公开(公告)号：US20050181529A1

公开(公告)日：2005-08-18

申请号：US11011888

申请日：2004-12-13

申请人： Hubert Benzel ,  Frank Schaefer ,  Simon Armbruster ,  Gerhard Lammel ,  Christoph Schelling ,  Joerg Brasas

发明人： Hubert Benzel ,  Frank Schaefer ,  Simon Armbruster ,  Gerhard Lammel ,  Christoph Schelling ,  Joerg Brasas

IPC分类号： B81B3/00 ,  H01L21/00 ,  H01L29/24 ,  H01L33/00

CPC分类号： B81C1/00158 ,  B81B3/007 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81B2203/0315 ,  B81C2201/0115 ,  B81C2201/0116 ,  B81C2201/0136

摘要： A manufacturing method for a micromechanical semiconductor element includes providing on a semiconductor substrate a patterned stabilizing element having at least one opening. The opening is arranged such that it allows access to a first region in the semiconductor substrate, the first region having a first doping. Furthermore, a selective removal of at least a portion of the semiconductor material having the first doping out of the first region of the semiconductor substrate is provided. In addition, a membrane is produced above the first region using a first epitaxy layer applied on the stabilizing element. In a further method step, at least a portion of the first region is used to produce a cavity underneath the stabilizing element. In this manner, the present invention provides for the production of the patterned stabilizing element by means of a second epitaxy layer, which is applied on the semiconductor substrate.

摘要翻译： 微机电半导体元件的制造方法包括在半导体衬底上提供具有至少一个开口的图案化稳定元件。 开口被布置成使得其允许接近半导体衬底中的第一区域，第一区域具有第一掺杂。 此外，提供了选择性地去除半导体衬底的第一区域中具有第一掺杂的半导体材料的至少一部分。 此外，使用施加在稳定元件上的第一外延层，在第一区域上方产生膜。 在另一方法步骤中，第一区域的至少一部分用于在稳定元件下方产生空腔。 以这种方式，本发明提供了通过施加在半导体衬底上的第二外延层来生产图案化的稳定元件。

公开(公告)号：US20050142687A1

公开(公告)日：2005-06-30

申请号：US11011898

申请日：2004-12-13

申请人： Hubert Benzel ,  Frank Schaefer ,  Simon Armbruster ,  Gerhard Lammel ,  Christoph Schelling ,  Joerg Brasas

发明人： Hubert Benzel ,  Frank Schaefer ,  Simon Armbruster ,  Gerhard Lammel ,  Christoph Schelling ,  Joerg Brasas

IPC分类号： B81C1/00 ,  H01L21/00 ,  H01L29/84

CPC分类号： B81C1/00182 ,  B81B2203/0127 ,  B81B2203/0315 ,  B81C2201/0115

摘要： A method for producing a micromechanical diaphragm sensor includes providing a semiconductor substrate having a first region, a diaphragm, and a cavity that is located at least partially below the diaphragm. Above at least one part of the first region, a second region is generated in or on the surface of the semiconductor substrate, with at least one part of the second region being provided as crosspieces. The diaphragm is formed by a deposited sealing layer, and includes at least a part of the crosspieces.

摘要翻译： 微机械振动膜传感器的制造方法包括提供具有至少部分地位于隔膜下方的第一区域，隔膜和空腔的半导体基板。 在第一区域的至少一部分上方，在半导体衬底的表面中或表面上产生第二区域，第二区域的至少一部分被设置为十字形。 隔膜由沉积的密封层形成，并且包括至少一部分挡条。

公开(公告)号：US20050115321A1

公开(公告)日：2005-06-02

申请号：US10958014

申请日：2004-10-04

申请人： Hubert Benzel ,  Frank Schaefer ,  Christoph Schelling

发明人： Hubert Benzel ,  Frank Schaefer ,  Christoph Schelling

IPC分类号： G01K7/01 ,  G01L9/00 ,  G01P1/02 ,  G01P15/08 ,  G01N25/00 ,  G01N7/00 ,  H01L21/461

CPC分类号： B81C1/00246 ,  B81B2201/0292 ,  B81C2203/0778 ,  G01K7/015 ,  G01L9/0054 ,  G01L19/147 ,  G01P1/023 ,  G01P15/08 ,  G01P15/0802 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/73257 ,  H01L2924/16235 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A micromechanical sensor, and a method for manufacturing a micromechanical sensor, featuring, in addition to a sensor element, at least a part of an evaluation circuit. In this context, the micromechanical sensor contains at least a first structural element made of a first material. The first structural element houses at least one sensor region and a part of an evaluation circuit, at least one sensor element being located in the sensor region. Moreover, at least one first and one second side are to be distinguished from one another in the first structural element. The first side of the first structural element features at least the sensor element, while the second side of the first structural element features at least a part of the evaluation circuit. At least parts of the sensor region and/or of the evaluation circuit are formed from the first material by micromechanical processing.

