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公开(公告)号:US20120293978A1
公开(公告)日:2012-11-22
申请号:US13111222
申请日:2011-05-19
申请人: Sheng-Shin Guo , Chih-Hsuan Sun , Tien-Ming Lin , Wei-Yu Yeh
发明人: Sheng-Shin Guo , Chih-Hsuan Sun , Tien-Ming Lin , Wei-Yu Yeh
CPC分类号: F21K9/64 , F21K9/232 , F21K9/90 , F21V3/02 , F21V13/02 , F21V29/507 , F21V29/70 , F21V29/74 , F21Y2101/00 , F21Y2113/13 , F21Y2115/10 , Y10T29/4913
摘要: The present disclosure involves an LED lamp. The LED lamp includes a plurality of light-emitting diode (LED) light sources located on a substrate. At least a subset of the LED light sources is free of a phosphor coating. The LED lamp includes a multi-layered cap structure located over at least the subset of the LED light sources. The cap structure contains a phosphor material and a diffuser material. The cap structure is physically separated from the subset of the LED light sources by a gap. The LED lamp includes a cover structure positioned over and surrounding the LED light sources and the cap structure.
摘要翻译: 本发明涉及一种LED灯。 LED灯包括位于基板上的多个发光二极管(LED)光源。 LED光源的至少一个子集没有磷光体涂层。 LED灯包括位于LED光源的至少子集上的多层帽结构。 盖结构包含磷光体材料和漫射材料。 盖结构通过间隙与LED光源的子集物理分离。 LED灯包括位于LED光源和盖结构之上并围绕LED光源的盖结构。
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公开(公告)号:US08721097B2
公开(公告)日:2014-05-13
申请号:US13111222
申请日:2011-05-19
申请人: Sheng-Shin Guo , Chih-Hsuan Sun , Tien-Ming Lin , Wei-Yu Yeh
发明人: Sheng-Shin Guo , Chih-Hsuan Sun , Tien-Ming Lin , Wei-Yu Yeh
CPC分类号: F21K9/64 , F21K9/232 , F21K9/90 , F21V3/02 , F21V13/02 , F21V29/507 , F21V29/70 , F21V29/74 , F21Y2101/00 , F21Y2113/13 , F21Y2115/10 , Y10T29/4913
摘要: The present disclosure involves an LED lamp. The LED lamp includes a plurality of light-emitting diode (LED) light sources located on a substrate. At least a subset of the LED light sources is free of a phosphor coating. The LED lamp includes a multi-layered cap structure located over at least the subset of the LED light sources. The cap structure contains a phosphor material and a diffuser material. The cap structure is physically separated from the subset of the LED light sources by a gap. The LED lamp includes a cover structure positioned over and surrounding the LED light sources and the cap structure.
摘要翻译: 本发明涉及一种LED灯。 LED灯包括位于基板上的多个发光二极管(LED)光源。 LED光源的至少一个子集没有磷光体涂层。 LED灯包括位于LED光源的至少子集上的多层帽结构。 盖结构包含磷光体材料和漫射材料。 盖结构通过间隙与LED光源的子集物理分离。 LED灯包括位于LED光源和盖结构之上并围绕LED光源的盖结构。
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公开(公告)号:US08757845B2
公开(公告)日:2014-06-24
申请号:US13194538
申请日:2011-07-29
申请人: Chi Xiang Tseng , Hsiao-Wen Lee , Sheng-Shin Guo , Pei-Wen Ko , Chih-Hsuan Sun , Wei-Yu Yeh
发明人: Chi Xiang Tseng , Hsiao-Wen Lee , Sheng-Shin Guo , Pei-Wen Ko , Chih-Hsuan Sun , Wei-Yu Yeh
IPC分类号: F21V7/07
CPC分类号: F21K9/50 , F21K9/60 , F21K9/90 , F21V3/02 , F21V3/0625 , F21V5/008 , F21V5/04 , F21V7/0091 , F21V29/77 , F21V29/89 , F21Y2115/10 , H01L33/58 , H01L2933/0091 , Y10T29/49826
摘要: The present disclosure provides one embodiment of an illumination structure. The illumination structure includes a light-emitting diode (LED) device on a substrate; a lens secured on the substrate and over the LED device; and a diffuser cap secured on the substrate and covering the lens, wherein the lens and diffuser cap are designed and configured to redistribute emitting light from the LED device for wide angle illumination.
