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公开(公告)号：US20130277553A1
公开(公告)日：2013-10-24
申请号：US13993838
申请日：2011-11-10
申请人： Yuko Otani , Yuta Urano , Toshifumi Honda
发明人： Yuko Otani , Yuta Urano , Toshifumi Honda
IPC分类号： H01J37/26
CPC分类号： H01J37/261 , G01N21/8806 , G01N21/9501
摘要： Disclosed are a method and an apparatus for observing defects by using an SEM, wherein, in order to observe defects on a wafer at high speed and high sensitivity, positional information of defects on a sample, which has been optically inspected and detected by other inspecting apparatus, and information of the conditions of the optical inspection having been performed by other inspecting apparatus are obtained, and optically detecting the defects on the sample placed on a table, on the basis of the thus obtained information, and on the basis of the detected positional information of the defect on the sample placed on the table, the positional information of the defect having been inspected and detected by other inspecting apparatus is corrected, then, the defects on the sample placed on the table are observed by the SEM using the thus corrected positional information of the defects.
摘要翻译： 公开了通过使用SEM观察缺陷的方法和装置，其中为了以高速和高灵敏度观察晶片上的缺陷，通过其他检查被光学检查和检测的样品上的缺陷的位置信息 获取了由其他检查装置执行的光学检查条件的信息，并根据所获得的信息，基于检测到的信息光学地检测放置在工作台上的样品上的缺陷 对放置在工作台上的样品上的缺陷的位置信息进行校正，由其他检查装置检查和检测的缺陷的位置信息被校正，然后通过SEM观察放置在工作台上的样品上的缺陷， 校正了缺陷的位置信息。
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公开(公告)号：US20120275681A1
公开(公告)日：2012-11-01
申请号：US13505803
申请日：2010-11-05
申请人： Toshifumi Honda , Hiroko Fujita , Muneo Maeshima , Akira Maekawa , Yoshiko Ishida , Yuta Urano , Shinya Murakami
发明人： Toshifumi Honda , Hiroko Fujita , Muneo Maeshima , Akira Maekawa , Yoshiko Ishida , Yuta Urano , Shinya Murakami
IPC分类号： G06K9/62
摘要： When multiple kinds of bacterial colonies are present in a petri dish and, for example, a drug tolerance is to be measured, harvesting of mixed colonies of different types of bacteria makes it impossible to accurately determine the drug tolerance. Also, it is required to improve the throughput of a device for harvesting a bacterial colony. From images illuminated from multiple directions, isolating bacterial colonies are automatically extracted. Next, the image feature amounts are calculated from the multiple images that are illuminated from multiple directions and colonies are grouped depending on the feature amounts. Then, bacterial colonies to be harvested are determined based on the results of the grouping.
摘要翻译： 当培养皿中存在多种细菌菌落时，例如测定药物耐受性时，收集不同类型细菌的混合菌落使得不可能准确地确定药物耐受性。 此外，需要提高用于收获细菌菌落的装置的产量。 从多个方向照射的图像，分离细菌菌落被自动提取。 接下来，根据从多个方向照明的多个图像计算图像特征量，并且根据特征量对殖民地进行分组。 然后，基于分组的结果确定要收获的细菌菌落。
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33.发明授权公开(公告)号：US09588054B2
公开(公告)日：2017-03-07
申请号：US13882542
申请日：2011-10-14
申请人： Yuta Urano , Toshifumi Honda , Takahiro Jingu
发明人： Yuta Urano , Toshifumi Honda , Takahiro Jingu
IPC分类号： G01N21/86 , H01J3/14 , G01N21/88 , G01N21/95 , G01N21/956
CPC分类号： G01N21/8806 , G01N21/4795 , G01N21/8851 , G01N21/9501 , G01N21/956 , G01N2021/8835
摘要： A defect inspection method includes an illumination light adjustment step of adjusting light emitted from a light source, an illumination intensity distribution control step of forming light flux obtained in the illumination light adjustment step into desired illumination intensity distribution, a sample scanning step of displacing a sample in a direction substantially perpendicular to a longitudinal direction of the illumination intensity distribution, a scattered light detection step of counting the number of photons of scattered light emitted from plural small areas in an area irradiated with illumination light to produce plural scattered light detection signals corresponding to the plural small areas, a defect judgment step of processing the plural scattered light detection signals to judge presence of a defect, a defect dimension judgment step of judging dimensions of the defect in each place in which the defect is judged to be present and a display step of displaying a position on sample surface and the dimensions of the defect in each place in which the defect is judged to be present.
