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8 条记录 (耗时 0.016 秒)

    MANUFACTURING METHOD OF PACKAGE STRUCTURE
    2.
    发明申请
    MANUFACTURING METHOD OF PACKAGE STRUCTURE 有权

    公开(公告)号：US20220375919A1

    公开(公告)日：2022-11-24

    申请号：US17818006

    申请日：2022-08-08

    申请人： Unimicron Technology Corp.

    发明人： Kai-Ming YANG ,  Chen-Hao LIN ,  Cheng-Ta KO ,  John Hon-Shing LAU ,  Yu-Hua CHEN ,  Tzyy-Jang TSENG

    IPC分类号： H01L25/00 ,  H01L21/48 ,  H01L23/538 ,  H01L23/00

    摘要： A method of manufacturing package structure with following steps is disclosed herein. An insulating composite layer is formed on a metal layer of a carrier board. A chip packaging module including a sealant and a first chip embedded therein is disposed on the insulating composite layer, in which the first chip has a plurality of conductive pads. A first circuit layer module including a dielectric layer and a circuit layer is formed on the chip packaging module, in which the circuit layer is on the dielectric layer and electrically connected to the conductive pads through a conductive vias in the dielectric layer. A second chip is disposed on the first circuit layer module. A second circuit layer module is formed on the first circuit layer module and the second chip. A protecting layer is formed on the second circuit layer module.

    PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
    3.
    发明申请
    PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF 审中-公开

    公开(公告)号：US20200068721A1

    公开(公告)日：2020-02-27

    申请号：US16672512

    申请日：2019-11-03

    申请人： Unimicron Technology Corp.

    发明人： Kai-Ming YANG ,  Chen-Hao LIN ,  Wang-Hsiang TSAI ,  Cheng-Ta KO

    IPC分类号： H05K3/40 ,  H05K1/18 ,  H05K1/11 ,  H05K1/14 ,  H01L23/14 ,  H01L23/15 ,  H01L23/498 ,  H01L21/48 ,  H01L21/768

    摘要： A package structure, includes a metal layer, an insulating composite layer disposed thereon, a sealant bonded on the insulating composite layer, a chip embedded in the sealant, a circuit layer structure disposed on the sealant and the chip, and a protecting layer. The chip has a plurality of electrode pads exposed from the sealant. The circuit layer structure includes at least one dielectric layer and at least one circuit layer. The dielectric layer has a plurality of conductive blind vias. The dielectric layer and the sealant are made of the same material. The circuit layer is disposed on the dielectric layer and extends into the conductive blind vias, and the bottommost circuit layer is electrically connected to the electrode pads through the conductive blind vias. The protecting layer is formed on the circuit layer structure and has a plurality of openings exposing a portion of the circuit layer structure.

    LIGHT-EMITTING PACKAGE AND METHOD OF MANUFACTURING THE SAME
    4.
    发明申请
    LIGHT-EMITTING PACKAGE AND METHOD OF MANUFACTURING THE SAME 有权

    公开(公告)号：US20220131054A1

    公开(公告)日：2022-04-28

    申请号：US17102458

    申请日：2020-11-24

    申请人： Unimicron Technology Corp.

    发明人： Kai-Ming YANG ,  Chen-Hao LIN ,  Tzu-Nien LEE

    IPC分类号： H01L33/54 ,  H01L33/62 ,  H01L33/00 ,  H01L33/56

    摘要： A light-emitting package includes a black encapsulating member, a plurality of light-emitting components and a circuit structure. The black encapsulating member has a first surface and a second surface opposite to the first surface. The light-emitting components are embedded in the black encapsulating member. Each light-emitting component has a light-emitting surface, a back surface opposite to the light-emitting surface, and a plurality of pads disposed on the back surface. The light-emitting surface of each light-emitting component is exposed on the first surface and is flush with the first surface. The pads of each light-emitting component are exposed on the second surface. The circuit structure is disposed on the second surface and electrically connected to the pads.

