公开(公告)号：US20210202455A1

公开(公告)日：2021-07-01

申请号：US16925326

申请日：2020-07-09

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tsung-Fu Tsai ,  Chin-Fu Kao ,  Pu Wang ,  Szu-Wei Lu

IPC: H01L25/18 ,  H01L21/50

Abstract: A package structure includes a circuits substrate, a semiconductor package, a lid structure and a plurality of first spacer structures. The semiconductor package is disposed on and electrically connected to the circuit substrate. The lid structure is disposed on the circuit substrate covering the semiconductor package, wherein the lid structure is attached to the circuit substrate through an adhesive material. The plurality of first spacer structures is surrounding the semiconductor package, wherein the first spacer structures are sandwiched between the lid structure and the circuit substrate, and includes a top portion in contact with the lid structure and a bottom portion in contact with the circuit substrate.

公开(公告)号：US20210118817A1

公开(公告)日：2021-04-22

申请号：US17113396

申请日：2020-12-07

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chih-Wei Wu ,  Li-Chung Kuo ,  Pu Wang ,  Ying-Ching Shih ,  Szu-Wei Lu ,  Kung-Chen Yeh

IPC: H01L23/00 ,  H01L21/56 ,  H01L21/3105 ,  H01L21/48 ,  H01L25/00 ,  H01L23/31 ,  H01L25/18 ,  H01L23/498 ,  H01L21/78

Abstract: A method includes bonding a second package component to a first package component, bonding a third package component to the first package component, attaching a dummy die to the first package component, encapsulating the second package component, the third package component, and the dummy die in an encapsulant, and performing a planarization process to level a top surface of the second package component with a top surface of the encapsulant. After the planarization process, an upper portion of the encapsulant overlaps the dummy die. The dummy die is sawed-through to separate the dummy die into a first dummy die portion and a second dummy die portion. The upper portion of the encapsulant is also sawed through.