摘要翻译: 本公开提供了照明结构的一个实施例。 照明结构包括在基板上的发光二极管(LED)装置; 固定在基板上并在LED器件上方的透镜; 以及固定在所述基板上并覆盖所述透镜的散射器盖,其中所述透镜和扩散器盖被设计和配置为重新分配来自所述LED装置的光以用于广角照明。
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公开(公告)号:US20130027946A1
公开(公告)日:2013-01-31
申请号:US13194538
申请日:2011-07-29
申请人: Chi Xiang Tseng , Hsiao-Wen Lee , Sheng-Shin Guo , Pei-Wen Ko , Chih-Hsuan Sun , Wei-Yu Yeh
发明人: Chi Xiang Tseng , Hsiao-Wen Lee , Sheng-Shin Guo , Pei-Wen Ko , Chih-Hsuan Sun , Wei-Yu Yeh
CPC分类号: F21K9/50 , F21K9/60 , F21K9/90 , F21V3/02 , F21V3/0625 , F21V5/008 , F21V5/04 , F21V7/0091 , F21V29/77 , F21V29/89 , F21Y2115/10 , H01L33/58 , H01L2933/0091 , Y10T29/49826
摘要: The present disclosure provides one embodiment of an illumination structure. The illumination structure includes a light-emitting diode (LED) device on a substrate; a lens secured on the substrate and over the LED device; and a diffuser cap secured on the substrate and covering the lens, wherein the lens and diffuser cap are designed and configured to redistribute emitting light from the LED device for wide angle illumination.
摘要翻译: 本公开提供了照明结构的一个实施例。 照明结构包括在基板上的发光二极管(LED)装置; 固定在基板上并在LED器件上方的透镜; 以及固定在所述基板上并覆盖所述透镜的散射器盖,其中所述透镜和扩散器盖被设计和配置为重新分配来自所述LED装置的光以用于广角照明。
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公开(公告)号:US08794791B2
公开(公告)日:2014-08-05
申请号:US13151857
申请日:2011-06-02
申请人: Sheng-Shin Guo , Wei-Yu Yeh , Chih-Hsuan Sun , Pei-Wen Ko
发明人: Sheng-Shin Guo , Wei-Yu Yeh , Chih-Hsuan Sun , Pei-Wen Ko
CPC分类号: F21K9/64 , F21K9/232 , F21V3/08 , F21V7/041 , F21W2121/00 , F21Y2101/00 , F21Y2107/60 , F21Y2115/10
摘要: The embodiments of a light-emitting-diode-based (LED-based) light bulb and an LED assembly described provide mechanisms of reflecting generated by LED emitters toward the back of the LED-based light bulb. An upper substrate and a lower substrate are used to support upper and lower LED emitters. A slanted and reflective surface between the upper substrate and the lower substrate reflects light generated by the lower LED emitters toward the backside of the LED-based light bulb.
摘要翻译: 基于发光二极管(LED)的灯泡和LED组件的实施例提供了由LED发射器朝向基于LED的灯泡背面产生的反射机制。 上基板和下基板用于支撑上下LED发射器。 上基板和下基板之间的倾斜和反射表面将由下LED发射器产生的光朝向基于LED的灯泡的背面反射。
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公开(公告)号:US20120097986A1
公开(公告)日:2012-04-26
申请号:US12910363
申请日:2010-10-22
申请人: Hao-Wei KU , Chung Yu WANG , Yu-Sheng Tang , Hsin-Hung Chen , Hao-Yu Yang , Ching-Yi Chen , Hsiao-Wen Lee , Chi Xiang Tseng , Sheng-Shin Guo , Tien-Ming Lin , Shang-Yu Tsai
发明人: Hao-Wei KU , Chung Yu WANG , Yu-Sheng Tang , Hsin-Hung Chen , Hao-Yu Yang , Ching-Yi Chen , Hsiao-Wen Lee , Chi Xiang Tseng , Sheng-Shin Guo , Tien-Ming Lin , Shang-Yu Tsai
CPC分类号: H01L27/15 , H01L24/97 , H01L25/167 , H01L33/486 , H01L33/54 , H01L33/60 , H01L2224/48091 , H01L2224/48227 , H01L2224/8592 , H01L2924/01322 , H01L2924/10253 , H01L2924/12035 , H01L2924/12041 , H01L2924/1305 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2933/0033 , H01L2933/005 , H01L2933/0058 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要: An optical emitter is fabricated by bonding a Light-Emitting Diode (LED) die to a package wafer, electrically connecting the LED die and the package wafer, forming a phosphor coating over the LED die on the package wafer, molding a lens over the LED die on the package wafer, molding a reflector on the package wafer, and dicing the wafer into at least one optical emitter.
