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24 条记录 (耗时 0.029 秒)

    LED lamp with improved light output
    1.
    发明授权
    LED lamp with improved light output 有权
    LED灯具有改善的光输出

    公开(公告)号：US08721097B2

    公开(公告)日：2014-05-13

    申请号：US13111222

    申请日：2011-05-19

    申请人： Sheng-Shin Guo ,  Chih-Hsuan Sun ,  Tien-Ming Lin ,  Wei-Yu Yeh

    发明人： Sheng-Shin Guo ,  Chih-Hsuan Sun ,  Tien-Ming Lin ,  Wei-Yu Yeh

    IPC分类号： F21V9/16 ,  F21V3/00

    CPC分类号： F21K9/64 ,  F21K9/232 ,  F21K9/90 ,  F21V3/02 ,  F21V13/02 ,  F21V29/507 ,  F21V29/70 ,  F21V29/74 ,  F21Y2101/00 ,  F21Y2113/13 ,  F21Y2115/10 ,  Y10T29/4913

    摘要： The present disclosure involves an LED lamp. The LED lamp includes a plurality of light-emitting diode (LED) light sources located on a substrate. At least a subset of the LED light sources is free of a phosphor coating. The LED lamp includes a multi-layered cap structure located over at least the subset of the LED light sources. The cap structure contains a phosphor material and a diffuser material. The cap structure is physically separated from the subset of the LED light sources by a gap. The LED lamp includes a cover structure positioned over and surrounding the LED light sources and the cap structure.

    摘要翻译： 本发明涉及一种LED灯。 LED灯包括位于基板上的多个发光二极管（LED）光源。 LED光源的至少一个子集没有磷光体涂层。 LED灯包括位于LED光源的至少子集上的多层帽结构。 盖结构包含磷光体材料和漫射材料。 盖结构通过间隙与LED光源的子集物理分离。 LED灯包括位于LED光源和盖结构之上并围绕LED光源的盖结构。

    LED LAMP WITH IMPROVED LIGHT OUTPUT
    2.
    发明申请
    LED LAMP WITH IMPROVED LIGHT OUTPUT 有权
    LED灯具改进的光输出

    公开(公告)号：US20120293978A1

    公开(公告)日：2012-11-22

    申请号：US13111222

    申请日：2011-05-19

    申请人： Sheng-Shin Guo ,  Chih-Hsuan Sun ,  Tien-Ming Lin ,  Wei-Yu Yeh

    发明人： Sheng-Shin Guo ,  Chih-Hsuan Sun ,  Tien-Ming Lin ,  Wei-Yu Yeh

    IPC分类号： F21V9/16 ,  F21V29/00 ,  H01J9/00 ,  F21V5/00

    CPC分类号： F21K9/64 ,  F21K9/232 ,  F21K9/90 ,  F21V3/02 ,  F21V13/02 ,  F21V29/507 ,  F21V29/70 ,  F21V29/74 ,  F21Y2101/00 ,  F21Y2113/13 ,  F21Y2115/10 ,  Y10T29/4913

    摘要： The present disclosure involves an LED lamp. The LED lamp includes a plurality of light-emitting diode (LED) light sources located on a substrate. At least a subset of the LED light sources is free of a phosphor coating. The LED lamp includes a multi-layered cap structure located over at least the subset of the LED light sources. The cap structure contains a phosphor material and a diffuser material. The cap structure is physically separated from the subset of the LED light sources by a gap. The LED lamp includes a cover structure positioned over and surrounding the LED light sources and the cap structure.

    摘要翻译： 本发明涉及一种LED灯。 LED灯包括位于基板上的多个发光二极管（LED）光源。 LED光源的至少一个子集没有磷光体涂层。 LED灯包括位于LED光源的至少子集上的多层帽结构。 盖结构包含磷光体材料和漫射材料。 盖结构通过间隙与LED光源的子集物理分离。 LED灯包括位于LED光源和盖结构之上并围绕LED光源的盖结构。

    Light-emitting-diode-based light bulb
    4.
    发明授权
    Light-emitting-diode-based light bulb 有权
    基于发光二极管的灯泡

