公开(公告)号：US11682626B2

公开(公告)日：2023-06-20

申请号：US16926215

申请日：2020-07-10

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chen-Hua Yu ,  Wei-Kang Hsieh ,  Shih-Wei Chen ,  Tin-Hao Kuo ,  Hao-Yi Tsai

IPC: H01L23/40 ,  H01L23/538 ,  H01L23/00 ,  H01L23/31 ,  H01L21/768 ,  H01L25/065 ,  H01L21/56 ,  H01L23/367

CPC classification number: H01L23/5384 ,  H01L21/56 ,  H01L21/76802 ,  H01L23/31 ,  H01L23/367 ,  H01L23/4006 ,  H01L23/4012 ,  H01L23/5385 ,  H01L24/14 ,  H01L25/0657

Abstract: A semiconductor device includes a die, an encapsulant over a front-side surface of the die, a redistribution structure on the encapsulant, a thermal module coupled to the back-side surface of the die, and a bolt extending through the redistribution structure and the thermal module. The die includes a chamfered corner. The bolt is adjacent to the chamfered corner.

公开(公告)号：US20230040030A1

公开(公告)日：2023-02-09

申请号：US17743999

申请日：2022-05-13

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chen-Shien Chen ,  Tin-Hao Kuo ,  Hsu-Hsien Chen ,  Yu-chih Huang

IPC: H01L21/66 ,  H01L21/683 ,  H01L23/00 ,  H01L25/00 ,  H01L25/10

Abstract: A method of forming a semiconductor package includes attaching a first package component to a first carrier; attaching a second package component to the first carrier, the second package component laterally displaced from the first package component; attaching a third package component to the first package component, the third package component being electrically connected to the first package component; removing the first carrier from the first package component and the second package component; after removing the first carrier, performing a first circuit probe test on the second package component to obtain first test data of the second package component; and comparing the first test data of the second package component with prior data of the second package component.

公开(公告)号：US11355466B2

公开(公告)日：2022-06-07

申请号：US16897296

申请日：2020-06-10

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Po-Yuan Teng ,  Hao-Yi Tsai ,  Kuo-Lung Pan ,  Sen-Kuei Hsu ,  Tin-Hao Kuo ,  Yi-Yang Lei ,  Ying-Cheng Tseng ,  Chi-Hui Lai

IPC: H01L23/538 ,  H01L23/00 ,  H01L23/31 ,  H01L21/56 ,  H01L21/48 ,  H01L21/683

Abstract: A package structure including at least one semiconductor die and a redistribution structure is provided. The semiconductor die is laterally encapsulated by an encapsulant, and the redistribution structure is disposed on the semiconductor die and the encapsulant and electrically connected with the semiconductor die. The redistribution structure includes signal lines and a pair of repair lines. The signal lines include a pair of first signal lines located at a first level, and each first signal line of the pair of first signal lines has a break that split each first signal line into separate first and second fragments. The pair of repair lines is located above the pair of first signal lines and located right above the break. Opposite ending portions of each repair line are respectively connected with the first and second fragments with each repair line covering the break in each first signal line.

公开(公告)号：US11342295B2

公开(公告)日：2022-05-24

申请号：US16231619

申请日：2018-12-24

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chen-Hua Yu ,  Chung-Shi Liu ,  Hao-Yi Tsai ,  Tin-Hao Kuo

IPC: H01L23/22 ,  H01L23/24 ,  H01L23/00 ,  H01L23/31 ,  H01L23/40 ,  H01L21/56 ,  H01L23/498

Abstract: A package structure includes at least one semiconductor die, a plurality of hollow cylinders, an insulating encapsulant, a redistribution layer and through holes. The plurality of hollow cylinders is surrounding the at least one semiconductor die. The insulating encapsulant has a top surface and a bottom surface opposite to the top surface, wherein the insulating encapsulant encapsulates the at least one semiconductor die and the plurality of hollow cylinders. The redistribution layer is disposed on the top surface of the insulant encapsulant and over the at least one semiconductor die. The through holes are penetrating through the plurality of hollow cylinders.

公开(公告)号：US20220108961A1

公开(公告)日：2022-04-07

申请号：US17554344

申请日：2021-12-17

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chen-Hua Yu ,  Tin-Hao Kuo ,  Chung-Shi Liu ,  Hao-Yi Tsai

IPC: H01L23/00

Abstract: A semiconductor device has a top metal layer, a first passivation layer over the top metal layer, a first redistribution layer over the first passivation layer, a first polymer layer, and a first conductive via extending through the first polymer layer. The first polymer layer is in physical contact with the first passivation layer.