摘要翻译： 微机械传感器和微机械传感器的制造方法，除传感器元件之外，还具有评估电路的至少一部分。 在本文中，微机械传感器至少包含由第一材料制成的第一结构元件。 第一结构元件容纳至少一个传感器区域和评估电路的一部分，至少一个传感器元件位于传感器区域中。 此外，在第一结构元件中至少一个第一和第二侧面将彼此区分开。 第一结构元件的第一侧至少具有传感器元件，而第一结构元件的第二侧具有评估电路的至少一部分。 传感器区域和/或评估电路的至少一部分通过微机械处理由第一材料形成。

公开(公告)号：US20050016949A1

公开(公告)日：2005-01-27

申请号：US10492009

申请日：2002-09-04

申请人： Hubert Benzel ,  Heribert Weber ,  Frank Schaefer

发明人： Hubert Benzel ,  Heribert Weber ,  Frank Schaefer

IPC分类号： B81B1/00 ,  B81B3/00 ,  B81C1/00 ,  H01B13/00

CPC分类号： B81C1/00047 ,  B81C1/00246 ,  B81C2201/0115 ,  B81C2201/014

摘要： A method is proposed which will enable cavities having optically transparent walls to be produced simply and cost-effectively in a component by using standard methods of microsystems technology. For this purpose, a silicon region is first produced, which is surrounded on all sides by at least one optically transparent cladding layer. At least one opening is then produced in the cladding layer. Over this opening, the silicon surrounded by the cladding layer is dissolved out, forming a cavity within the cladding layer. In this context, the cladding layer acts as an etch barrier layer.

摘要翻译： 提出了一种通过使用微系统技术的标准方法，能够简单且成本有效地在部件中产生具有光学透明壁的空腔的方法。 为此目的，首先制造出硅区域，其通过至少一个光学透明覆层在所有侧面上被包围。 然后在包层中产生至少一个开口。 在该开口上，由包覆层包围的硅被溶出，在包覆层内形成空腔。 在本文中，包覆层用作蚀刻阻挡层。

公开(公告)号：US06832523B2

公开(公告)日：2004-12-21

申请号：US10017772

申请日：2001-10-29

申请人： Hubert Benzel ,  Heribert Weber ,  Frank Schaefer

发明人： Hubert Benzel ,  Heribert Weber ,  Frank Schaefer

IPC分类号： G01L100

CPC分类号： G01N25/68 ,  B81B3/0081 ,  B81B2203/0127 ,  B81C2201/0115 ,  H01L2924/0002 ,  H01L2924/00

摘要： A micromechanical component having a substrate and a diaphragm positioned on the substrate. Underneath the diaphragm a region made of porous material is provided, which mechanically supports the diaphragm and thermally insulates it.

摘要翻译： 具有基板和位于基板上的隔膜的微机械部件。 在隔膜下方设置有由多孔材料制成的区域，该区域机械地支撑隔膜并将其热绝缘。

公开(公告)号：US07494839B2

公开(公告)日：2009-02-24

申请号：US11011888

申请日：2004-12-13

申请人： Hubert Benzel ,  Frank Schaefer ,  Simon Armbruster ,  Gerhard Lammel ,  Christoph Schelling ,  Joerg Brasas

发明人： Hubert Benzel ,  Frank Schaefer ,  Simon Armbruster ,  Gerhard Lammel ,  Christoph Schelling ,  Joerg Brasas

IPC分类号： H01L21/00

CPC分类号： B81C1/00158 ,  B81B3/007 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81B2203/0315 ,  B81C2201/0115 ,  B81C2201/0116 ,  B81C2201/0136

摘要： A manufacturing method for a micromechanical semiconductor element includes providing on a semiconductor substrate a patterned stabilizing element having at least one opening. The opening is arranged such that it allows access to a first region in the semiconductor substrate, the first region having a first doping. Furthermore, a selective removal of at least a portion of the semiconductor material having the first doping out of the first region of the semiconductor substrate is provided. In addition, a membrane is produced above the first region using a first epitaxy layer applied on the stabilizing element. In a further method step, at least a portion of the first region is used to produce a cavity underneath the stabilizing element. In this manner, the present invention provides for the production of the patterned stabilizing element by means of a second epitaxy layer, which is applied on the semiconductor substrate.