    LIGHT-EMITTING PACKAGE AND METHOD OF MANUFACTURING THE SAME
    6.
    发明申请
    LIGHT-EMITTING PACKAGE AND METHOD OF MANUFACTURING THE SAME 有权

    公开(公告)号：US20220139886A1

    公开(公告)日：2022-05-05

    申请号：US17125981

    申请日：2020-12-17

    申请人： Unimicron Technology Corp.

    发明人： Kai-Ming YANG ,  Chen-Hao LIN ,  Chia-Hao CHANG ,  Tzu-Nien LEE

    IPC分类号： H01L25/075 ,  H01L33/54 ,  H01L33/62

    摘要： A light-emitting package includes an encapsulating member, a plurality of light-emitting components disposed in the encapsulating member, a plurality of first electrode pads, a plurality of second electrode pads, and a plurality of conductive connection structures. The encapsulating member has a first surface and a second surface opposite to each other. Each light-emitting component has a light-emitting surface exposed on the first surface. Both the first electrode pads and the second electrode pads are exposed on the second surface. A first bonding surface of each first electrode pad and a second bonding surface of each second electrode pad are both flush with the second surface. The light-emitting components disposed on the first electrode pads are electrically connected to the first electrode pads. The conductive connection structures passing through the encapsulating member are electrically connected to the light-emitting components and the second electrode pads.

    WIRING BOARD AND METHOD OF FORMING HOLE THEREOF
    7.
    发明申请
    WIRING BOARD AND METHOD OF FORMING HOLE THEREOF 有权

    公开(公告)号：US20220061157A1

    公开(公告)日：2022-02-24

    申请号：US17022128

    申请日：2020-09-16

    申请人： Unimicron Technology Corp.

    发明人： Kai-Ming YANG ,  Chen-Hao LIN ,  Bo-Cheng LIN

    IPC分类号： H05K1/11 ,  H05K3/40

    摘要： A wiring board includes a photosensitive insulating layer and a first wiring layer. The photosensitive insulating layer has a hole, a first surface and a second surface opposite to each other. The hole has a first end opening formed in the first surface, a second end opening formed in the second surface, an axis, and a sidewall surrounding the axis. Part of the sidewall extends toward the axis to form at least one annular flange. The first wiring layer is disposed on the first surface and includes a first pad, in which the hole exposes the first pad. There is at least one recessed cavity between the annular flange and the first pad. The minimum width of the annular flange is smaller than the maximum width of the recessed cavity.

    MANUFACTURING METHOD OF PACKAGE STRUCTURE
    8.
    发明申请
    MANUFACTURING METHOD OF PACKAGE STRUCTURE 有权

    公开(公告)号：US20210195761A1

    公开(公告)日：2021-06-24

    申请号：US17194323

    申请日：2021-03-08

    申请人： Unimicron Technology Corp.

    发明人： Kai-Ming YANG ,  Chen-Hao LIN ,  Wang-Hsiang TSAI ,  Cheng-Ta KO

    IPC分类号： H05K3/40 ,  H01L21/768 ,  H01L21/48 ,  H05K1/11 ,  H05K1/18 ,  H05K1/14 ,  H01L23/14 ,  H01L23/15 ,  H01L23/498 ,  H01L23/36 ,  H01L23/538 ,  H05K3/46 ,  H01L23/00 ,  H01L21/683

    摘要： A package structure includes a metal layer, a composite layer of a non-conductor inorganic material and an organic material, a sealant, a chip, a circuit layer structure, and an insulating protective layer. The composite layer of the non-conductor inorganic material and the organic material is disposed on the metal layer. The sealant is bonded on the composite layer of the non-conductor inorganic material and the organic material. The chip is embedded in the sealant, and the chip has electrode pads. The circuit layer structure is formed on the sealant and the chip. The circuit layer structure includes at least one dielectric layer and at least one circuit layer. The dielectric layer has conductive blind holes. The insulating protective layer is formed on the circuit layer structure. The insulating protective layer has openings, so as to expose parts of the surface of the circuit layer structure in the openings.