公开(公告)号：US11239135B2

公开(公告)日：2022-02-01

申请号：US16515024

申请日：2019-07-18

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Shih-Wei Chen ,  Hao-Yi Tsai ,  Kuo-Lung Pan ,  Tin-Hao Kuo ,  Po-Yuan Teng ,  Chi-Hui Lai

IPC: H01L23/367 ,  H01L21/48 ,  H01L21/3205 ,  H01L25/065 ,  H01L23/373 ,  H01L23/552 ,  H01L23/00 ,  H01L25/18 ,  H01L23/498

Abstract: A package structure includes a semiconductor die, a redistribution circuit structure, and a metallization element. The semiconductor die has an active side and an opposite side opposite to the active side. The redistribution circuit structure is disposed on the active side and is electrically coupled to the semiconductor die. The metallization element has a plate portion and a branch portion connecting to the plate portion, wherein the metallization element is electrically isolated to the semiconductor die, and the plate portion of the metallization element is in contact with the opposite side.

公开(公告)号：US20210391270A1

公开(公告)日：2021-12-16

申请号：US17461061

申请日：2021-08-30

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Shu-Rong Chun ,  Tin-Hao Kuo ,  Chi-Hui Lai ,  Kuo Lung Pan ,  Yu-Chia Lai ,  Hao-Yi Tsai ,  Chung-Shi Liu ,  Chen-Hua Yu

IPC: H01L23/538 ,  H01L23/31 ,  H01L21/683 ,  H01L21/48 ,  H01L21/56

Abstract: A method includes encapsulating a plurality of package components in an encapsulant, and forming a first plurality of redistribution layers over and electrically coupling to the plurality of package components. The first plurality of redistribution layers have a plurality of power/ground pad stacks, with each of the plurality of power/ground pad stacks having a pad in each of the first plurality of redistribution layers. The plurality of power/ground pad stacks include a plurality of power pad stacks, and a plurality of ground pad stacks. At least one second redistribution layer is formed over the first plurality of redistribution layers. The second redistribution layer(s) include power lines and electrical grounding lines electrically connecting to the plurality of power/ground pad stacks.

公开(公告)号：US11177192B2

公开(公告)日：2021-11-16

申请号：US16533789

申请日：2019-08-07

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Po-Yuan Teng ,  Chen-Hua Yu ,  Hao-Yi Tsai ,  Kuo-Chung Yee ,  Tin-Hao Kuo ,  Shih-Wei Chen

IPC: H01L23/473 ,  H01L23/31 ,  H01L23/40 ,  H01L21/56 ,  H01L21/48 ,  H01L23/00 ,  H01L21/683

Abstract: A semiconductor device includes a chip package comprising a semiconductor die laterally encapsulated by an insulating encapsulant, the semiconductor die having an active surface, a back surface opposite to the active surface, and a thermal enhancement pattern on the back surface; and a heat dissipation structure connected to the chip package, the heat dissipation structure comprising a heat spreader having a flow channel for a cooling liquid, and the cooling liquid in the flow channel being in contact with the thermal enhancement pattern.

公开(公告)号：US11158576B2

公开(公告)日：2021-10-26

申请号：US16897299

申请日：2020-06-10

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chih-Hao Chang ,  Hao-Yi Tsai ,  Tsung-Hsien Chiang ,  Tin-Hao Kuo

IPC: H01L23/532 ,  H01L23/31 ,  H01L23/52 ,  H01L23/522 ,  H01L23/00 ,  H01L21/56

Abstract: A package structure includes a redistribution layer (RDL) structure, a die, and an encapsulant. The die is attached to the RDL structure through an adhesive layer. The encapsulant is disposed on the RDL structure and laterally encapsulates the die and the adhesive layer. The encapsulant includes a protruding part extending into the RDL structure and having a bottom surface in contact with the RDL structure.

公开(公告)号：US20210305123A1

公开(公告)日：2021-09-30

申请号：US17077815

申请日：2020-10-22

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chen-Hua Yu ,  Tin-Hao Kuo

IPC: H01L23/367 ,  H01L23/433 ,  H01L23/495

Abstract: A package includes a die having a first side and a second side opposite to each other. The package also includes an encapsulating material surrounding the die. The package further includes a redistribution layer (RDL) structure disposed over the first side of the die and the encapsulating material. The package yet includes a heat dissipating feature disposed over the second side of the die and the encapsulating material. In addition, the package includes a first screw assembly penetrating through the die, the RDL structure and the heat dissipating feature.