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    Light-emitting-diode-based light bulb
    2.
    发明授权
    Light-emitting-diode-based light bulb 有权
    基于发光二极管的灯泡

    公开(公告)号：US08794791B2

    公开(公告)日：2014-08-05

    申请号：US13151857

    申请日：2011-06-02

    Applicant: Sheng-Shin Guo ,  Wei-Yu Yeh ,  Chih-Hsuan Sun ,  Pei-Wen Ko

    Inventor： Sheng-Shin Guo ,  Wei-Yu Yeh ,  Chih-Hsuan Sun ,  Pei-Wen Ko

    IPC: F21V1/00 ,  F21V11/00 ,  F21V7/00

    CPC classification number: F21K9/64 ,  F21K9/232 ,  F21V3/08 ,  F21V7/041 ,  F21W2121/00 ,  F21Y2101/00 ,  F21Y2107/60 ,  F21Y2115/10

    Abstract: The embodiments of a light-emitting-diode-based (LED-based) light bulb and an LED assembly described provide mechanisms of reflecting generated by LED emitters toward the back of the LED-based light bulb. An upper substrate and a lower substrate are used to support upper and lower LED emitters. A slanted and reflective surface between the upper substrate and the lower substrate reflects light generated by the lower LED emitters toward the backside of the LED-based light bulb.

    Abstract translation: 基于发光二极管（LED）的灯泡和LED组件的实施例提供了由LED发射器朝向基于LED的灯泡背面产生的反射机制。 上基板和下基板用于支撑上下LED发射器。 上基板和下基板之间的倾斜和反射表面将由下LED发射器产生的光朝向基于LED的灯泡的背面反射。

    LED lamp with improved light output
    3.
    发明授权
    LED lamp with improved light output 有权
    LED灯具有改善的光输出

    公开(公告)号：US08721097B2

    公开(公告)日：2014-05-13

    申请号：US13111222

    申请日：2011-05-19

    Applicant: Sheng-Shin Guo ,  Chih-Hsuan Sun ,  Tien-Ming Lin ,  Wei-Yu Yeh

    Inventor： Sheng-Shin Guo ,  Chih-Hsuan Sun ,  Tien-Ming Lin ,  Wei-Yu Yeh

    IPC: F21V9/16 ,  F21V3/00

    CPC classification number: F21K9/64 ,  F21K9/232 ,  F21K9/90 ,  F21V3/02 ,  F21V13/02 ,  F21V29/507 ,  F21V29/70 ,  F21V29/74 ,  F21Y2101/00 ,  F21Y2113/13 ,  F21Y2115/10 ,  Y10T29/4913

    Abstract: The present disclosure involves an LED lamp. The LED lamp includes a plurality of light-emitting diode (LED) light sources located on a substrate. At least a subset of the LED light sources is free of a phosphor coating. The LED lamp includes a multi-layered cap structure located over at least the subset of the LED light sources. The cap structure contains a phosphor material and a diffuser material. The cap structure is physically separated from the subset of the LED light sources by a gap. The LED lamp includes a cover structure positioned over and surrounding the LED light sources and the cap structure.

    Abstract translation: 本发明涉及一种LED灯。 LED灯包括位于基板上的多个发光二极管（LED）光源。 LED光源的至少一个子集没有磷光体涂层。 LED灯包括位于LED光源的至少子集上的多层帽结构。 盖结构包含磷光体材料和漫射材料。 盖结构通过间隙与LED光源的子集物理分离。 LED灯包括位于LED光源和盖结构之上并围绕LED光源的盖结构。

    Energy star compliant LED lamp
    4.
    发明授权
    Energy star compliant LED lamp 有权
    符合能源之星的LED灯

    公开(公告)号：US08668366B2

    公开(公告)日：2014-03-11

    申请号：US13313153

    申请日：2011-12-07

    Applicant: Chih-Hsuan Sun ,  Wei-Yu Yeh ,  Hsueh-Hung Fu ,  Dong Jung Suen

    Inventor： Chih-Hsuan Sun ,  Wei-Yu Yeh ,  Hsueh-Hung Fu ,  Dong Jung Suen

    IPC: F21V7/00

    CPC classification number: F21K9/60 ,  B05D5/061 ,  B05D5/063 ,  F21K9/20 ,  F21K9/232 ,  F21K9/66 ,  F21V3/049 ,  F21V3/0625 ,  F21V3/10 ,  F21V7/0016 ,  F21V29/74 ,  F21V29/773 ,  F21Y2101/00 ,  F21Y2115/10

    Abstract: The present disclosure provides an illumination device. The illumination device includes a cap structure. The cap structure is partially coated with a reflective material operable to reflect light. The illumination device includes one or more lighting-emitting devices disposed within the cap structure. The light-emitting devices may be light-emitting diode (LED) chips. The illumination device also includes a thermal dissipation structure. The thermal dissipation structure is coupled to the cap structure in a first direction. The thermal dissipation structure and the cap structure have a coupling interface. The coupling interface extends in a second direction substantially perpendicular to the first direction. The thermal dissipation structure has a portion that intersects the coupling interface at an angle. The angle is in a range from about 60 degrees to about 90 degrees according to some embodiments.