摘要翻译： 缺陷检查方法包括调整从光源发出的光的照明光调节步骤，将在所述照明光调节步骤中获得的光束形成为期望的照度分布的照度分布控制步骤，将样品置换的样本扫描步骤 在与照明强度分布的长度方向大致正交的方向上，对从照明光照射的区域的多个小区域发射的散射光的光数进行计数，生成与多个散射光检测信号对应的散射光检测信号的散射光检测步骤 多个小区域，处理多个散射光检测信号以判断缺陷的存在的缺陷判断步骤，判断存在缺陷的每个位置的缺陷的尺寸的缺陷维度判断步骤和显示 显示位置的步骤o n样品表面和缺陷的每个位置的缺陷的尺寸。
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公开(公告)号：US09041921B2
公开(公告)日：2015-05-26
申请号：US13519138
申请日：2011-01-17
CPC分类号： G01N21/9501 , G01N21/47
摘要： A defect inspection device has: an illumination optical system which irradiates a predetermined region of an inspection target with illumination light; a detection optical system which has a detector provided with a plurality of pixels by which scattered light from the predetermined region of the inspection target due to illumination light from the illumination optical system can be detected; and a signal processing portion which is provided with a correction portion which corrects pixel displacement caused by change in a direction perpendicular to a surface of the inspection target with respect to a detection signal based on the scattered light detected by the detector of the detection optical system, and a defect determination portion which determines a defect on the surface of the inspection target based on the detection signal corrected by the correction portion.
摘要翻译： 缺陷检查装置具有：利用照明光照射检查对象物的规定区域的照明光学系统; 检测光学系统，其具有检测器，该检测器设置有多个像素，通过该检测器能够检测来自照明光学系统的照明光来自检查对象物的预定区域的散射光; 以及信号处理部，其具有校正部，该校正部基于由检测光学系统的检测器检测到的散射光，相对于检测信号校正与垂直于检查对象的表面的方向的变化引起的像素位移 以及缺陷确定部分，其基于由校正部分校正的检测信号来确定检查对象的表面上的缺陷。
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公开(公告)号：US20130003052A1
公开(公告)日：2013-01-03
申请号：US13519138
申请日：2011-01-17
IPC分类号： G01N21/956
CPC分类号： G01N21/9501 , G01N21/47
摘要： A defect inspection device has: an illumination optical system which irradiates a predetermined region of an inspection target with illumination light; a detection optical system which has a detector provided with a plurality of pixels by which scattered light from the predetermined region of the inspection target due to illumination light from the illumination optical system can be detected; and a signal processing portion which is provided with a correction portion which corrects pixel displacement caused by change in a direction perpendicular to a surface of the inspection target with respect to a detection signal based on the scattered light detected by the detector of the detection optical system, and a defect determination portion which determines a defect on the surface of the inspection target based on the detection signal corrected by the correction portion.
