公开(公告)号：US11419222B2

公开(公告)日：2022-08-16

申请号：US16784219

申请日：2020-02-06

Applicant: Unimicron Technology Corp.

Inventor： Hsin-Chi Hu

IPC: H05K3/46 ,  H05K3/42 ,  H05K3/00 ,  H05K1/11 ,  H05K3/24 ,  H05K3/40

Abstract: A method of manufacturing a circuit board includes: providing a substrate including a bottom layer and a resin layer over the bottom layer, the resin layer including a first surface in contact with the bottom layer and a second surface opposite to the first surface; forming a plurality of vias through the resin layer; depositing a first metal layer in the vias, the first metal layer filling a portion of each of the vias; depositing a second metal layer over the first metal layer and in the vias; forming a patterned metal layer over the second metal layer and extending from each of the vias to a position over the second surface; separating the bottom layer and the resin layer; and removing a portion of the resin layer from the first surface, so that the first metal layer protrudes from the resin layer.

公开(公告)号：US11410933B2

公开(公告)日：2022-08-09

申请号：US17314055

申请日：2021-05-07

Applicant: Unimicron Technology Corp.

Inventor： John Hon-Shing Lau ,  Cheng-Ta Ko ,  Pu-Ju Lin ,  Tzyy-Jang Tseng ,  Ra-Min Tain ,  Kai-Ming Yang

IPC: H01L21/00 ,  H01L23/538 ,  H01L25/065 ,  H01L23/00 ,  H01L21/48 ,  H01L25/00

Abstract: A package structure, including a bridge, an interposer, a first redistribution structure layer, a second redistribution structure layer, and multiple chips, is provided. The bridge includes a silicon substrate, a redistribution layer, and multiple bridge pads. The interposer includes an intermediate layer, multiple conductive vias, multiple first pads, and multiple second pads. The bridge is embedded in the intermediate layer. The bridge pads are aligned with the upper surface. The first redistribution structure layer is disposed on the upper surface of the interposer and is electrically connected to the first pads and the bridge pads. The second redistribution structure layer is disposed on the lower surface of the interposer and is electrically connected to the second pads. The chips are disposed on the first redistribution structure layer and are electrically connected to the first redistribution structure layer. The chips are electrically connected to each other through the bridge.

公开(公告)号：US20220232702A1

公开(公告)日：2022-07-21

申请号：US17367419

申请日：2021-07-05

Applicant: Unimicron Technology Corp.

Inventor： Yunn-Tzu Yu ,  Ching-Ho Hsieh ,  Wang-Hsiang Tsai

IPC: H05K1/14 ,  H05K1/11

Abstract: A circuit board structure includes a body, multiple first pads, a conductive assembly, multiple first engaging components, and multiple second engaging components. The body includes a first portion and a second portion integrally formed. A first surface of the first portion directly contacts a second surface of the second portion. A first region of the first surface protrudes from the second portion, and a second region of the second surface protrudes from the first portion. The first pads and the first engaging components are disposed on the first portion of the body and located in the first region of the first surface. The conductive assembly and the second engaging components are disposed on the second portion of the body and located in the second region of the second portion. The first pads are located between the first engaging components, and the conductive assembly is located between the second engaging components.

公开(公告)号：US20220171482A1

公开(公告)日：2022-06-02

申请号：US17317870

申请日：2021-05-11

Applicant: Unimicron Technology Corp.

Inventor： Shih-Yao Lin ,  Ming-Chang Chan ,  Leng-Chieh Lin ,  Po-Ching Chan ,  Meng-Chia Chan ,  Kuo-Feng Cheng

IPC: G06F3/041

Abstract: A display device includes a display and a transflective module. The transflective module is disposed at one side of the display and includes a glass substrate and a transflective structure layer. The transflective structure layer is disposed on the glass substrate and located between the glass substrate and the display.

公开(公告)号：US20220159824A1

公开(公告)日：2022-05-19

申请号：US17137293

申请日：2020-12-29

Applicant: Unimicron Technology Corp.

Inventor： Ming-Hao Wu ,  Hsuan-Wei Chen ,  Chi-Chun Po

IPC: H05K1/02 ,  H01L23/498 ,  H01L21/48 ,  H05K3/00 ,  H05K3/42 ,  H05K1/11 ,  H05K3/46

Abstract: A package carrier includes a circuit structure layer and a heat-conducting element. The circuit structure layer includes a notch portion. The heat-conducting element includes a first heat-conducting portion and a second heat-conducting portion vertically connected to the first heat-conducting portion. The notch portion exposes the first heat-conducting portion, and an outer surface of the second heat-conduction portion is aligned with a side surface of the circuit structure layer.