    Abstract translation: 本公开提供一种照明装置。 照明装置包括盖结构。 盖结构部分地涂覆有可反射光的反射材料。 照明装置包括设置在盖结构内的一个或多个发光装置。 发光装置可以是发光二极管（LED）芯片。 照明装置还包括散热结构。 散热结构在第一方向上连接到盖结构。 散热结构和盖结构具有耦合接口。 联接接口在基本上垂直于第一方向的第二方向上延伸。 散热结构具有以一定角度与耦合接口相交的部分。 根据一些实施例，该角度在约60度至约90度的范围内。

    LED lamp and method of making the same
    6.
    发明授权
    LED lamp and method of making the same 有权
    LED灯及其制作方法

    公开(公告)号：US08414160B2

    公开(公告)日：2013-04-09

    申请号：US13158962

    申请日：2011-06-13

    Applicant: Chih-Hsuan Sun ,  Wei-Yu Yeh ,  Tien-Ming Lin

    Inventor： Chih-Hsuan Sun ,  Wei-Yu Yeh ,  Tien-Ming Lin

    IPC: F21V29/00

    CPC classification number: F21V29/74 ,  F21K9/232 ,  F21K9/90 ,  F21V3/02 ,  F21Y2101/00 ,  F21Y2115/10 ,  Y10T29/49002

    Abstract: A lighting device includes a multi-faceted heat sink with facets in a center portion facing outward. The facets form a central enclosed portion, and the heat sink further has a plurality of fins, where each of the fins is placed between adjacent facets and protrudes outwardly from the heat sink. The lighting device also has a plurality of circuit boards with semiconductor emitters mounted thereon. Each of the circuit boards is mounted on a respective facet of the heat sink. The lighting device also has a light-diffusion housing covering the plurality of circuit boards, a power module in communication with the circuit boards and operable to convert power to be compatible with the semiconductor emitters, and a power connector assembly in electrical communication with the power module.

    Abstract translation: 照明装置包括具有朝向外侧的中心部分的小面的多面散热器。 小面形成中央封闭部分，并且散热器还具有多个翅片，其中每个翅片放置在相邻小面之间并从散热器向外突出。 照明装置还具有安装有半导体发射体的多个电路板。 每个电路板安装在散热器的相应面上。 所述照明装置还具有覆盖所述多个电路板的光扩散壳体，与所述电路板连通并可操作以将功率转换为与所述半导体发射体兼容的功率模块，以及与所述电力电连通的电源连接器组件 模块。

    Color temperature adjustment for LED lamps using switches
    9.
    发明授权
    Color temperature adjustment for LED lamps using switches 有权
    使用开关的LED灯的色温调节

    公开(公告)号：US08669722B2

    公开(公告)日：2014-03-11

    申请号：US13209327

    申请日：2011-08-12

    Applicant: Wei-Yu Yeh ,  Chih-Hsuan Sun

    Inventor： Wei-Yu Yeh ,  Chih-Hsuan Sun

    IPC: H05B37/00 ,  H05B39/00 ,  H05B41/00 ,  H05B37/02 ,  H05B39/04 ,  H05B41/36 ,  G05F1/00 ,  G01J5/60

    CPC classification number: H05B33/0863 ,  H05B33/0824 ,  H05B33/0869

    Abstract: A light-emitting diode (LED) lamp includes a number of different color LEDs that can be turned on and off in different combinations using an external switch operable by a user. A user or a controller can adjust the color temperature of light output by the lamp. The color temperature change may be a user preference and can compensate for decreased phosphor efficiency over time.

    Abstract translation: 发光二极管（LED）灯包括许多不同颜色的LED，可以使用可由用户操作的外部开关以不同的组合打开和关闭。 用户或控制器可以调节灯输出的光的色温。 色温变化可能是用户偏好，并且可以补偿随时间降低的磷光体效率。

    Light emitting diode light bar module with electrical connectors formed by injection molding
    10.
    发明授权
    Light emitting diode light bar module with electrical connectors formed by injection molding 有权
    具有电连接器的发光二极管灯条模块，通过注射成型形成

    公开(公告)号：US08591251B2

    公开(公告)日：2013-11-26

    申请号：US13557315

    申请日：2012-07-25

    Applicant: Hsiao-Wen Lee ,  Chih-Hsuan Sun ,  Wei-Yu Yeh

    Inventor： Hsiao-Wen Lee ,  Chih-Hsuan Sun ,  Wei-Yu Yeh

    IPC: H01R13/00

    CPC classification number: B29C45/0001 ,  B29C45/14262 ,  B29C45/14311 ,  B29C45/14639 ,  B29K2705/02 ,  F21S4/20 ,  F21V23/06 ,  F21Y2103/10 ,  F21Y2115/10 ,  H01R43/24 ,  Y10T29/53

    Abstract: The present disclosure relates to methods for fabricating electrical connectors of a waterproof connector-heat sink assembly of a LED light bar module using injection molding. The methods include matching the coefficient of thermal expansion (CTE) of injection molding materials for the connectors and heat sinks. A heat sink and conductor pins are inserted into an injection mold and the injection molding materials are injected into the injection mold. An integrated connector-heat sink assembly is formed when the injection molding materials of the connectors form a waterproof seal with the heat sink when the injection molding materials solidify. Placement of the heat sink and conductor pins inside the injection mold is controlled to ensure that adhesive bonding between the injection molding materials and the heat sink is stronger than a maximum shear force.

    Abstract translation: 本公开涉及使用注射成型制造LED灯条模块的防水连接器 - 散热器组件的电连接器的方法。 这些方法包括匹配用于连接器和散热器的注塑材料的热膨胀系数（CTE）。 将散热器和导体销插入注射模具中，并将注射成型材料注入注射模具中。 当注射成型材料固化时，当连接器的注射成型材料与散热器形成防水密封时，形成集成连接器 - 散热器组件。 控制注射模具内的散热器和导体销的放置，以确保注射成型材料和散热片之间的粘合剂粘合力比最大剪切力更强。

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