在金属基板16上形成上升部分16a和凹槽部分116b中的至少一个来提供液位差。

    Aluminum nitride powder and thermally conductive grease composition using the same
    39.
    发明授权
    Aluminum nitride powder and thermally conductive grease composition using the same 有权
    氮化铝粉末和使用其的导热油脂组合物

    公开(公告)号：US6136758A

    公开(公告)日：2000-10-24

    申请号：US209455

    申请日：1998-12-11

    申请人： Kunihiro Yamada ,  Takayuki Takahashi ,  Kenichi Isobe

    发明人： Kunihiro Yamada ,  Takayuki Takahashi ,  Kenichi Isobe

    IPC分类号： C01B21/072 ,  C10M113/16 ,  C10M169/00 ,  C10M169/02 ,  C10M107/50

    CPC分类号： C10M169/02 ,  C01B21/0728 ,  C10M113/16 ,  C10M169/00 ,  C10M2201/0613 ,  C10M2201/0616 ,  C10M2201/0626 ,  C10M2227/045 ,  C10N2210/02 ,  C10N2210/03 ,  C10N2250/10 ,  C10N2260/00

    摘要： An aluminum nitride powder having the surface treated with an organosilane represented by formula, R.sup.I.sub.a R.sup.II.sub.b SiY.sub.4-1-b, and/or a partial hydrolysis condensate thereof to acquire excellent moisture-proof, wherein R.sup.I represents a 6-20C alkyl group or a group formed by substituting halogen atom or atoms for part or all of the hydrogen atoms attached to carbon atoms of the 6-20C alkyl group, R.sup.II represents a 1-20C hydrocarbon group or a group formed by substituting halogen atom or atoms for part or all of the hydrogen atoms attached to carbon atoms of the 1-20C hydrocarbon group, Y represents a hydrolyzable group, a is an integer of 1 to 3 and b is an integer of 0 to 2, provided that a+b is an integer of 1 to 3; and a thermally conductive grease composition comprising (A) 50-95 weight % of the aforementioned surface-treated aluminum nitride powder and (B) 5 to 50 weight % of at least one base oil selected from the group consisting of liquid silicones, liquid hydrocarbons and fluorohydrocarbon oils, and further, if desired, (C) 0-30 weight % of a thicknener selected from the group consisting of zinc oxide, alumina, boron nitride and silicon carbide powders.

    摘要翻译： 具有用式表示的有机硅烷表面处理的氮化铝粉末，RIaRIIbSiY4-1-b和/或其部分水解缩合物，以获得优异的防湿性，其中RI表示6-20C烷基或由 用卤原子或原子取代与6-20C烷基的碳原子连接的部分或全部氢原子，RII表示1-20C的烃基或通过用卤原子或原子取代部分或全部氢 附着于1-20C烃基的碳原子的原子，Y表示可水解基团，a表示1〜3的整数，b表示0〜2的整数，条件是a + b为1〜3的整数。 和导热性润滑脂组合物，其包含（A）50-95重量％的上述表面处理的氮化铝粉末和（B）5至50重量％的至少一种基础油，其选自液体硅酮，液体烃 和氟代烃油，并且如果需要，（C）0-30重量％的选自氧化锌，氧化铝，氮化硼和碳化硅粉末的增稠剂。

    Thermally conductive silicone composition
    40.
    发明授权
    Thermally conductive silicone composition 有权
    导热硅胶组合物

    公开(公告)号：US6114429A

    公开(公告)日：2000-09-05

    申请号：US153334

    申请日：1998-09-15

    申请人： Kunihiro Yamada ,  Takayuki Takahashi ,  Kenichi Isobe

    发明人： Kunihiro Yamada ,  Takayuki Takahashi ,  Kenichi Isobe

    IPC分类号： C08L83/04 ,  H01B1/04

    CPC分类号： C08L83/04 ,  C08G77/12 ,  C08G77/14 ,  C08G77/16 ,  C08G77/20 ,  C08G77/24 ,  C08G77/26 ,  C08G77/46 ,  C08G77/70

    摘要： A thermally conductive silicone composition which comprises (A) 5 to 30 weight % of a liquid silicone, (B) 50 to 94.98 weight % of at least one thickener selected from the group consisting of a zinc oxide powder, an aluminum powder, an aluminum nitride powder, a boron nitride powder and a silicon carbide powder, (C) 0.01 to 10 weight % of an organopolysiloxane having at least one per molecule of hydroxyl group attached directly to a silicon atom, and (D) 0.01 to 10 weight % of an alkoxysilane, thereby retainining satisfactory thermal conductive properties and hardly causing oil bleeding over a long time.

    摘要翻译： 一种导热硅氧烷组合物，其包含（A）5至30重量％的液体硅氧烷，（B）50至94.98重量％的至少一种增稠剂，其选自氧化锌粉末，铝粉末，铝 氮化物粉末，氮化硼粉末和碳化硅粉末，（C）0.01〜10重量％的每分子羟基至少一个羟基直接与硅原子连接的有机聚硅氧烷，（D）0.01〜10重量％ 烷氧基硅烷，从而保持令人满意的导热性能，并且长时间难以引起油渗出。