    公开(公告)号：US08794791B2

    公开(公告)日：2014-08-05

    申请号：US13151857

    申请日：2011-06-02

    申请人： Sheng-Shin Guo ,  Wei-Yu Yeh ,  Chih-Hsuan Sun ,  Pei-Wen Ko

    发明人： Sheng-Shin Guo ,  Wei-Yu Yeh ,  Chih-Hsuan Sun ,  Pei-Wen Ko

    IPC分类号： F21V1/00 ,  F21V11/00 ,  F21V7/00

    CPC分类号： F21K9/64 ,  F21K9/232 ,  F21V3/08 ,  F21V7/041 ,  F21W2121/00 ,  F21Y2101/00 ,  F21Y2107/60 ,  F21Y2115/10

    摘要： The embodiments of a light-emitting-diode-based (LED-based) light bulb and an LED assembly described provide mechanisms of reflecting generated by LED emitters toward the back of the LED-based light bulb. An upper substrate and a lower substrate are used to support upper and lower LED emitters. A slanted and reflective surface between the upper substrate and the lower substrate reflects light generated by the lower LED emitters toward the backside of the LED-based light bulb.

    摘要翻译： 基于发光二极管（LED）的灯泡和LED组件的实施例提供了由LED发射器朝向基于LED的灯泡背面产生的反射机制。 上基板和下基板用于支撑上下LED发射器。 上基板和下基板之间的倾斜和反射表面将由下LED发射器产生的光朝向基于LED的灯泡的背面反射。

    Systems and Methods Providing Semiconductor Light Emitters
    6.
    发明申请
    Systems and Methods Providing Semiconductor Light Emitters 有权
    提供半导体发光器的系统和方法

    公开(公告)号：US20120299019A1

    公开(公告)日：2012-11-29

    申请号：US13117320

    申请日：2011-05-27

    申请人： Tien-Ming Lin ,  Chih-Hsuan Sun ,  Wei-Yu Yeh

    发明人： Tien-Ming Lin ,  Chih-Hsuan Sun ,  Wei-Yu Yeh

    IPC分类号： H01L33/52 ,  H01L21/52

    CPC分类号： H01L33/58 ,  H01L33/507 ,  H01L2224/48091 ,  H01L2924/0002 ,  H01L2933/0041 ,  H01L2933/0058 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A semiconductor structure includes a module with a plurality of die regions, a plurality of light-emitting devices disposed upon the substrate so that each of the die regions includes one of the light-emitting devices, and a lens board over the module and adhered to the substrate with glue. The lens board includes a plurality of microlenses each corresponding to one of the die regions, and at each one of the die regions the glue provides an air-tight encapsulation of one of the light-emitting devices by a respective one of the microlenses. Further, phosphor is included as a part of the lens board.

    摘要翻译： 半导体结构包括具有多个管芯区域的模块，设置在衬底上的多个发光器件，使得每个管芯区域包括一个发光器件，以及在该模块上的透镜板，并且粘附到 基材用胶。 透镜板包括多个微透镜，每个微透镜各自对应于一个裸片区域，并且在每个裸片区域中，胶水通过相应的一个微透镜提供一个发光器件的气密封装。 此外，作为透镜板的一部分包括磷光体。

    LED LAMP AND METHOD OF MAKING THE SAME
    7.
    发明申请
    LED LAMP AND METHOD OF MAKING THE SAME 有权
    LED灯及其制作方法

    公开(公告)号：US20120313518A1

    公开(公告)日：2012-12-13

    申请号：US13158962

    申请日：2011-06-13

    申请人： Chih-Hsuan Sun ,  Wei-Yu Yeh ,  Tien-Ming Lin

    发明人： Chih-Hsuan Sun ,  Wei-Yu Yeh ,  Tien-Ming Lin

    IPC分类号： H01K1/62 ,  H05K13/00 ,  H01J61/52

    CPC分类号： F21V29/74 ,  F21K9/232 ,  F21K9/90 ,  F21V3/02 ,  F21Y2101/00 ,  F21Y2115/10 ,  Y10T29/49002

    摘要： A lighting device includes a multi-faceted heat sink with facets in a center portion facing outward. The facets form a central enclosed portion, and the heat sink further has a plurality of fins, where each of the fins is placed between adjacent facets and protrudes outwardly from the heat sink. The lighting device also has a plurality of circuit boards with semiconductor emitters mounted thereon. Each of the circuit boards is mounted on a respective facet of the heat sink. The lighting device also has a light-diffusion housing covering the plurality of circuit boards, a power module in communication with the circuit boards and operable to convert power to be compatible with the semiconductor emitters, and a power connector assembly in electrical communication with the power module.