公开(公告)号：US20220157687A1

公开(公告)日：2022-05-19

申请号：US17156848

申请日：2021-01-25

Applicant: UNIMICRON TECHNOLOGY CORP.

Inventor： Chien-Chen LIN ,  Ho-Shing LEE

IPC: H01L23/367 ,  H01L23/538

Abstract: A circuit substrate has an open substrate, a heat-dissipation block, multiple high thermal conductivity members, a first dielectric layer, a second dielectric layer, multiple first heat conductive members, and multiple second heat conductive members. The heat-dissipation block is disposed in the open substrate. Multiple high thermal conductivity members are mounted through the heat-dissipation block. The first dielectric layer exposes a part of one of two surfaces of the heat-dissipation block. The second dielectric layer exposes a part of the other surface of the heat-dissipation block. The first heat conductive members are in contact with the heat-dissipation block exposed from the first dielectric layer. The second heat conductive members are in contact with the part of the heat-dissipation block exposed from the second dielectric layer. Therefore, heat can be transferred quickly via the heat-dissipation block and the high thermal conductivity members to improve heat-dissipating capacity of the circuit substrate.

公开(公告)号：USD950446S1

公开(公告)日：2022-05-03

申请号：US29716934

申请日：2019-12-13

Applicant: Unimicron Technology Corp.

Designer： Shih-Yao Lin ,  Ming-Yuan Hsu ,  Meng-Chia Chan ,  Kuo-Chuan Huang ,  Cheng-Jui Chang

公开(公告)号：US20220131054A1

公开(公告)日：2022-04-28

申请号：US17102458

申请日：2020-11-24

Applicant: Unimicron Technology Corp.

Inventor： Kai-Ming YANG ,  Chen-Hao LIN ,  Tzu-Nien LEE

IPC: H01L33/54 ,  H01L33/62 ,  H01L33/00 ,  H01L33/56

Abstract: A light-emitting package includes a black encapsulating member, a plurality of light-emitting components and a circuit structure. The black encapsulating member has a first surface and a second surface opposite to the first surface. The light-emitting components are embedded in the black encapsulating member. Each light-emitting component has a light-emitting surface, a back surface opposite to the light-emitting surface, and a plurality of pads disposed on the back surface. The light-emitting surface of each light-emitting component is exposed on the first surface and is flush with the first surface. The pads of each light-emitting component are exposed on the second surface. The circuit structure is disposed on the second surface and electrically connected to the pads.

公开(公告)号：US20220130781A1

公开(公告)日：2022-04-28

申请号：US17567883

申请日：2022-01-04

Applicant: Unimicron Technology Corp.

Inventor： Tzyy-Jang Tseng ,  Pu-Ju Lin ,  Cheng-Ta Ko ,  John Hon-Shing Lau

IPC: H01L23/00 ,  H01L23/538 ,  H01L25/00 ,  H01L21/48

Abstract: A circuit substrate structure includes a circuit substrate, at least two chips, and a bridge element. The circuit substrate has a first surface and a second surface opposite to each other. The chips are arranged in parallel on the first surface of the circuit substrate and electrically connected to the circuit substrate. The chips have active surfaces, back surfaces opposite to the active surfaces, and side surfaces connecting the active surfaces and the back surfaces. The chips include side circuits. The side circuits are arranged on the side surfaces and have first ends and second ends, the first ends extend to the active surfaces along the side surfaces, and the second ends extend to the back surfaces along the side surfaces. The bridge element is arranged on the back surfaces of the chips and electrically connected to the active surfaces of the chips through the side circuits.

公开(公告)号：US11289413B2

公开(公告)日：2022-03-29

申请号：US16747548

申请日：2020-01-21

Applicant: Unimicron Technology Corp.

Inventor： Shih-Liang Cheng

IPC: H05K1/11 ,  H01L23/498 ,  H01L21/48 ,  H05K3/40

Abstract: A wiring board and a method of manufacturing the same are provided. The method includes the following steps. A substrate is provided. The substrate is perforated to form at least one through hole. A first conductive layer is integrally formed on a surface of the substrate and an inner wall of the through hole. An etch stop layer is formed on a portion of the first conductive layer on the surface of the substrate and another portion of the first conductive layer on the inner wall of the through hole. A second conductive layer is integrally formed on the etch stop layer and the first conductive layer on the inner wall of the through hole. A plug-hole column is formed by filling with a plugged-hole material in the through hole. The second conductive layer is removed. The etch stop layer is then removed.