摘要翻译： 微机电半导体元件的制造方法包括在半导体衬底上提供具有至少一个开口的图案化稳定元件。 开口被布置成使得其允许接近半导体衬底中的第一区域，第一区域具有第一掺杂。 此外，提供了选择性地去除半导体衬底的第一区域中具有第一掺杂的半导体材料的至少一部分。 此外，使用施加在稳定元件上的第一外延层，在第一区域上方产生膜。 在另一方法步骤中，第一区域的至少一部分用于在稳定元件下方产生空腔。 以这种方式，本发明提供了通过施加在半导体衬底上的第二外延层来生产图案化的稳定元件。

公开(公告)号：US07354786B2

公开(公告)日：2008-04-08

申请号：US11223592

申请日：2005-09-08

申请人： Hubert Benzel ,  Stefan Finkbeiner ,  Matthias Illing ,  Frank Schaefer ,  Simon Armbruster ,  Gerhard Lammel ,  Christoph Schelling ,  Joerg Brasas

发明人： Hubert Benzel ,  Stefan Finkbeiner ,  Matthias Illing ,  Frank Schaefer ,  Simon Armbruster ,  Gerhard Lammel ,  Christoph Schelling ,  Joerg Brasas

IPC分类号： H01L21/00

CPC分类号： G01L9/0045 ,  B81B2203/0315 ,  B81C1/00182 ,  G01P15/0802

摘要： A micromechanical sensor element and a method for the production of a micromechanical sensor element that is suitable, for example in a micromechanical component, for detecting a physical quantity. Provision is made for the sensor element to include a substrate, an access hole and a buried cavity, at least one of the access holes and the cavity being produced in the substrate by a trench etching and/or, in particular, an isotropic etching process. The trench etching process includes different trenching (trench etching) steps which may be divided into a first phase and a second phase. Thus, in the first phase, at least one first trenching step is carried out in which, in a predeterminable first time period, material is etched out of the substrate and a depression is produced. In that trenching step, a typical concavity is produced in the wall of the depression. A passivation process is then carried out in that first phase, in which the concavity produced in the walls of the depression by the first trenching step is covered with a passivation material. The first trenching step and the first passivation process may be carried out repeatedly in alternating succession within the first phase, with the result that a typical corrugation is obtained on the walls of the depression so produced. In the second phase of the trench etching process, the cavity is produced through the at least one access hole produced by the depression, by carrying out a second trenching step of a predetermined second time period that is distinctly longer in comparison with the first time period.

摘要翻译： 微机械传感器元件和用于生产微机械传感器元件的方法，其适用于例如微机械部件中，用于检测物理量。 为传感器元件提供包括基板，进入孔和埋入空腔的设置，通过沟槽蚀刻和/或特别地，各向同性蚀刻工艺在基板中产生至少一个访问孔和空腔 。 沟槽蚀刻工艺包括可分为第一相和第二相的不同的开沟（沟槽蚀刻）步骤。 因此，在第一阶段中，执行至少一个第一开沟步骤，其中在可预定的第一时间段内将材料从衬底中蚀刻出来并产生凹陷。 在挖沟步骤中，在凹陷的壁上产生典型的凹陷。 然后在第一阶段进行钝化处理，其中通过第一开挖步骤在凹陷的壁中产生的凹陷被钝化材料覆盖。 第一开沟步骤和第一钝化工艺可以在第一阶段内连续交替重复进行，结果是在如此制造的凹陷的壁上获得典型的波纹。 在沟槽蚀刻工艺的第二阶段，通过执行与第一时间段相比明显更长的预定第二时间段的第二开沟步骤，通过由凹陷产生的至少一个访问孔产生空腔 。

公开(公告)号：US07193290B2

公开(公告)日：2007-03-20

申请号：US10479563

申请日：2002-07-06

申请人： Hubert Benzel ,  Heribert Weber ,  Frank Schaefer

发明人： Hubert Benzel ,  Heribert Weber ,  Frank Schaefer

IPC分类号： H01L31/058

CPC分类号： G01N27/121

摘要： A semiconductor component, such as a humidity sensor, which has a semiconductor substrate, such as, for example, made of silicon, a first electrode and a second electrode and at least one first layer that is accessible for a medium acting from the outside on the semiconductor component, the first layer being arranged at least partially between the first and the second electrode. To reduce the costs for producing the semiconductor component the first layer has pores into which the medium reaches at least partially.