    摘要翻译： 照明装置包括具有朝向外侧的中心部分的小面的多面散热器。 小面形成中央封闭部分，并且散热器还具有多个翅片，其中每个翅片放置在相邻小面之间并从散热器向外突出。 照明装置还具有安装有半导体发射体的多个电路板。 每个电路板安装在散热器的相应面上。 所述照明装置还具有覆盖所述多个电路板的光扩散壳体，与所述电路板连通并可操作以将功率转换为与所述半导体发射体兼容的功率模块，以及与所述电力电连通的电源连接器组件 模块。

    LED lamp and method of making the same
    8.
    发明授权
    LED lamp and method of making the same 有权
    LED灯及其制作方法

    公开(公告)号：US08414160B2

    公开(公告)日：2013-04-09

    申请号：US13158962

    申请日：2011-06-13

    申请人： Chih-Hsuan Sun ,  Wei-Yu Yeh ,  Tien-Ming Lin

    发明人： Chih-Hsuan Sun ,  Wei-Yu Yeh ,  Tien-Ming Lin

    IPC分类号： F21V29/00

    CPC分类号： F21V29/74 ,  F21K9/232 ,  F21K9/90 ,  F21V3/02 ,  F21Y2101/00 ,  F21Y2115/10 ,  Y10T29/49002

    摘要： A lighting device includes a multi-faceted heat sink with facets in a center portion facing outward. The facets form a central enclosed portion, and the heat sink further has a plurality of fins, where each of the fins is placed between adjacent facets and protrudes outwardly from the heat sink. The lighting device also has a plurality of circuit boards with semiconductor emitters mounted thereon. Each of the circuit boards is mounted on a respective facet of the heat sink. The lighting device also has a light-diffusion housing covering the plurality of circuit boards, a power module in communication with the circuit boards and operable to convert power to be compatible with the semiconductor emitters, and a power connector assembly in electrical communication with the power module.

    摘要翻译： 照明装置包括具有朝向外侧的中心部分的小面的多面散热器。 小面形成中央封闭部分，并且散热器还具有多个翅片，其中每个翅片放置在相邻小面之间并从散热器向外突出。 照明装置还具有安装有半导体发射体的多个电路板。 每个电路板安装在散热器的相应面上。 所述照明装置还具有覆盖所述多个电路板的光扩散壳体，与所述电路板连通并可操作以将功率转换为与所述半导体发射体兼容的功率模块，以及与所述电力电连通的电源连接器组件 模块。

    LIGHT EMITTING DIODE LIGHT BAR MODULE WITH ELECTRICAL CONNECTORS FORMED BY INJECTION MOLDING
    10.
    发明申请
    LIGHT EMITTING DIODE LIGHT BAR MODULE WITH ELECTRICAL CONNECTORS FORMED BY INJECTION MOLDING 有权
    带注射成型电气连接器的发光二极管灯模块

    公开(公告)号：US20120088397A1

    公开(公告)日：2012-04-12

    申请号：US12899999

    申请日：2010-10-07

    申请人： Hsiao-Wen Lee ,  Chih-Hsuan Sun ,  Wei-Yu Yeh

    发明人： Hsiao-Wen Lee ,  Chih-Hsuan Sun ,  Wei-Yu Yeh

    IPC分类号： H01R43/24 ,  H01R43/18 ,  B29C45/14 ,  H01R13/00

    CPC分类号： B29C45/0001 ,  B29C45/14262 ,  B29C45/14311 ,  B29C45/14639 ,  B29K2705/02 ,  F21S4/20 ,  F21V23/06 ,  F21Y2103/10 ,  F21Y2115/10 ,  H01R43/24 ,  Y10T29/53

    摘要： The present disclosure relates to methods for fabricating electrical connectors of a waterproof connector-heat sink assembly of a LED light bar module using injection molding. The methods include matching the coefficient of thermal expansion (CTE) of injection molding materials for the connectors and heat sinks. A heat sink and conductor pins are inserted into an injection mold and the injection molding materials are injected into the injection mold. An integrated connector-heat sink assembly is formed when the injection molding materials of the connectors form a waterproof seal with the heat sink when the injection molding materials solidify. Placement of the heat sink and conductor pins inside the injection mold is controlled to ensure that adhesive bonding between the injection molding materials and the heat sink is stronger than a maximum shear force.

    摘要翻译： 本公开涉及使用注射成型制造LED灯条模块的防水连接器 - 散热器组件的电连接器的方法。 这些方法包括匹配用于连接器和散热器的注塑材料的热膨胀系数（CTE）。 将散热器和导体销插入注射模具中，并将注射成型材料注入注射模具中。 当注射成型材料固化时，当连接器的注射成型材料与散热器形成防水密封时，形成集成连接器 - 散热器组件。 控制注射模具内的散热器和导体销的放置，以确保注射成型材料和散热片之间的粘合剂粘合力比最大剪切力更强。