公开(公告)号：US20220173052A1

公开(公告)日：2022-06-02

申请号：US17160749

申请日：2021-01-28

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Chih-Hsun Hsu ,  Chi-Jen Chen ,  Hsi-Chang Hsu ,  Yuan-Hung Hsu ,  Rui-Feng Tai ,  Don-Son Jiang

IPC: H01L23/00 ,  H01L25/065 ,  H01L23/31 ,  H01L25/00 ,  H01L21/56 ,  H01L21/48

Abstract: An electronic package is provided and includes at least one protective structure positioned between a first electronic element and a second electronic element on a carrier for reducing stresses generated inside the first electronic element and the second electronic element when a filling material is formed on the carrier, encapsulates the protective structure and comes into contact with the first electronic element and the second electronic element, thereby preventing cracking of the first electronic element and the second electronic element and improving the reliability of the electronic package.

公开(公告)号：US20200328142A1

公开(公告)日：2020-10-15

申请号：US16538286

申请日：2019-08-12

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Don-Son Jiang ,  Nai-Hao Kao ,  Chih-Sheng Lin ,  Szu-Hsien Chen ,  Chih-Yuan Shih ,  Chia-Cheng Chen ,  Yu-Cheng Pai ,  Hsuan-Hao Mi

IPC: H01L23/498 ,  H01L23/14 ,  H01L23/367 ,  H01L23/00 ,  H01L21/48

Abstract: A package stack structure and a method for fabricating the same are provided. An electronic component is disposed on the topmost one of a plurality of organic material substrates, and no chip is disposed on the remaining organic material substrates. A predefined layer number of circuit layers are disposed in the organic material substrates, and distributes the thermal stress via the organic material substrates. Therefore, the bottommost one of the organic material substrates will not be separated from a circuit board due to CTE mismatch. Also a carrier component is provided.

公开(公告)号：US20170048981A1

公开(公告)日：2017-02-16

申请号：US14998114

申请日：2015-12-24

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Shao-Chueh Hu ,  Yueh-Chiung Chang ,  Don-Son Jiang

IPC: H05K1/18

CPC classification number: H01L25/117 ,  H01L23/66 ,  H01L2223/6616 ,  H01L2223/6677 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058

Abstract: An electronic module is provided, which includes a first package and a second package stacked on the first package. The first package has an encapsulant and an electronic element embedded in the encapsulant. The second package has an insulating layer and an antenna structure formed on and extending through the insulating layer. The insulating layer is bonded to the encapsulant with the antenna structure being electrically connected to the electronic element. Since the second package having the antenna structure is stacked on the first package, the invention eliminates the need to increase the area of the first package for mounting the antenna structure and hence allows the electronic module to meet the miniaturization requirement.

Abstract translation: 提供了一种电子模块，其包括堆叠在第一包装上的第一包装和第二包装。 第一封装具有密封剂和嵌入密封剂中的电子元件。 第二封装具有绝缘层和形成在绝缘层上并延伸穿过绝缘层的天线结构。 绝缘层被结合到密封剂上，天线结构电连接到电子元件。 由于具有天线结构的第二封装堆叠在第一封装上，所以本发明不需要增加用于安装天线结构的第一封装的面积，因此允许电子模块满足小型化要求。