摘要翻译： 缺陷检查装置具有：利用照明光照射检查对象物的规定区域的照明光学系统; 检测光学系统，其具有检测器，该检测器设置有多个像素，通过该检测器能够检测来自照明光学系统的照明光来自检查对象物的预定区域的散射光; 以及信号处理部，其具有校正部，该校正部基于由检测光学系统的检测器检测到的散射光，相对于检测信号校正与垂直于检查对象的表面的方向的变化引起的像素位移 以及缺陷确定部分，其基于由校正部分校正的检测信号来确定检查对象的表面上的缺陷。
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公开(公告)号：US20120194807A1
公开(公告)日：2012-08-02
申请号：US13387120
申请日：2010-07-28
IPC分类号： G01N21/95
CPC分类号： G01N21/9501 , G01N21/47
摘要： In order to maximize the effect of signal addition during inspection of foreign substances in wafers, a device structure including line sensors arranged in plural directions is effective. Low-angle detection optical systems that detect light beams in plural azimuth directions, the light beams being scattered in low angle directions among those scattered from a linear area on a sample illuminated by illuminating means, each include a combination of a first imaging lens group (330) and a diffraction grating (340) and a combination of a second imaging lens group (333) and an image detector (350) having a plurality of light receiving surfaces. A signal processing unit processes signals from the image detectors of the low-angle detection optical systems by adding the signals from the light receiving surfaces corresponding between the image detectors.
摘要翻译： 为了最大限度地发挥在晶片中异物检查期间信号增加的效果，包括沿多个方向布置的线传感器的装置结构是有效的。 检测在多个方位方向上的光束的低角度检测光学系统，所述光束在从照明装置照射的样品上的线性区域散射的那些中以低角度方向散射，各自包括第一成像透镜组（ 330）和衍射光栅（340）以及具有多个光接收表面的第二成像透镜组（333）和图像检测器（350）的组合。 信号处理单元通过将来自相应于图像检测器之间的光接收表面的信号相加来处理来自低角度检测光学系统的图像检测器的信号。
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公开(公告)号：US08514388B2
公开(公告)日：2013-08-20
申请号：US13387120
申请日：2010-07-28
IPC分类号： G01N21/95
CPC分类号： G01N21/9501 , G01N21/47
摘要： In order to maximize the effect of signal addition during inspection of foreign substances in wafers, a device structure including line sensors arranged in plural directions is effective. Low-angle detection optical systems that detect light beams in plural azimuth directions, the light beams being scattered in low angle directions among those scattered from a linear area on a sample illuminated by illuminating means, each include a combination of a first imaging lens group (330) and a diffraction grating (340) and a combination of a second imaging lens group (333) and an image detector (350) having a plurality of light receiving surfaces. A signal processing unit processes signals from the image detectors of the low-angle detection optical systems by adding the signals from the light receiving surfaces corresponding between the image detectors.
摘要翻译： 为了最大限度地发挥在晶片中异物检查期间信号增加的效果，包括沿多个方向布置的线传感器的装置结构是有效的。 检测在多个方位方向上的光束的低角度检测光学系统，所述光束在从由照明装置照射的样品上的线性区域散射的那些中以低角度方向散射，各自包括第一成像透镜组（ 330）和衍射光栅（340）以及具有多个光接收表面的第二成像透镜组（333）和图像检测器（350）的组合。 信号处理单元通过将来自相应于图像检测器之间的光接收表面的信号相加来处理来自低角度检测光学系统的图像检测器的信号。
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公开(公告)号：US20120019816A1
公开(公告)日：2012-01-26
申请号：US13145138
申请日：2010-01-06
IPC分类号： G01N21/88
CPC分类号： G01N21/95 , G01N21/21 , G01N21/47 , G01N21/9501 , G01N21/956 , G01N21/95607
摘要： The present invention provides a spatial filtering technology for exposing a defect image independently of polarization properties of defect scattered light, a defect inspection method for increasing a defect capture rate by suppressing the brightness saturation of a normal pattern, and a defect inspection apparatus that uses the defect inspection method. An array of spatial filters is disposed in one or more optical paths, which are obtained by polarizing and splitting a detection optical path, to filter diffracted light and scattered light emitted from the normal pattern. An image whose brightness saturation is suppressed is obtained by controlling an illumination light amount and/or detection efficiency during image detection in accordance with the amount of scattered light from the normal pattern.