摘要翻译: 通过将发光二极管(LED)裸片结合到封装晶片,电连接LED管芯和封装晶片,在封装晶片上的LED管芯上形成荧光体涂层,在LED上模制透镜来制造光发射器 在封装晶片上模制,在封装晶片上模制反射器,并将晶片切割成至少一个光发射器。
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公开(公告)号:US08486724B2
公开(公告)日:2013-07-16
申请号:US12910363
申请日:2010-10-22
申请人: Hao-Wei Ku , Chung Yu Wang , Yu-Sheng Tang , Hsin-Hung Chen , Hao-Yu Yang , Ching-Yi Chen , Hsiao-Wen Lee , Chi Xiang Tseng , Sheng-Shin Guo , Tien-Ming Lin , Shang-Yu Tsai
发明人: Hao-Wei Ku , Chung Yu Wang , Yu-Sheng Tang , Hsin-Hung Chen , Hao-Yu Yang , Ching-Yi Chen , Hsiao-Wen Lee , Chi Xiang Tseng , Sheng-Shin Guo , Tien-Ming Lin , Shang-Yu Tsai
IPC分类号: H01L21/00
CPC分类号: H01L27/15 , H01L24/97 , H01L25/167 , H01L33/486 , H01L33/54 , H01L33/60 , H01L2224/48091 , H01L2224/48227 , H01L2224/8592 , H01L2924/01322 , H01L2924/10253 , H01L2924/12035 , H01L2924/12041 , H01L2924/1305 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2933/0033 , H01L2933/005 , H01L2933/0058 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要: An optical emitter is fabricated by bonding a Light-Emitting Diode (LED) die to a package wafer, electrically connecting the LED die and the package wafer, forming a phosphor coating over the LED die on the package wafer, molding a lens over the LED die on the package wafer, molding a reflector on the package wafer, and dicing the wafer into at least one optical emitter.
摘要翻译: 通过将发光二极管(LED)裸片结合到封装晶片,电连接LED管芯和封装晶片,在封装晶片上的LED管芯上形成荧光体涂层,在LED上模制透镜来制造光发射器 在封装晶片上模制,在封装晶片上模制反射器,并将晶片切割成至少一个光发射器。
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公开(公告)号:US07796337B2
公开(公告)日:2010-09-14
申请号:US11717128
申请日:2007-03-13
IPC分类号: G02B27/10
CPC分类号: B29D11/00365
摘要: An optical microstructure plate and mold for fabricating the same is disclosed. The optical microstructure plate comprises a substrate. An optical microstructure element is formed on the substrate. A period alignment mark is disposed on the substrate to provide alignment for fabricating the optical microstructure element by a mold. A universal alignment mark is disposed on the substrate to provide alignment for bonding another plate therewith. Specifically, the mold comprises a concave within a mold substrate, a spoiler around the concave, and a buffer zone adjacent to the spoiler.
摘要翻译: 公开了一种用于制造它的光学微结构板和模具。 光学微结构板包括基底。 在基板上形成光学微结构元件。 周期对准标记设置在基板上以提供用于通过模具制造光学微结构元件的对准。 通用对准标记设置在基板上以提供用于将另一个板粘合的对准。 具体地,模具包括在模具基板内的凹部,围绕凹部的扰流板和与扰流板相邻的缓冲区域。
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公开(公告)号:US20090179138A1
公开(公告)日:2009-07-16
申请号:US12007887
申请日:2008-01-16
CPC分类号: G03F7/0002 , B29C33/10 , B29C33/3857 , B29C33/40 , B82Y10/00 , B82Y40/00
摘要: Soft mold and fabrication method thereof. The soft mold of the present invention comprises: a polymer layer having a printing pattern on a first surface thereof; at least one air channel on the first surface; and a back-plate attached to a second surface of the polymer layer. Additionally, the method for fabricating the soft mold includes: providing a mold having a predetermined pattern; positioning the mold in a cavity and calibrating the horizontal thereof; forming a polymer layer on the mold; attaching a back-plate to a top surface of the polymer layer and the dam; separating the polymer layer from the mold, wherein the polymer layer has a patterned surface; and cutting at least one air channel on the patterned surface of the polymer layer.
摘要翻译: 软模具及其制造方法。 本发明的软模具包括:在其第一表面上具有印刷图案的聚合物层; 在所述第一表面上的至少一个空气通道; 以及附接到聚合物层的第二表面的背板。 另外,制造软模具的方法包括:提供具有预定图案的模具; 将模具定位在空腔中并校准其水平面; 在模具上形成聚合物层; 将背板附接到聚合物层和坝的顶表面; 将聚合物层与模具分离,其中聚合物层具有图案化表面; 以及在聚合物层的图案化表面上切割至少一个空气通道。
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公开(公告)号:US20080225390A1
公开(公告)日:2008-09-18
申请号:US11717128
申请日:2007-03-13
CPC分类号: B29D11/00365
摘要: An optical microstructure plate and mold for fabricating the same is disclosed. The optical microstructure plate comprises a substrate. An optical microstructure element is formed on the substrate. A period alignment mark is disposed on the substrate to provide alignment for fabricating the optical microstructure element by a mold. A universal alignment mark is disposed on the substrate to provide alignment for bonding another plate therewith. Specifically, the mold comprises a concave within a mold substrate, a spoiler around the concave, and a buffer zone adjacent to the spoiler.
摘要翻译: 公开了一种用于制造它的光学微结构板和模具。 光学微结构板包括基底。 在基板上形成光学微结构元件。 周期对准标记设置在基板上以提供用于通过模具制造光学微结构元件的对准。 通用对准标记设置在基板上以提供用于将另一个板粘合的对准。 具体地,模具包括在模具基板内的凹部,围绕凹部的扰流板和与扰流板相邻的缓冲区域。
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