公开(公告)号：US20120293978A1

公开(公告)日：2012-11-22

申请号：US13111222

申请日：2011-05-19

Applicant: Sheng-Shin Guo ,  Chih-Hsuan Sun ,  Tien-Ming Lin ,  Wei-Yu Yeh

Inventor： Sheng-Shin Guo ,  Chih-Hsuan Sun ,  Tien-Ming Lin ,  Wei-Yu Yeh

IPC: F21V9/16 ,  F21V29/00 ,  H01J9/00 ,  F21V5/00

CPC classification number: F21K9/64 ,  F21K9/232 ,  F21K9/90 ,  F21V3/02 ,  F21V13/02 ,  F21V29/507 ,  F21V29/70 ,  F21V29/74 ,  F21Y2101/00 ,  F21Y2113/13 ,  F21Y2115/10 ,  Y10T29/4913

Abstract: The present disclosure involves an LED lamp. The LED lamp includes a plurality of light-emitting diode (LED) light sources located on a substrate. At least a subset of the LED light sources is free of a phosphor coating. The LED lamp includes a multi-layered cap structure located over at least the subset of the LED light sources. The cap structure contains a phosphor material and a diffuser material. The cap structure is physically separated from the subset of the LED light sources by a gap. The LED lamp includes a cover structure positioned over and surrounding the LED light sources and the cap structure.

Abstract translation: 本发明涉及一种LED灯。 LED灯包括位于基板上的多个发光二极管（LED）光源。 LED光源的至少一个子集没有磷光体涂层。 LED灯包括位于LED光源的至少子集上的多层帽结构。 盖结构包含磷光体材料和漫射材料。 盖结构通过间隙与LED光源的子集物理分离。 LED灯包括位于LED光源和盖结构之上并围绕LED光源的盖结构。

公开(公告)号：US08257110B2

公开(公告)日：2012-09-04

申请号：US12899999

申请日：2010-10-07

Applicant: Hsiao-Wen Lee ,  Chih-Hsuan Sun ,  Wei-Yu Yeh

Inventor： Hsiao-Wen Lee ,  Chih-Hsuan Sun ,  Wei-Yu Yeh

IPC: H01R4/24

CPC classification number: B29C45/0001 ,  B29C45/14262 ,  B29C45/14311 ,  B29C45/14639 ,  B29K2705/02 ,  F21S4/20 ,  F21V23/06 ,  F21Y2103/10 ,  F21Y2115/10 ,  H01R43/24 ,  Y10T29/53

Abstract: The present disclosure relates to methods for fabricating electrical connectors of a waterproof connector-heat sink assembly of a LED light bar module using injection molding. The methods include matching the coefficient of thermal expansion (CTE) of injection molding materials for the connectors and heat sinks. A heat sink and conductor pins are inserted into an injection mold and the injection molding materials are injected into the injection mold. An integrated connector-heat sink assembly is formed when the injection molding materials of the connectors form a waterproof seal with the heat sink when the injection molding materials solidify. Placement of the heat sink and conductor pins inside the injection mold is controlled to ensure that adhesive bonding between the injection molding materials and the heat sink is stronger than a maximum shear force.

Abstract translation: 本公开涉及使用注射成型制造LED灯条模块的防水连接器 - 散热器组件的电连接器的方法。 这些方法包括匹配用于连接器和散热器的注塑材料的热膨胀系数（CTE）。 将散热器和导体销插入注射模具中，并将注射成型材料注入注射模具中。 当注射成型材料固化时，当连接器的注射成型材料与散热器形成防水密封时，形成集成连接器 - 散热器组件。 控制注射模具内的散热器和导体销的放置，以确保注射成型材料和散热片之间的粘合剂粘合力比最大剪切力更强。

公开(公告)号：US20120201007A1

公开(公告)日：2012-08-09

申请号：US13024017

申请日：2011-02-09

Applicant: Wei-Yu Yeh ,  Chih-Hsuan Sun

Inventor： Wei-Yu Yeh ,  Chih-Hsuan Sun

IPC: H05K7/20 ,  H05K3/30

CPC classification number: F21V29/20 ,  F21K9/20 ,  F21V29/70 ,  F21V29/763 ,  F21Y2103/10 ,  F21Y2115/10 ,  H05K1/0203 ,  H05K1/056 ,  H05K1/111 ,  H05K3/0061 ,  H05K2201/066 ,  H05K2201/10106 ,  H05K2201/10969 ,  Y10T29/4913

Abstract: A Light Emitting Diode (LED) module includes a circuit board having a front side and a back side, a heat sink coupled to the back side of the circuit board, a thermal pad disposed on a front side of the circuit board, an LED disposed on the front side of the circuit board. The LED is in thermal contact with the thermal pad. The module further includes a heat spreading device placed over the thermal pad and in thermal contact with the thermal pad.

Abstract translation: 发光二极管（LED）模块包括具有前侧和后侧的电路板，耦合到电路板的背面的散热器，设置在电路板的前侧的散热垫，设置在LED 在电路板的正面。 LED与散热垫热接触。 模块还包括放置在热垫上并与热垫热接触的散热装置。