摘要翻译： 诸如湿度传感器的半导体部件，其具有例如由硅制成的半导体衬底，第一电极和第二电极以及至少一个第一层，该第一层可从外部作用的介质 半导体部件，第一层至少部分地布置在第一和第二电极之间。 为了降低制造半导体部件的成本，第一层具有至少部分介质到达的孔。

公开(公告)号：US20060057816A1

公开(公告)日：2006-03-16

申请号：US11223592

申请日：2005-09-08

申请人： Hubert Benzel ,  Stefan Finkbeiner ,  Matthias Illing ,  Frank Schaefer ,  Simon Armbruster ,  Gerhard Lammel ,  Christoph Schelling ,  Joerg Brasas

发明人： Hubert Benzel ,  Stefan Finkbeiner ,  Matthias Illing ,  Frank Schaefer ,  Simon Armbruster ,  Gerhard Lammel ,  Christoph Schelling ,  Joerg Brasas

IPC分类号： H01L21/76

CPC分类号： G01L9/0045 ,  B81B2203/0315 ,  B81C1/00182 ,  G01P15/0802

摘要： A micromechanical sensor element and a method for the production of a micromechanical sensor element that is suitable, for example in a micromechanical component, for detecting a physical quantity. Provision is made for the sensor element to include a substrate, an access hole and a buried cavity, at least one of the access holes and the cavity being produced in the substrate by a trench etching and/or, in particular, an isotropic etching process. The trench etching process includes different trenching (trench etching) steps which may be divided into a first phase and a second phase. Thus, in the first phase, at least one first trenching step is carried out in which, in a predeterminable first time period, material is etched out of the substrate and a depression is produced. In that trenching step, a typical concavity is produced in the wall of the depression. A passivation process is then carried out in that first phase, in which the concavity produced in the walls of the depression by the first trenching step is covered with a passivation material. The first trenching step and the first passivation process may be carried out repeatedly in alternating succession within the first phase, with the result that a typical corrugation is obtained on the walls of the depression so produced. In the second phase of the trench etching process, the cavity is produced through the at least one access hole produced by the depression, by carrying out a second trenching step of a predetermined second time period that is distinctly longer in comparison with the first time period.

摘要翻译： 微机械传感器元件和用于生产微机械传感器元件的方法，其适用于例如微机械部件中，用于检测物理量。 为传感器元件提供包括基板，进入孔和埋入空腔的设置，通过沟槽蚀刻和/或特别地，各向同性蚀刻工艺在基板中产生至少一个访问孔和空腔 。 沟槽蚀刻工艺包括可分为第一相和第二相的不同的开沟（沟槽蚀刻）步骤。 因此，在第一阶段中，执行至少一个第一开沟步骤，其中在可预定的第一时间段内将材料从衬底中蚀刻出来并产生凹陷。 在挖沟步骤中，在凹陷的壁上产生典型的凹陷。 然后在第一阶段进行钝化处理，其中通过第一开挖步骤在凹陷的壁中产生的凹陷被钝化材料覆盖。 第一开沟步骤和第一钝化工艺可以在第一阶段内连续交替重复进行，结果是在如此制造的凹陷的壁上获得典型的波纹。 在沟槽蚀刻工艺的第二阶段，通过执行与第一时间段相比明显更长的预定第二时间段的第二开沟步骤，通过由凹陷产生的至少一个访问孔产生空腔 。

公开(公告)号：US08784964B2

公开(公告)日：2014-07-22

申请号：US13232726

申请日：2011-09-14

申请人： Frank Schaefer

发明人： Frank Schaefer

IPC分类号： B60N2/58

CPC分类号： B60N2/5816 ,  B60N2/5825 ,  B60N2/5883 ,  B60R13/02 ,  B60R13/0206 ,  B60R2013/0293 ,  Y10T428/19 ,  Y10T428/198 ,  Y10T428/24479

摘要： A composite part includes a sub-material having a compression hardness of up to 50 kPa with a compression of 40% and a recess formed in the sub-material. A first skin and a second skin are connected at a seam that is disposed within the recess. A holding profile that includes a groove having side walls and a base and at least one wing is introduced into the recess.

摘要翻译： 复合部件包括压缩硬度高达50kPa，压缩率为40％的子材料和在副材料中形成的凹部。 第一皮肤和第二皮肤在设置在凹部内的接缝处连接。 包括具有侧壁和基部以及至少一个翼的凹槽的保持轮廓被引入到凹部中。