摘要翻译： 本发明提供了一种独立于缺陷散射光的偏振特性曝光缺陷图像的空间滤波技术，通过抑制正常图案的亮度饱和来增加缺陷捕获率的缺陷检查方法，以及使用 缺陷检查方法。 空间滤波器阵列设置在通过偏振和分离检测光路获得的一个或多个光路中，以滤除衍射光和从正常图案发射的散射光。 根据来自正常图案的散射光的量，通过控制图像检测期间的照明光量和/或检测效率来获得亮度饱和度被抑制的图像。
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公开(公告)号：US20130119250A1
公开(公告)日：2013-05-16
申请号：US13697025
申请日：2011-04-05
申请人： Naoki Hosoya , Toshifumi Honda , Takashi Hiroi
发明人： Naoki Hosoya , Toshifumi Honda , Takashi Hiroi
CPC分类号： H01J37/28 , G06T7/001 , G06T7/136 , G06T2207/10061 , G06T2207/30148 , H01J37/222 , H01L22/12
摘要： A conventional pattern inspection, which compares an image to be inspected with a reference image and subjects the resulting difference value to the defect detection using the threshold of defect determination, has difficulty in highly-sensitive inspection. Because defects occur only in specific circuit pattern sections, false reports occur in the conventional pattern inspections which are not based on the position. Disclosed are a defect inspection method and a device thereof which perform a pattern inspection by acquiring a GP image in advance, designating a place to be inspected and a threshold map to the GP image on the GUI, setting the identification reference of the defects, next acquiring the image to be inspected, applying the identification reference to the image to be inspected, and identifying the defects with the identification reference, thereby enabling the highly-sensitive inspection.
摘要翻译： 将待检查的图像与参考图像进行比较并将得到的差分值与使用缺陷确定的阈值进行缺陷检测相对照的常规图案检查在高灵敏度检查中是困难的。 因为缺陷仅在特定的电路图形部分中发生，所以在常规图案检查中出现虚假报告，而不是基于位置。 公开了一种缺陷检查方法及其装置，其通过事先获取GP图像，指定待检查地点和GUI上的GP图像的阈值图来进行图案检查，设置缺陷的识别参考，下一步 获取要检查的图像，将所述识别参考应用于要检查的图像，以及使用所述识别参考来识别所述缺陷，由此实现高度敏感的检查。
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公开(公告)号：US20110102573A1
公开(公告)日：2011-05-05
申请号：US12986475
申请日：2011-01-07
申请人： Masaki KURIHARA , Toshifumi Honda , Ryo Nakagaki
发明人： Masaki KURIHARA , Toshifumi Honda , Ryo Nakagaki
CPC分类号： G06T7/001 , G06T2207/30148 , H01J37/222 , H01J37/28 , H01J2237/2817
摘要： A method and apparatus for reviewing defects of a semiconductor device is provided which involves detecting a defect on a SEM image taken at low magnification, and reviewing the defect on a SEM image taken at high magnification, and which can review a lot of defects in a short period of time thereby to improve the efficiency of defect review. In the present invention, the method for reviewing defects of a semiconductor device includes the steps of obtaining an image including a defect on the semiconductor device detected by a detection device by use of a scanning electron microscope at a first magnification, making a reference image from the image including the defect obtained at the first magnification, detecting the defect by comparing the image including the defect obtained at the first magnification to the reference image made from the image including the defect at the first magnification, and taking an image of the detected defect at a second magnification that is larger than the first magnification.
摘要翻译： 提供了一种用于检查半导体器件缺陷的方法和装置，其涉及检测在低放大倍率下拍摄的SEM图像上的缺陷，并且以高倍放大倍数检查SEM图像上的缺陷，并且可以检查在 短时间内可以提高缺陷检查的效率。 在本发明中，用于检查半导体器件的缺陷的方法包括以下步骤：通过使用扫描电子显微镜以第一放大率获得由检测装置检测的半导体器件上的缺陷的图像，从而 所述图像包括在第一放大处获得的缺陷，通过将包括在第一放大获得的缺陷的图像与由包含第一放大率的缺陷构成的图像进行比较的图像进行比较来检测缺陷，并且获取检测到的缺陷的图像 在大于第一放大率的第二放大倍率下。
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